Electronic apparatus

Abstract

The electronic device comprises a plurality of pixels disposed in an active area, a plurality of power lines connected to at least one of the pixels, a power pad disposed in a peripheral area and receiving a power voltage, a power pattern disposed in a peripheral area and connecting the power lines and the power pad, a plurality of sensing electrodes disposed on the pixels and disposed in an active area, and a plurality of sensing pads disposed in a peripheral area and electrically connected to the sensing patterns, wherein the sensing pads and the power patterns overlap each other when viewed from the top surface.

Description

Technology Field

[0001] The present invention relates to an electronic device, and more specifically, to an electronic device with improved reliability. Background Technology

[0002] Electronic devices are activated according to electrical signals. Electronic devices may include devices composed of various electronic components, such as a display unit that displays images or an input detection unit that detects external inputs. Electronic components may be electrically connected to each other by variously arranged signal lines.

[0003] Signal lines can be provided in varying numbers depending on the number of electronic components or the processing environment, and are designed to be arranged in appropriate spaces within a defined panel area to prevent electrical signal interference. Signal lines can receive electrical signals applied from the outside through pads. As the processing speed or processing data of the electronic device increases, a large number of signal lines and pads are required, and consequently, mutual interference between electronic components or signal lines may increase. The problem to be solved

[0004] Accordingly, the present invention aims to provide an electronic device capable of preventing a decrease in electrical reliability due to electrical signal interference. Additionally, another objective of the present invention is to provide an electronic device with improved reliability due to bending. means of solving the problem

[0005] An electronic device according to one embodiment of the present invention comprises a base substrate including an active area and a peripheral area adjacent to the active area, a plurality of pixels disposed in the active area, a plurality of power lines each connected to at least one of the pixels, a power pad disposed in the peripheral area and receiving a power voltage, a power pattern disposed in the peripheral area and connecting the power lines and the power pad, a plurality of sensing electrodes disposed on the pixels in cross-section and disposed in the active area, and a plurality of sensing pads disposed in the peripheral area and electrically connected to the sensing patterns, wherein the sensing pads and the power pattern overlap each other when viewed from the top surface.

[0006] Each of the above pixels includes a semiconductor pattern, a control electrode spaced apart from the semiconductor pattern, an input electrode connected to the semiconductor pattern, and an output electrode disposed on the same layer as the input electrode and connected to the semiconductor pattern, a thin-film transistor covered by an insulating layer, and an organic light-emitting element disposed on the insulating layer, comprising a first electrode, a second electrode disposed on the first electrode, and a light-emitting layer disposed between the first electrode and the second electrode, and the sensing pads may be disposed between the organic light-emitting element and the thin-film transistor in cross-section.

[0007] The above power pattern can be placed on the same layer as the output electrode.

[0008] The insulating layer comprises a first layer disposed between the first electrode and the output electrode and covering the output electrode, a second layer disposed on the first layer, and a third layer disposed on the second layer and on which the first electrode is disposed, and the power pattern can be covered by the first layer.

[0009] The above sensing pad can be placed between the second layer and the third layer.

[0010] An electronic device according to one embodiment of the present invention further includes a connecting electrode disposed between the second layer and the third layer, wherein the first electrode penetrates the third layer and is connected to the connecting electrode, and the connecting electrode penetrates the first layer and is connected to the output electrode.

[0011] It further includes a first circuit board connected to the power pad and a second circuit board connected to the sensing pad, and the sensing electrodes can receive an electrical signal through the second circuit board.

[0012] The base substrate includes a bending portion that is bent around a bending axis extended along one direction and a non-bending portion connected to the bending portion, and the power pad and the sensing pad are disposed in the non-bending portion, and the power pad may be disposed in the bending portion.

[0013] An electronic device according to one embodiment of the present invention may further include a main pad disposed in the bending portion, and a connecting line extending along a direction intersecting the bending axis to connect the main pad and the sensing pad.

[0014] The above connection line can directly contact the above detection pad.

[0015] The above connecting line includes a first line connecting the main pad and the sensing pad, and a second line connecting the main pad and the sensing pad and including a portion spaced apart from the first line in cross-section, and the first line, the second line, and the sensing pad can come into direct contact.

[0016] An electronic device according to one embodiment of the present invention further includes an organic layer disposed in the bending portion, and the organic layer may be disposed between the first line and the second line.

[0017] An electronic device according to one embodiment of the present invention further includes a circuit board connected to the main pad and the power pad, and the sensing electrodes can receive an electrical signal through the circuit board.

[0018] An electronic device according to one embodiment of the present invention comprises an electronic panel including a bending portion that is bent along a bending axis in one direction and a non-bending portion connected to the bending portion, and a circuit board connected to the electronic panel, wherein the electronic panel comprises a plurality of pixels disposed in the non-bending portion, sensing electrodes disposed in the non-bending portion and overlapping with the pixels when viewed from the top surface, data pads disposed in the bending portion and connected to the circuit board, power pads disposed in the bending portion and connected to the circuit board, a power pattern disposed in the non-bending portion and connecting the power pads and the pixels, and sensing pads disposed in the non-bending portion and connected to the sensing electrodes, wherein the sensing pads overlap with the power pattern when viewed from the top surface.

[0019] The circuit board comprises a first circuit board connected to the data pads and the power pads, and a second circuit board connected to the sensing pads, and the sensing electrodes can receive an electrical signal through the second circuit board.

[0020] An electronic device according to one embodiment of the present invention further comprises main pads disposed in the bending portion and connected to the circuit board, and connecting lines extending in a direction intersecting the bending axis and connecting the main pads and the sensing pads, wherein the sensing electrodes can receive an electrical signal through the circuit board.

[0021] An electronic device according to one embodiment of the present invention further comprises a stress relief layer disposed in the bending portion and containing an organic material, and the connecting line may include a first line and a second line spaced apart in cross-section with the stress relief layer in between.

[0022] The above sensing pad, the first line, and the second line can be laminated in cross-section.

[0023] The first line is positioned on the second line, and at least a portion of the second line may be positioned on the same layer as the power pattern.

