Singulating chips separation apparatus by roll to roll process and method for the same

Abstract

The present invention relates to an apparatus for separating a chip by continuously heating a thermal peel tape, comprising: a tape for a roll-to-roll process; a thermal peelable adhesive tape attached to one side of the tape for the roll-to-roll process; an MLCC chip attached to the upper side of the thermal peelable adhesive tape; and a laser heating module that reduces the adhesive strength of the thermal peelable adhesive tape by irradiating a planar or linear irradiation light positioned spaced apart from the tape for the roll-to-roll process.

Description

Technology Field

[0001] The present invention relates to an apparatus for separating a chip by continuously heating a thermal peel tape, comprising: a tape for a roll-to-roll process; a thermal peelable adhesive tape attached to one side of the tape for the roll-to-roll process; an MLCC chip attached to the upper side of the thermal peelable adhesive tape; and a laser heating module that reduces the adhesive strength of the thermal peelable adhesive tape by irradiating a planar or linear irradiation light positioned spaced apart from the tape for the roll-to-roll process. Background Technology

[0002] Passive components, such as Multi-Layer Ceramic Capacitors (MLCCs) that store electricity and release it consistently as needed by circuits, and inductors—components wound into coil shapes that store energy in the form of magnetic fields—are used for a wide variety of applications. For instance, MLCC chips serve as power supply and stabilization devices; they store and stably supply the electricity required by semiconductors (such as APs and CPUs), maintain the voltage flowing through the circuit to prevent sudden fluctuations for voltage stabilization, and eliminate noise around high-speed semiconductors to prevent malfunctions. MLCC chips are used in IT and mobile devices (smartphones, tablets, wearables), automotive electronics and autonomous vehicles, AI servers, and network equipment.

[0003] Meanwhile, until passive components are converted into chips, they take the form of rectangular panels of various sizes. These panel materials are fabricated into chip form by cutting and shaping them using diamond blades in tungsten carbide blade and dicing saw processes, and thermal release tapes are used to facilitate material transport. Thermal release tapes maintain adhesive strength at room temperature to stably bond the film and the material, preventing material detachment during the process. After the cutting and shaping process, the tape is heated using equipment such as a heater or oven to lose its adhesive strength, thereby allowing the material to be easily separated from the tape. Ovens are primarily used for the tape heating process, which requires manual handling by an operator. Additionally, there is a problem in that it takes a long time for the thermal adhesive tape to heat up, reach a critical temperature, and lose its adhesive strength. For example, individual chips are obtained by mounting passive components onto thermal release tape, cutting the material, assembling the materials, performing a baking process using oven equipment, and then removing the material from the thermal adhesive tape; however, there are issues of reduced efficiency due to manual work and long processing times, so research and development are required to improve this. The problem to be solved

[0004] The present invention aims to solve the aforementioned problem by providing a device for separating a chip by heating a thermal release tape that peels off a material by inducing a thermal reaction of the thermal release tape using a planar laser. means of solving the problem

[0005] A chip separation device using a laser, which is an embodiment of the present invention, comprises: a roll-to-roll process tape; a heat-removable adhesive tape attached to one side of the roll-to-roll process tape; an MLCC chip attached to the upper side of the heat-removable adhesive tape; and a laser heating module that reduces the adhesive strength of the heat-removable adhesive tape by irradiating a planar or linear irradiation light positioned spaced apart from the roll-to-roll process tape.

[0006] A method for separating chips using a laser, which is an embodiment of the present invention, comprises: a first step of loading a heat-removable adhesive tape onto a substrate and mounting a bar-type MLCC chip onto the heat-removable adhesive tape; a second step of cutting the mounted bar-type MLCC chip from the first step into individual MLCC chips using a cutting machine; a third step of heating the heat-removable adhesive tape by irradiating a laser from a planar or linear laser heating module toward the heat-removable adhesive tape loaded and cut into individual MLCC chips in the second step; and a fourth step of separating the individual MLCC chips after heating in the third step from the heat-removable adhesive tape. This is a method for separating chips by irradiating a laser onto a heat-removable adhesive tape attached to a substrate.