[0024] An electronic device according to one embodiment of the present invention further comprises an encapsulation layer disposed between the pixels and the sensing electrodes and including at least one of an organic film and an inorganic film, and the sensing electrodes may be disposed directly on the encapsulation layer. Effects of the invention

[0025] According to the present invention, mutual interference between a sensing pad, to which an electrical signal for detecting an external input is transmitted and received, and a power pattern can be prevented, thereby improving the electrical reliability of an electronic panel. Furthermore, according to the present invention, in an electronic panel in which a portion is bent, reliability against folding stress of the sensing signal line can be improved. Brief explanation of the drawing

[0026] FIG. 1a is an exploded perspective view of an electronic device according to one embodiment of the present invention. FIG. 1b is a combined perspective view of the electronic device shown in FIG. 1a. FIG. 3a is a cross-sectional view taken along I-I' shown in FIG. 2b. FIG. 3b is a cross-sectional view taken along II-II' shown in FIG. 2b. FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a part of an electronic device according to one embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a part of an electronic panel according to one embodiment of the present invention. FIG. 7 is a cross-sectional view illustrating a part of an electronic panel according to one embodiment of the present invention. FIGS. 8a to 8c are plan views briefly illustrating electronic panels according to one embodiment of the present invention. Specific details for implementing the invention

[0027] In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed / connected / combined with the other component, or that a third component may be placed between them.

[0028] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the effective illustration of the technical content.

[0029] "And / or" includes all one or more combinations that the associated configurations can define.

[0030] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0031] Additionally, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0032] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Additionally, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and are explicitly defined herein unless interpreted in an ideal or overly formal sense.

[0033] Terms such as "include" or "have" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0034] The present invention will be described below with reference to the drawings.

[0035] FIG. 1a is an exploded perspective view of an electronic device according to one embodiment of the present invention, and FIG. 1b is an assembled perspective view of the electronic device shown in FIG. 1a. Hereinafter, the present invention will be described with reference to FIG. 1a and FIG. 1b.

[0036] The electronic device (EA) includes a window member (100), an electronic panel (200), and a circuit board (300). The window member (100) can be divided into a transparent area (TA) and a bezel area (BA) when viewed on a plane defined by a first direction (D1) and a second direction (D2).

[0037] The transmission region (TA) may be a region through which light is transmitted. The bezel region (BA) may be a region with a lower light transmittance than the transmission region (TA). The bezel region (BA) is adjacent to the transmission region (TA). In this embodiment, the bezel region (BA) may surround the transmission region (TA). However, this is illustrated as an example, and the bezel region (BA) may be adjacent to only a portion of the edges of the transmission region (TA), and is not limited to any one embodiment.

[0038] The electronic panel (200) provides an active area (AA) and a peripheral area (NAA) facing the upper direction (D3, hereinafter the third direction). The electronic panel (200) activates the active area (AA) according to an electrical signal. The electronic panel (200) can display an image (IM) on the activated active area (AA) or detect an external input (TC) applied to the active area (AA).

[0039] In this embodiment, the transmission area (TA) may correspond to the active area (AA). Accordingly, the user can easily visualize the image (IM) displayed in the active area (AA) through the transmission area (TA). The external input (TC) may include various embodiments. For example, the external input (TC) includes various forms of external inputs such as parts of the user's body, light, heat, or pressure. Additionally, the electronic device (EA) may detect inputs that come into contact with the electronic device (EA), as well as inputs that are close or adjacent.

[0040] The surrounding area (NAA) is adjacent to the active area (AA). The surrounding area (NAA) may surround the edges of the active area (AA). However, this is illustrated as an example, and the surrounding area (NAA) may be adjacent to only some of the edges of the active area (AA) and is not limited to any one embodiment.

[0041] Various signal lines or electronic components that provide electrical signals to the active area (AA) may be placed in the peripheral area (NAA). The peripheral area (NAA) may be covered by the bezel area (BZA) and may not be visible from the outside.

[0042] Meanwhile, in the present embodiment, the electronic panel (200) may include a first pad area (PA1) and a second pad area (PA2). The first pad area (PA1) and the second pad area (PA2) are spaced apart from each other when viewed from the upper surface of the electronic panel (200). The first pad area (PA1) and the second pad area (PA2) may be areas to which a circuit board (300) is coupled. The first pad area (PA1) and the second pad area (PA2) are spaced apart from the active area (AA).

[0043] In this embodiment, at least a portion of the electronic panel (200) may be bent and combined with the window member (100). The portion of the peripheral area (NAA) where the first pad area (PA1) is located may be bent and positioned on the lower side of the electronic panel (200). Accordingly, the circuit board (300) may be assembled to be placed on the back side of the electronic panel (200) to form an electronic device (EA). A detailed description thereof will be provided later.

[0044] The circuit board (300) can be connected to the electronic panel (200). The circuit board (300) may include a first circuit board (310) and a second circuit board (320).

[0045] The first circuit board (310) is connected to the electronic panel (200) through the first pad area (PA1). The first circuit board (310) can provide a signal or power signal to control an image (IM) displayed on the electronic panel (200). The first circuit board (310) may include a main board (311), an electronic component (312), and a connector (313).

[0046] The main substrate (311) may be a configuration substantially coupled to the electronic panel (200). The main substrate (311) is electrically and physically coupled to the first pad area (PA1) through a conductive adhesive member not shown, etc. The main substrate (311) may include signal lines not shown.

[0047] The electronic component (312) can be mounted on the main board (311). The electronic component (312) can be electrically connected to the electronic panel (200) by connecting to the signal lines of the main board (311). The electronic component (312) generates or processes various electrical signals.

[0048] The connector (313) can be mounted on the main board (311). The connector (313) can be connected to signal lines. The connector (313) can serve as a passage to electrically connect the first circuit board (310) and the external configuration of the first circuit board (310).

[0049] The second circuit board (320) is connected to the electronic panel (200) through the second pad area (PA2). The second circuit board (320) can transmit / receive an electrical signal that enables the active area (AA) of the electronic panel (200) to detect an external touch (TC). The second circuit board (320) can provide an electrical signal to the electronic panel (200) or receive and process an electrical signal generated on the electronic panel (200).

[0050] Meanwhile, the second circuit board (320) may be connected to the first circuit board (310) through a connector (313). Accordingly, the first circuit board (320) may process an electrical signal corresponding to an external touch (TC) transmitted through the second circuit board (320), along with an electrical signal displaying an image (IM). Meanwhile, this is illustrated as an example, and the second circuit board (320) may be separated from the first circuit board (310) and controlled independently, and is not limited to any one embodiment.

[0051] FIG. 2a is a perspective view of an electronic panel according to an embodiment of the present invention, and FIG. 2b is an exploded perspective view showing some components of the electronic panel illustrated in FIG. 2a separated. Hereinafter, the present invention will be described with reference to FIG. 2a and FIG. 2b.

[0052] Referring to FIG. 2a, the electronic panel (200) may include a bending portion (BR) and a non-bending portion (NBR) that are bent along a bending axis (BX) extended along a first direction (D1). The bending portion (BR) may be bent to wrap around the bending axis (BX). At least a portion of the bending portion (BR) may have a curve in a cross-section defined by a second direction (D2) and a third direction (D3). Depending on the degree of bending of the electronic panel (200) or the width of the bending portion (BR) in the second direction (D2), the bending portion (BR) may consist only of a curved portion or may consist of a curved portion and a flat portion.

[0053] The non-bending portion (NBR) can be connected to the bending portion (BR) in the second direction (D2). When the bending portion (BR) is bent, the non-bending portion (NBR) can maintain a plane parallel to the plane defined by the first direction (D1) and the second direction (D2).

[0054] The boundary between the bending portion (BR) and the non-bending portion (NBR) can be defined parallel to the bending axis (BX). For one side and the other side of the electronic panel (200) that extend in a direction parallel to the bending axis (BX) and face each other in a direction intersecting the bending axis (BX), the non-bending portion (NBR) is the area from the boundary to either the one side or the other side, and the bending portion (NBR) may be the remaining area of ​​the electronic panel (100) other than the non-bending portion (NBR). That is, the bending portion (NBR) may be the area from the boundary to the other side of the one side or the other side.

[0055] The active area (AA) and the second pad area (PA2) may be defined in the non-bending portion (NBR). Accordingly, the active area (AA) and the second pad area (PA2) may be exposed toward the third direction (D3). Meanwhile, the first pad area (PA1) may be defined in the bending portion (BR). Accordingly, the first pad area (PA1) is positioned on the back surface of the non-bending portion (NBR) and is not exposed toward the third direction (D3). The first pad area (PA1) may be formed on various surfaces without being limited to curved or flat surfaces, depending on the degree of bending of the bending portion (BR) or the width of the bending portion (BR) in the second direction (D2). For example, if the bending portion (BR) consists only of a curved portion, the first pad area (PA1) may be formed on a curved surface. Alternatively, if the bending portion (BR) is composed of a curved portion and a flat portion connected to the curved portion, the first pad area (PA1) may be formed on a flat surface.

[0056] The electronic panel (200) may include a display unit (210) and an input detection unit (220). In FIG. 2b, the display unit (210) and the input detection unit (220) are shown separately for easy explanation.

[0057] The display unit (210) can generate and display an image (IM: see FIG. 1b) in an active area (AA). The display unit (210) may include a base substrate (10), a plurality of signal lines (GL, DL, PL), a pixel (PX), a power pattern (PP), and a plurality of display pads (PDP, PDD).

[0058] The base substrate (10) may correspond to the shape on the plane of the electronic panel (200). Specifically, the base substrate (10) may be configured to substantially provide a bending portion (BR) and a non-bending portion (NBR). The base substrate (10) may have flexibility to be bendable. For example, the base substrate (10) may be an insulating polymer film.

[0059] Signal lines (GL, DL, PL) are placed on a base substrate (10). The signal lines (GL, DL, PL) may include a gate line (GL), a data line (DL), and a power line (PL). The gate line (GL), the data line (DL), and the power line (PL) may each transmit different electrical signals.

[0060] The gate line (GL) extends along the first direction (D1). Although the gate line (GL) may be provided in multiple numbers and arranged spaced apart from each other along the second direction (D2), a single gate line (GL) is illustrated as an example for ease of explanation.

[0061] Meanwhile, although not shown, the display unit (210) may further include a gate driving circuit mounted on the base substrate (10) to provide an electrical signal to the gate line (GL). Alternatively, the display unit (210) may further include gate pads to be electrically connected to an externally provided gate driving circuit.

[0062] The data line (DL) extends along the second direction (D2). The data line (DL) may be electrically isolated from the gate line (GL). Although the data line (DL) may be provided in multiple numbers and arranged spaced apart from each other along the first direction (D1), a single data line (DL) is illustrated as an example for ease of explanation. The data line (DL) provides a data signal to the pixel (PX).

[0063] The power line (PL) extends along the second direction (D2). The power line (PL) may be electrically isolated from the gate line (GL) and the data line (DL). Although the power line (PL) may be provided in multiple numbers and arranged spaced apart from each other along the first direction (D1), a single power line (PL) is illustrated as an example for ease of explanation. The power line (PL) may provide a power signal (hereinafter referred to as the first power signal) to the pixel (PX).

[0064] A pixel (PX) is placed in a display area (DA). Although multiple pixels (PX) may be provided and arranged in a matrix form along a first direction (D1) and a second direction (D2) within the display area (DA), a single pixel (PX) is illustrated as an example for ease of explanation. The pixel (PX) displays light according to an electrical signal to create an image (IM).

[0065] A pixel (PX) may include a first thin-film transistor (TR1), a second thin-film transistor (TR2), a capacitor (CP), and a light-emitting element (ED). The first thin-film transistor (TR1), the second thin-film transistor (TR2), the capacitor (CP), and the light-emitting element (ED) are electrically connected.

[0066] The first thin-film transistor (TR1) may be a switching element that controls the turn-on and turn-off of a pixel (PX). The first thin-film transistor (TR1) is connected to a gate line (GL) and a data line (DL). The first thin-film transistor (TR1) is turned on by a gate signal provided through the gate line (GL) and provides a data signal provided through the data line (DL) to a capacitor (CP).

[0067] The capacitor (CP) charges a voltage corresponding to the potential difference between the first power signal provided from the power line (PL) and the signal provided from the thin-film transistor (TR1). The second thin-film transistor (TR2) provides the first power signal provided from the power line (PL) to the light-emitting element (ED) in correspondence with the voltage charged in the capacitor (CP).

[0068] A light-emitting device (ED) can generate light or control the amount of light according to an electrical signal. For example, the light-emitting device (ED) may include an organic light-emitting device, a quantum dot light-emitting device, an electrophoretic device, or an electrowetting device.

[0069] The light-emitting element (ED) is connected to the power terminal (VSS) and receives a second power signal that is different from the first power signal. A driving current corresponding to the difference between the electrical signal provided by the second thin-film transistor (TR2) and the second power signal flows through the light-emitting element (ED), and the light-emitting element (ED) can generate light corresponding to the driving current.

[0070] Meanwhile, this is illustrated as an example, and the pixel (PX) may include electronic elements having various configurations and arrangements and is not limited to any one embodiment.

[0071] The power pattern (PP) is placed in the non-display area (NDA). The power pattern (PP) constitutes the non-bending portion (NBR). The power pattern (PP) may have a rectangular shape with an extended long side extending along the first direction (D1) and a short side extending along the second direction (D2). The power pattern (PP) is electrically connected to the power line (PL). That is, the power pattern (PP) may be provided with the same electrical signal as the power line (PL).