[0007] A method for separating chips using a laser in a roll-to-roll process, which is an embodiment of the present invention, comprises: a first step of loading a heat-removable adhesive tape onto a substrate and mounting a bar-type MLCC chip onto the heat-removable adhesive tape; a second step of cutting the mounted bar-type MLCC chip from the first step into individual MLCC chips using a cutting machine; a second-1 step of loading the heat-removable adhesive tape from the second step onto the lower part of a roll-to-roll process tape; a third step of irradiating a laser from a planar or linear laser heating module spaced apart from the upper part of the roll-to-roll process tape from the second-1 step, passing through the roll-to-roll process tape, and irradiating the heat-removable adhesive tape to heat it; and a fourth step of separating the individual MLCC chips after heating in the third step from the heat-removable adhesive tape and loading them onto a tray spaced apart from the lower part of the roll-to-roll process tape. This is a method of separating chips by separating a thermal peel-off adhesive tape attached to a substrate, attaching it to a roll-to-roll process tape, and irradiating a laser while the roll-to-roll process tape is flowing continuously.

[0008] The above roll-to-roll process tape uses any one selected from polyethylene terephthalate, polyethylene naphthalate, polypropylene, and polytetrafluoroethylene.

[0009] In the third step above, a laser heating laser is irradiated so that the heating temperature of the heat-removable adhesive tape is controlled to 150°C or lower.

[0010] The third step further includes the step of cooling the Peltier module while applying pressure to the individual MLCC chips from the bottom to the top for a certain period of time when the laser of the laser heating module is irradiated. Effects of the invention

[0011] According to the chip separation device and method using a laser in a roll-to-roll process, which is an embodiment of the present invention, after cutting the material, the operator does not have to directly collect the material and feed it into an oven, so the line can be made in-line and the process automated.

[0012] Since the thermal separation tape is heated using a laser, the time required to induce a thermal reaction in the thermal separation tape is shortened, and there is less risk of the raw material being damaged by unnecessary thermal influence during this process.

[0013] By using a method that heats the thermal separation tape with a laser located on the underside of the substrate without placing it in an oven, it becomes possible to separate the chip in an inline process without the need for an operator to handle it in an oven. Brief explanation of the drawing

[0014] Figure 1 shows a flowchart of a chip separation method using a laser according to the present invention. Figure 2 shows a flowchart of a chip separation method using a laser in a roll-to-roll process of the present invention. Figure 3 shows a conceptual diagram of a chip separation device using a laser in a roll-to-roll process of the present invention. FIG. 4(a) shows a schematic diagram of a chip separation device that irradiates a laser of the present invention in a downward direction, and FIG. 4(b) shows a schematic diagram of a chip separated in a downward direction after irradiating a laser of the present invention in a downward direction. FIG. 5(a) shows a photograph of an MLCC chip, which is an embodiment of the present invention, attached to a thermal stripping tape before irradiating with a laser, FIG. 5(b) shows a photograph of the laser of the present invention being irradiated downward, and FIG. 5(c) shows a photograph of the chip falling downward after the laser of the present invention is irradiated downward. FIG. 6(a) shows a photograph of an MLCC chip attached to a thermal stripping tape before a laser is irradiated, which is another embodiment of the present invention; FIG. 6(b) shows a photograph of the chip falling downward after the laser of the present invention is irradiated downward; and FIG. 6(c) shows a photograph of the chip falling downward after the laser of the present invention is irradiated downward. FIG. 6 shows a schematic diagram of a chip separation device that irradiates the opposite side of the MLCC chip of the present invention attached to the thermal peel tape in a downward direction while scanning with a linear laser. Figure 7 shows a schematic diagram of a chip separation device using a laser and a Peltier. Specific details for implementing the invention

[0015] The present invention is susceptible to various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each drawing.

[0016] Terms such as first, second, A, B, etc., may be used to describe various components, but said components shall not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0017] For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any of a plurality of related described items.

[0018] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0019] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0020] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0022] The chip separation device using a laser in a roll-to-roll process and the chip separation method using the same according to the present invention will be described in detail below with reference to the drawings. The chip separation device using a laser in a roll-to-roll process according to the present invention refers to a chip separation system using a laser in a roll-to-roll process.

[0023] FIG. 1 shows a flowchart of a chip separation method using a laser according to the present invention. As shown in FIG. 1, the chip separation method using a laser comprises: a first step (S10) of placing a heat-removable adhesive tape (20) on a substrate (10) and mounting a bar-type MLCC chip (30) on the heat-removable adhesive tape (20); a second step (S20) of cutting the mounted bar-type MLCC chip (30) from the first step into individual MLCC chips (30) using a cutting machine; a third step (S30) of heating the individual MLCC chips (30) placed on the heat-removable adhesive tape (20) from the second step with a laser heating module (40); and a fourth step (S40) of separating the individual MLCC chips (30) after heating in the third step from the heat-removable adhesive tape (20).