[0072] A plurality of display pads (PDP, PDD) are placed in a non-display area (NDA). The area within the non-display area (NDA) where the display pads (PDP, PDD) are placed can be defined as a first pad area (PA1). As described above, a first circuit board (310: see FIG. 1a) is coupled to the first pad area (PA1). The first circuit board (310) is electrically connected to an electronic panel (200) through the display pads (PDP, PDD) placed in the first pad area (PA1).

[0073] Display pads (PDP, PDD) may include a data pad (PDD) and a power pad (PDP). The data pad (PDD) is connected to a data line (DL). The data line (DL) extends from the display area (DA) and is connected to the data pad (PDD) via a power pattern (PP). The data line (DL) can receive a data signal from the outside through the data pad (PDD).

[0074] Meanwhile, this is illustrated as an example, and a display unit (210) according to one embodiment of the present invention may place a data line (DL) only in a display area (DA) and may further include a separate connection line placed in a non-display area (NDA) to connect the data line (DL) and the data pad (PDD). In this case, the connection line may be connected to the data line (DL) and the data pad (PDD), respectively, through a contact hole or through direct contact.

[0075] The power pad (PDP) is connected to the power pattern (PP). The power pattern (PP) can transmit a first power signal provided from the outside to the power line (PL) through the power pad (PDP). The connection line connecting the power pattern (PP) and the power pad (PDP) may be formed integrally with the power pattern (PP) or provided on a separate layer. A detailed explanation thereof will be provided later.

[0076] An input detection unit (220) is placed on a display unit (210). The input detection unit (220) can detect an external input (TC: see FIG. 1b) and obtain position or intensity information of the external input (TC). The input detection unit (220) may include a detection insulating layer (20), a detection electrode (SS), a plurality of detection lines (SL1, SL2), and a plurality of detection pads (PDT).

[0077] The input detection unit (220) may include a detection area (SA) and a non-detection area (NSA). The detection area (SA) may be an area capable of detecting an external input (TC). The detection area (SA) may overlap with a display area (DA). In this embodiment, the active area (AA) may be an area including the detection area (SA) and the display area (DA).

[0078] The non-sensing area (NSA) is adjacent to the sensing area (SA). The non-sensing area (NSA) may surround the edge of the sensing area (SA). However, this is illustrated as an example, and the non-sensing area (NSA) may be adjacent to only a part of the edge of the sensing area (SA), may be omitted, and is not limited to any one embodiment.

[0079] A sensing electrode (SS) is placed in a sensing area (SA). The sensing electrode (SS) may include a first sensing electrode (SP1) and a second sensing electrode (SP2) that receive different electrical signals. The sensing electrode (SS) can obtain information about an external input (TC) through a change in capacitance between the first sensing electrode (SP1) and the second sensing electrode (SP2).

[0080] The first sensing electrode (SP1) extends along the first direction (D1). The first sensing electrode (SP1) may be provided in multiple numbers and arranged spaced apart from each other along the second direction (D2). The second sensing electrode (SP2) extends along the second direction (D2). The second sensing electrode (SP2) may be provided in multiple numbers and arranged spaced apart from each other along the first direction (D1).

[0081] The sensing lines (SL1, SL2) and sensing pads (PDT) are placed in a non-sensing area (NSA). The sensing pads (PDT) are connected to the sensing lines (SL1, SL2), respectively. The sensing lines (SL1, SL2) include a first sensing line (SL1) and a second sensing line (SL2). The first sensing line (SL1) connects the first sensing electrode (SP1) and the first sensing pad (PDT) to transmit an electrical signal provided from the outside through the sensing pad (PDT) to the first sensing electrode (SP1). The second sensing line (SL2) connects the second sensing electrode (SP2) and the sensing pad (PDT) to transmit an electrical signal provided from the outside through the sensing pad (PDT) to the second sensing electrode (SP2).

[0082] The area within the non-sensing area (NSA) where sensing pads (PDTs) are placed can be defined as the second pad area (PA2). As described above, the second circuit board (320: see FIG. 1a) is coupled to the second pad area (PA2). The second circuit board (320) is electrically connected to the electronic panel (200) through the sensing pads (PDTs) placed in the second pad area (PA2).

[0083] Meanwhile, in this embodiment, the second pad area (PA2) can overlap with the power pattern (PP) when viewed from the upper surface of the electronic panel (200). That is, the sensing pads (PDT) and the power pattern (PP) are placed on different layers, and the projected images of the two configurations on the same plane can overlap. Mutual interference between the area where the sensing pads (PDT) are placed and the area where the power pattern (PP) is placed is prevented, so they can be designed independently. A detailed explanation of this will be provided later.

[0084] FIG. 3a is a cross-sectional view taken along I-I' as shown in FIG. 2b, and FIG. 3b is a cross-sectional view taken along II-II' as shown in FIG. 2b. FIG. 3a and FIG. 3b show cross-sectional views of an electronic panel (200) in which a display unit (210) and an input detection unit (220) are combined for ease of explanation. The present invention will be described with reference to FIG. 3a and FIG. 3b. Meanwhile, the same reference numerals are assigned to configurations identical to those described in FIG. 1a to FIG. 2b, and redundant descriptions are omitted.

[0085] FIGS. 3A and 3B illustrate a region where a non-bending portion (NBR) and a bending portion (BR) are connected. The electronic panel (200) may include a plurality of insulating layers (11, 12, 13, 14, 15, 16, 17, 18) and an encapsulation layer (ECL) disposed between a base substrate (10) and a sensing insulating layer (20). A thin-film transistor (TR) and a light-emitting element (ED) connected to each other are disposed on the base substrate (10). The thin-film transistor (TR) may correspond to a second transistor (TR2: see FIG. 2B) shown in FIG. 2B.

[0086] A thin-film transistor (TR) comprises a semiconductor layer (AL), a control electrode (CE), an input electrode (IE), and an output electrode (OE). The semiconductor layer (AL) comprises a semiconductor material. The semiconductor layer (AL) may be disposed between a base substrate (10) and a first insulating layer (11). The first insulating layer (11) may comprise an inorganic film. The first insulating layer (11) may be a barrier layer, a buffer layer, or a combination thereof.

[0087] The control electrode (CE) may be positioned between the second insulating layer (12) and the third insulating layer (13). It is spaced apart from the semiconductor layer (AL) with the second insulating layer (12) positioned on the first insulating layer (11) in between. The input electrode (IE) and the output electrode (OE) may be positioned between the fourth insulating layer (14) and the fifth insulating layer (15) positioned on the third insulating layer (13). The input electrode (IE) and the output electrode (OE) may be connected to the semiconductor layer (AL) by penetrating the second to fourth insulating layers (12, 13, 14).

[0088] In this embodiment, the electronic panel (200) may further include an upper electrode (UE) disposed between the third insulating layer (13) and the fourth insulating layer (14). The upper electrode (UE) is spaced apart from the control electrode (CE) with the third insulating layer (13) in between. The upper electrode (UE) can function in various configurations depending on the applied electrical signal. For example, the upper electrode (UE) may receive the same electrical signal as the control electrode (CE). In this case, the thin-film transistor (TR) may have a dual-gate structure including the upper electrode (UE) and the control electrode (CE). Alternatively, for example, the upper electrode (UE) may receive an electrical signal different from that of the control electrode (CE). In this case, the upper electrode (UE) and the control electrode (CE) may function as capacitors forming a predetermined electric field. However, this is illustrated as an example, and according to one embodiment of the present invention, the upper electrode (UE) may be omitted.

[0089] Meanwhile, in this embodiment, a portion of the region constituting the bending portion (BR) among the insulating layers may be removed. For example, a portion of the first to fifth insulating layers (11, 12, 13, 14, 15) is removed to form an opening region (OP-B) in the bending portion (BR). A sixth insulating layer (16) fills the opening region (OP-B). The sixth insulating layer (16) may include an organic material. According to this embodiment, by forming an opening region (OP-B) in the bending portion (BR) and filling it with a sixth insulating layer (16) with high flexibility, the bending stress applied to the bending portion (BR) can be relieved and the reliability of the electronic panel (200) can be improved.

[0090] In this embodiment, a light-emitting element (ED) is disposed on a thin-film transistor (TR). A sixth insulating layer (16) and a seventh insulating layer (17) may be disposed sequentially between the light-emitting element (ED) and the thin-film transistor (TR). Meanwhile, the electronic panel (200) according to this embodiment may further include a connecting electrode (CNE) disposed between the sixth insulating layer (16) and the seventh insulating layer (17). The connecting electrode (CNE) penetrates the fifth insulating layer (15) and the sixth insulating layer (16) and is connected to the output electrode (OE) of the thin-film transistor (TR). The first electrode (E1) of the light-emitting element (ED) penetrates the seventh insulating layer (17) and is connected to the output electrode (OE). According to the present invention, by further including the connecting electrode (CNE), the contact resistance between the light-emitting element (ED) and the thin-film transistor (TR) can be reduced and the reliability of the electrical connection can be improved. However, this is illustrated as an example, and according to one embodiment of the present invention, the connecting electrode (CNE) may be omitted.

[0091] The light-emitting element (ED) comprises a first electrode (E1), a light-emitting layer (EL), and a second electrode (E2). As described above, the first electrode (E1) is connected to a thin-film transistor (TR) and receives an electrical signal from the thin-film transistor (TR). The second electrode (E2) is connected to a power terminal not shown. The light-emitting layer (EL) is placed in an opening defined in the eighth insulating layer (18). The light-emitting layer (EL) emits light in response to the potential difference between the first electrode (E1) and the second electrode (E2).

[0092] The encapsulation layer (ECL) may include a first inorganic layer (IOL1), a second inorganic layer (IOL2), and an organic layer (OL). The first inorganic layer (IOL1) covers the light-emitting element (ED). The organic layer (OL) is disposed between the first inorganic layer (IOL1) and the second inorganic layer (IOL2). The organic layer (OL) provides a flat upper surface to the second inorganic layer (IOL2). The second inorganic layer (IOL2) covers the organic layer (OL). At least a portion of the first inorganic layer (IOL1) may be exposed from the organic layer (OL) and in direct contact with the second inorganic layer (IOL2).

[0093] In the present invention, a sensing electrode (SS) may be disposed on an encapsulation layer (ECL). The sensing electrode (SS) may include a first sensing layer (TL1) and a second sensing layer (TL2). The first sensing layer (TL1) is disposed between the encapsulation layer (ECL) and the sensing insulating layer (20). The second sensing layer (TL2) is disposed on the sensing insulating layer (20). In this embodiment, the case where the first sensing layer (TL1) is a bridge pattern connected to the second sensing layer (TL2) is illustrated as an example, but is not limited thereto.

[0094] The power pattern (PP) can be placed between the fourth insulating layer (14) and the fifth insulating layer (15). In this embodiment, the power pattern (PP) is placed on the same layer as the input electrode (IE) and the output electrode (OE). Accordingly, the power pattern (PP) can be formed simultaneously with the input electrode (IE) and the output electrode (OE) in the same process.

[0095] A sensing pad (PDT) is placed on a power pattern (PP). The sensing pad (PDT) is placed to overlap with the power pattern (PP) when viewed from the top surface of the electronic panel (200). In this embodiment, the sensing pad (PDT) may be placed on a different layer from the power pattern (PP). For example, the sensing pad (PDT) is placed between the sixth insulating layer (16) and the seventh insulating layer (17). A sensor electrode (SS) can receive an electrical signal from the outside through the sensing pad (PDT).

[0096] The seventh insulating layer (17) forms a predetermined opening region (OP-T) to expose a sensing pad (PDT). The sensing pad (PDT) can be connected to other components through the opening region (OP-T).

[0097] The sensing signal line (SL-T) is a conductive line connecting the sensor electrode (SS) and the sensing pad (PDT), and may be any one of the sensing lines (SL1, SL2: see FIG. 2b). Alternatively, the sensing signal line (SL-T) may be a conductive line provided separately from the sensing lines (SL1, SL2). In this case, the sensing signal line (SL-T) may be connected to the sensing lines (SL1, SL2) through a contact hole or directly connected to the sensing pad (PDT) and the sensing lines (SL1, SL2).

[0098] The power pad (PDP) is placed in the bending portion (BR). The power pad (PDP) is exemplarily illustrated as being placed between the fourth insulating layer (14) and the fifth insulating layer. That is, in this embodiment, the power pad (PDP) may be placed on the same layer as the power pattern (PP). The power pad (PDP) is exposed to the outside through an opening area (OP-P1) formed in the fifth insulating layer (15), the sixth insulating layer (16), and the seventh insulating layer (17).

[0099] The power pattern (PP) and the power pad (PDP) can be connected via a power connection line (BRL1). The power connection line (BRL1) electrically connects the power pattern (PP) located in the non-bending section (NBR) and the power pad (PDP) located in the bending section (BR) via the aperture area (OP-B). The power connection line (BRL1) can be placed on a different layer from the power pattern (PP) or the power pad (PDP).

[0100] The power connection line (BRL1) may include a material that is relatively more flexible than the power pattern (PP) or power pad (PDP). Accordingly, the power connection line (BRL1) may have improved reliability against bending stress. Meanwhile, this is described by way of example, and the power connection line (BRL1) may include the same material as the power pattern (PP) or power pad (PDP), and is not limited to any one embodiment.

[0101] In this embodiment, the power connection line (BRL1) is positioned between the sixth insulating layer (16) and the seventh insulating layer (17). The power connection line (BRL1) penetrates the fifth insulating layer (15) and the sixth insulating layer (16) and is connected to the power pattern (PP) and the power pad (PDP), respectively. However, this is illustrated as an example, and the power connection line (BRL1) can be positioned at various locations as long as it can connect the power pad (PDP) and the power pattern (PP) according to one embodiment of the present invention, and is not limited to any one embodiment.

[0102] Referring to FIG. 3b, the data pad (PDD) may be placed on the fourth insulating layer (14). In this embodiment, the data pad (PDD) is placed on the same layer as the power pad (PDP). Accordingly, the surface to which the first circuit board (310) is connected may be provided on the same insulating layer, thereby allowing for a stable electrical connection between the first circuit board (310) and the electronic panel (200). However, this is illustrated as an example, and the data pad (PDD) according to one embodiment of the present invention may be placed on a different layer from the power pad (PDP), and is not limited to any one embodiment.

[0103] The data pad (PDD) can be connected to the data line (DL: see FIG. 2b) of the non-bending portion (NBR) via the data connection line (BRL2). FIG. 3b illustrates the connection pattern (CNP) and data signal lines (SL-D) for ease of explanation. The connection pattern (CNP) is placed on the fourth insulating layer (14) on which the input electrode (IE) and the output electrode (DE) are placed. The connection pattern (CNP) may be a conductive pattern placed on the same layer as the data line (DL). The connection pattern (CNP) connects the unillustrated data line (DL) and the data signal lines (SL-D).

[0104] Data signal lines (SL-D) may be placed on a different layer from the data line (DL). When viewed from the top surface of the electronic panel (200), the data signal lines (SL-D) may overlap with the power pattern (PP). The data signal lines (SL-D) are connected to the data line (DL) through the connection pattern (CNP) and connected to the data pad (PDD) through the data connection line (BRL2). According to the present invention, by further including the data signal lines (SL-D), data signals different from the power signal can be transmitted to the area overlapping with the power pattern (PP).

[0105] The data connection line (BRL2) may include a material that is relatively more ductile than the data signal lines (SL-D) or the data pad (PDD). Accordingly, the data connection line (BRL2) may have improved reliability against bending stress. Meanwhile, this is described by way of example, and the data connection line (BRL2) may include the same material as the data signal lines (SL-D) or the data pad (PDD), and is not limited to any one embodiment.

[0106] According to the present invention, by providing a sensing pad (PDT) for providing voltage to a sensing electrode (SS) disposed on an encapsulation layer (ECL) on a layer different from the power pattern (PP), the power pattern (PP) and the sensing pad (PDT) can be arranged in an overlapping manner when viewed from the upper surface of the electronic panel (200). Accordingly, the power pattern (PP) and the sensing pad (PDT) can each secure a space for independent formation, and short-circuit problems between the two components can be prevented, thereby improving the reliability of the electronic panel (200).

[0107] FIG. 4 is an exploded perspective view of an electronic device according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view illustrating a part of an electronic device according to an embodiment of the present invention. For ease of explanation, FIG. 4 is illustrated to correspond to FIG. 1a, and FIG. 5 is illustrated to correspond to an area corresponding to FIG. 3a. Hereinafter, the present invention will be described with reference to FIG. 4 and FIG. 5. Meanwhile, the same reference numerals are assigned to configurations identical to those described in FIG. 1a to FIG. 3b, and redundant descriptions are omitted.

[0108] The electronic device (EA1) may include an electronic panel (201) and a circuit board (301). The electronic panel (201) includes a first pad area (PA10) and a second pad area (PA20).

[0109] The circuit board (301) is connected to the electronic panel (200) through the first pad area (PA10). The circuit board (301) may include a main board (311), an electronic element (312), and a sensing driving element (314). The main board (311) and the electronic element (312) may correspond to the main board (311) and the electronic element (312) shown in FIG. 1a, and a redundant description will be omitted. The sensing driving element (314) may provide a driving signal to the sensing electrode (SS) or receive and process a sensing signal received from the sensing electrode (SS).

[0110] The sensing driving element (314) may be configured to be mounted on the second circuit board (320: see FIG. 1a) shown in FIG. 1a or mounted on the main board (311). In this embodiment, the second circuit board (320) may not be provided. Accordingly, the second pad area (PA20) is not connected to a separate circuit board.

[0111] The sensing pad (PDT) is placed on the non-bending portion (NBR). The sensing pad (PDT) may be placed on the power pattern (PP). The sensing pad (PDT) overlaps with the power pattern (PP) when viewed from the upper surface of the electronic panel (200).

[0112] At this time, the electronic panel (200) may further include a connection line (BRL-T, hereinafter referred to as the detection connection line) connecting the second pad area (PA20) and the first pad area (PA10). The detection connection line (BRL-T) connects the detection pad (PDT) placed in the second pad area (PA20) and the main pad (PD-T) placed in the first pad area (PA10). That is, in this embodiment, the electronic panel (201) may further include a main pad (PD-T) placed in the first pad area (PA10).

[0113] The electronic panel (200) can transmit an electrical signal provided through the main pad (PD-T) to the sensing pad (PDT) through the sensing connection line (BRL-T). The sensing pad (PDT) provides the transmitted electrical signal to the sensing electrode (SS) to detect an external input.

[0114] The sensing connection line (BRL-T) passes through the bending portion (BR) and is connected to the sensing pad (PDT). The sensing connection line (BRL-T) may be placed on a different layer from the power pattern (PP). Additionally, although not shown, it may be placed on a different layer from the power connection line (BRL1: see FIG. 3b) connected to the power pattern (PP) or the data connection line (BRL2: see FIG. 3b) for transmitting data voltage. Accordingly, interference with the electrical signal provided to the display unit can be minimized.

[0115] The sensing connection line (BRL-T) may include a material that is relatively more ductile than the sensing pad (PDT) or the main pad (PD-T). Accordingly, the sensing connection line (BRL-T) may have improved reliability against bending stress. Meanwhile, this is described by way of example, and the sensing connection line (BRL-T) may include the same material as the sensing pad (PDT) or the main pad (PD-T), and is not limited to any one embodiment.

[0116] According to the present invention, the connection area of ​​a circuit board (301) for applying an electrical signal to a sensing electrode (SS) through a sensing connection line (BRL-T) can be unified into a first pad area (PA10). According to the present invention, since a power pad (PDP: see FIG. 2b), a data pad (PDD: see FIG. 2b), and a main pad (PD-T) can be provided in a single pad area (PA10), a separate configuration such as a second circuit board (320) can be omitted. Accordingly, production costs can be reduced.

[0117] FIG. 6 is a cross-sectional view illustrating a portion of an electronic panel according to an embodiment of the present invention. For ease of explanation, FIG. 6 illustrates a region corresponding to FIG. 5. Hereinafter, the present invention will be described with reference to FIG. 6. Meanwhile, the same reference numerals are assigned to configurations identical to those described in FIG. 1a to FIG. 5, and redundant descriptions are omitted.

[0118] As illustrated in FIG. 6, the electronic panel (202) may include a sensing connection line (BRL-T1) comprising a plurality of lines. The sensing connection line (BRL-T1) includes a first line (BRL-TA) and a second line (BRL-TB). The first line (BRL-TA) and the second line (BRL-TB) may pass through a bending portion (BR) and be connected to a main pad (PD-T) and a sensing pad (PDT), respectively. Meanwhile, in the present embodiment, the main pad (PD-T) may be part of the second line (BRL-TB), but this is illustrated as an example and may be provided as a separate pattern.

[0119] A stress relief layer (SNL) may be additionally disposed between the first line (BRL-TA) and the second line (BRL-TB). The stress relief layer (SNL) may include an organic material. For example, the stress relief layer (SNL) may include the same material as at least one of the sixth insulating layer (16) and the seventh insulating layer (17). Alternatively, the stress relief layer (SNL) may include a material having higher ductility than the sixth insulating layer (16) and the seventh insulating layer (17). The stress relief layer (SNL) may be a single layer or have a structure in which multiple layers are stacked, and is not limited to any one embodiment.

[0120] The first line (BRL-TA) is connected to the sensing pad (PDT) via the bending portion (BR) on the stress relief layer (SNL). The second line (BRL-TB) is connected to the sensing pad (PDT) via the bending portion (BR) on the lower side of the stress relief layer (SNL). Meanwhile, the second line (BRL-TB) may be placed on the same layer as the power pattern (PP). Referring to the AA region, the first line (BRL-TA), the second line (BRL-TB), and the pad electrode (PDT) may have a structure in which they are directly contacted and connected.

[0121] According to the present invention, by forming a sensing connection line (BRL-T1) passing through a bending part (BR) as a double wiring structure, damage to the sensing connection line (BRL-T1) due to bending stress can be prevented. In addition, even if either the first line (BRL-TA) or the second line (BRL-TB) is damaged by bending stress, the other line can be maintained, thereby ensuring stable transmission of electrical signals.

[0122] FIG. 7 is a cross-sectional view illustrating a portion of an electronic panel according to an embodiment of the present invention. For ease of explanation, FIG. 7 illustrates a region corresponding to FIG. 5. Hereinafter, the present invention will be described with reference to FIG. 7. Meanwhile, the same reference numerals are assigned to configurations identical to those described in FIG. 1a to 6, and redundant descriptions are omitted.

[0123] As illustrated in FIG. 7, in an electronic panel (203), a sensing pad (PDT), a sensing connection line (BRL-T), and a main pad (PD-T) may be integrally formed on the same layer. By opening a portion of the conductive lines disposed between the sixth insulating layer (16) and the seventh insulating layer (17) from the seventh insulating layer (17), a sensing pad (PDT) may be defined in the open area of ​​the non-bending portion (NBR), and a main pad (PD-T) may be defined in the open area of ​​the bending portion (BR).

[0124] At this time, the main pad (PD-T) may be formed on the same layer as the sensing pad (PDT). Although not shown, the display pads (not shown) may be placed on the same layer as the main pad (PD-T), unlike the display pads (PDP: see FIG. 3A) shown in FIG. 3A. Accordingly, the step difference between the main pad (PD-T) and the display pads is eliminated, thereby preventing poor connection with the circuit board (301). Meanwhile, this is described as an example, and the display pads may be placed on a different layer from the main pad (PD-T), and the step difference may be eliminated through a connecting member such as an anisotropic conductive film or solder particles.

[0125] According to the present invention, a sensing pad (PDT), a sensing connection line (BRL-T), and a main pad (PD-T) can be formed with a single conductive line, thereby simplifying the process and reducing process costs. However, this is illustrated as an example, and the electronic panel (203) according to one embodiment of the present invention can be designed with various stacked structures and is not limited to any one embodiment.

[0126] FIGS. 8a to 8c are simplified plan views illustrating electronic panels according to an embodiment of the present invention. FIGS. 8a to 8c briefly illustrates the positional relationship between the power pattern and the sensing pad as viewed from the top surface for ease of explanation, and the remaining components are omitted. Hereinafter, the present invention will be described with reference to FIGS. 8a to 8c. Meanwhile, the same reference numerals are assigned to components identical to those described in FIGS. 1a to 7, and redundant descriptions are omitted.

[0127] As illustrated in FIG. 8a, the electronic panel (200-1) may include an overlapping power pattern (PP-1) and a sensing pad (PDT-1) when viewed from the top surface of the electronic panel (200-1). A second pad area (PA2) on which the sensing pad (PDT-1) is placed may be defined to overlap with the power pattern (PP-1).

[0128] According to the present invention, since the sensing pad (PDT-1) can be placed overlappingly on the power pattern (PP-1), the width (D11, hereinafter the first width) in the first direction (D1) of the second pad area (PA2-1) may be less than or equal to the width (D21, hereinafter the second width) in the first direction (D1) of the power pattern (PP-1). Additionally, the second pad area (PA2-1) may be placed at various locations within the area where the second width (D21) is defined.

[0129] Referring to FIG. 8b, in the electronic panel (200-2), the second width (D22) may extend outside the active area (AA). The second width (D22) of the electronic panel (200-2) may be longer than the second width (D21) of the electronic panel (200-1) shown in FIG. 7a. According to the present invention, since the power pattern (PP-2) is placed on a different layer from the sensing pad (PDT-2), the position of the sensing pad (PDT-2) may not affect the area occupied by the power pattern (PP-2). According to the present invention, the power pattern (PP-2) may be designed with various sizes, shapes, and widths regardless of the sensing pad (PDT-2) and is not limited to any one embodiment.

[0130] Referring to FIG. 8c, in the electronic panel (200-3), the first width (D13) may have an extended length compared to the first width (D11) shown in FIG. 7a. When the number of sensing pads (PDT-3) is constant, an increase in the first width (D13) can result in an increase in the spacing between the sensing pads (PDT-3). Accordingly, interference between the sensing pads (PDT-3) can be reduced, and stable signal transmission can be achieved for each sensing pad (PDT-3).

[0131] According to the present invention, by placing the sensing pads (PDT-1, PDT-2, PDT-3) on a different layer from the power patterns (PP-1, PP-2, PP-3), interference between the two configurations can be prevented and an independent design can be made possible. Accordingly, the reliability of the electronic panels (200-1, 200-2, 200-3) can be improved.

[0132] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as described in the claims set forth below.

[0133] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0134] EA: Electronic Device 100: Window Missing 200: Electronic panel 300: Circuit board PDT: Detection pad PP: Power pattern

Claims

Claim 1 A base substrate comprising a bending portion that is bent along a bending axis extending in one direction and a non-bending portion adjacent to the bending portion; a plurality of pixels disposed in an active area defined in the non-bending portion; a plurality of power lines connected to the pixels; a first insulating layer disposed on the power lines; a power pad disposed on the first insulating layer in a first pad area defined in the bending portion and receiving a power voltage; a power pattern disposed on the first insulating layer in the non-bending portion and connecting the power lines to the power pad; a second insulating layer disposed on the first insulating layer, the power pad, and the power pattern; a plurality of sensing electrodes disposed on the pixels in the non-bending portion; and a plurality of sensing pads disposed on the second insulating layer in a second pad area defined in the non-bending portion and electrically connected to the sensing electrodes. An electronic device comprising a second insulating layer and a third insulating layer disposed on the second insulating layer, wherein the second pad region is disposed between the first pad region and the active region, the sensing pads overlap with the power pattern in the second pad region, the power pad is exposed through a first opening formed within the second and third insulating layers, and the sensing pads are disposed between the second and third insulating layers and are exposed through a second opening formed within the third insulating layer. Claim 2 An electronic device according to claim 1, wherein each of the pixels comprises: a thin-film transistor comprising a semiconductor pattern, a control electrode spaced apart from the semiconductor pattern, an input electrode connected to the semiconductor pattern, and an output electrode disposed on the same layer as the input electrode and connected to the semiconductor pattern; and a light-emitting element disposed on the thin-film transistor, comprising a first electrode, a second electrode disposed on the first electrode, and a light-emitting layer disposed between the first electrode and the second electrode. Claim 3 In claim 2, the power pattern is an electronic device disposed on the first insulating layer together with the output electrode. Claim 4 An electronic device according to claim 3, wherein the first insulating layer is disposed between the first electrode and the output electrode and covers the output electrode, the second insulating layer is disposed on the first insulating layer, the first electrode is disposed on the third insulating layer, and the power pattern is covered by the first insulating layer. Claim 5 An electronic device according to claim 4, further comprising a connecting electrode disposed between the second insulating layer and the third insulating layer, wherein the first electrode penetrates the third insulating layer and is connected to the connecting electrode, and the connecting electrode penetrates the first and second insulating layers and is connected to the output electrode. Claim 6 An electronic device according to claim 1, wherein the power pattern extends in the one direction, the width of the power pattern in the one direction is smaller than the width of the active region in the one direction, and the width of the second pad region in the one direction is smaller than or equal to the width of the power pattern in the one direction. Claim 7 An electronic device according to claim 1, wherein the power pattern extends in the one direction, the width of the power pattern in the one direction is greater than the width of the active region in the one direction, and the width of the second pad region in the one direction is less than or equal to the width of the power pattern in the one direction. Claim 8 An electronic device according to claim 1, wherein the opening region is defined by penetrating the first insulating layer in the above one direction, and the opening region is disposed between the first pad region and the second pad region. Claim 9 In claim 8, the second insulating layer is filled in the opening region and is an electronic device comprising an organic material. Claim 10 An electronic device according to claim 8, further comprising a power connection line that electrically connects the power pattern to the power pad through the opening area. Claim 11 An electronic device according to claim 8, further comprising: a plurality of main pads disposed in the first pad area and connected to the sensing pads; and a plurality of sensing connection lines connecting the main pads to the sensing pads. Claim 12 An electronic device according to claim 11, wherein the opening region is positioned between the main pads and the sensing pads and overlaps with the plurality of sensing connection lines. Claim 13 An electronic panel comprising a bending portion that is bent along a bending axis extending in one direction and a non-bending portion adjacent to the bending portion, wherein the electronic panel comprises: a plurality of pixels disposed in an active area defined in the non-bending portion; data pads disposed in a first pad area defined in the bending portion; a first insulating layer; power pads disposed on the first insulating layer in the first pad area; a power pattern disposed on the first insulating layer in the non-bending portion and connecting the power pads and the pixels; sensing electrodes disposed in the non-bending portion and overlapping with the pixels; a second insulating layer disposed on the first insulating layer, the power pads, and the power patterns; and sensing pads disposed on the second insulating layer in a second pad area defined in the non-bending portion, connected to the sensing electrodes, and overlapping with the power pattern in the second pad area. An electronic device comprising a second insulating layer and a third insulating layer disposed on the second insulating layer, wherein the second pad region is disposed between the first pad region and the active region, the power pads and the data pads are exposed through a first opening formed within the second and third insulating layers corresponding to the bending portion, and the sensing pads are disposed between the second and third insulating layers and are exposed through a second opening formed within the third insulating layer corresponding to the non-bending portion. Claim 14 An electronic device according to claim 13, further comprising: a first circuit board connected to the power pads in the first pad area; and a second circuit board connected to the sensing pads in the second pad area. Claim 15 In claim 14, the first circuit board is an electronic device that overlaps with the second circuit board. Claim 16 An electronic device according to claim 13, wherein the opening region is defined by penetrating the first insulating layer in the above one direction, and the opening region is disposed between the first pad region and the second pad region. Claim 17 In claim 16, the second insulating layer is filled in the opening region and is an electronic device comprising an organic material. Claim 18 In claim 13, the electronic panel further comprises power lines arranged spaced apart from each other in a first direction, and the power pattern extends in the first direction and is an electronic device commonly connected to the power lines. Claim 19 An electronic device according to claim 18, wherein the width of the power pattern in the first direction is smaller than the width of the active region in the first direction, and the width of the second pad region in the first direction is smaller than or equal to the width of the power pattern in the first direction. Claim 20 An electronic device according to claim 18, wherein the width of the power pattern in the first direction is greater than the width of the active region in the first direction, and the width of the second pad region in the first direction is less than or equal to the width of the power pattern in the first direction.

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