[0024] FIG. 2 shows a flowchart of a chip separation method using a laser in a roll-to-roll process according to the present invention. As shown in FIG. 2, the chip separation method using a laser in a roll-to-roll process according to the present invention comprises: a first step (S10) of loading a heat-removable adhesive tape (20) onto a substrate (10) and mounting a bar-type MLCC chip (30) onto the heat-removable adhesive tape (20); a second step (S20) of cutting the mounted bar-type MLCC chip (30) from the first step into individual MLCC chips (30) using a cutting machine; and a second-1 step of loading the heat-removable adhesive tape (20) from the second step (S20) onto the lower part of a roll-to-roll process tape (11). The method includes: a third step (S30) in which a laser is irradiated from a planar or linear laser heating module (40) positioned spaced apart from the upper portion of the roll-to-roll process tape (11) of the above second-1 step, and the laser is irradiated through the roll-to-roll process tape (11) to heat the thermal peelable adhesive tape (20); and a fourth step (S40) in which individual MLCC chips (30) after heating in the third step are separated from the thermal peelable adhesive tape (20) and loaded onto a tray (60) positioned spaced apart from the lower portion of the roll-to-roll process tape (11).

[0025] FIG. 3 shows a conceptual diagram of a chip separation device using a laser in a roll-to-roll process according to the present invention. As shown in FIG. 3, in a chip separation device using a laser in a roll-to-roll process, a roll-to-roll process tape (11) is transported by a plurality of rollers (12), and a heat-removable adhesive tape (20) to which the individual MLCC chips (30) loaded on the roll-to-roll process tape (11) are attached moves. Here, the individual MLCC chips (30) are loaded facing the ground, and a laser irradiated from a laser heating module (40) passes through the roll-to-roll process tape (11) and reaches the heat-removable adhesive tape (20) to be heated.

[0026] The above roll-to-roll process tape (11) uses any one selected from polyethylene terephthalate, polyethylene naphthalate, polypropylene, and polytetrafluoroethylene. Here, the above roll-to-roll process tape (11) may preferably use polypropylene (PP). The above polypropylene is most preferable because it has excellent transparency in the UV wavelength range of a laser (high transmittance in the region of about 200 to 300 nm or more) and has few chromophores capable of absorbing UV of a laser.

[0027] FIG. 4(a) shows a schematic diagram of a chip separation device that irradiates a laser in a downward direction according to the present invention, and FIG. 4(b) shows a schematic diagram of a chip falling in a downward direction after irradiating a laser in a downward direction according to the present invention. As shown in FIG. 4(a), the chip separation device using a laser comprises: a roll-to-roll process tape (11); a heat-removable adhesive tape (20) loaded on the roll-to-roll process tape (11); an MLCC chip (30) attached to the heat-removable adhesive tape (20); and a laser heating module (40) that irradiates a planar or linear irradiation light positioned spaced apart from the upper part of the roll-to-roll process tape (11). As shown in FIG. 4(b), after irradiating a laser for a certain period of time, the adhesive force of the heat-removable adhesive tape (20) is weakened, and the MLCC chip falls downward due to the load and is separated.

[0028] FIG. 5(a) shows a photograph of an MLCC chip attached to a thermal release tape before irradiating it with a laser, which is an embodiment of the present invention; FIG. 5(b) shows a photograph of the laser of the present invention being irradiated downwards; FIG. 5(c) shows a photograph of the chip falling downwards after the laser of the present invention is irradiated downwards. In addition, FIG. 6(a) shows a photograph of an MLCC chip attached to a thermal release tape before irradiating it with a laser, which is another embodiment of the present invention; FIG. 6(b) shows a photograph of the chip falling downwards after the laser of the present invention is irradiated downwards; FIG. 6(c) shows a photograph of the chip falling downwards after the laser of the present invention is irradiated downwards. As shown in FIG. 5 and 6, the adhesive strength of the thermal release tape attached to the roll-to-roll process tape (11) is reduced to less than 1% of the initial adhesive strength by laser irradiation. The thermal energy of the laser instantaneously expands the microcapsules inside the tape, and as the capsules inside the tape fill with gas and expand tens of times, the flat adhesive surface changes into a bumpy structure, reducing the contact area with the component by more than 90%, and as the adhesive force almost disappears during this process, the MLCC falls downward on its own due to gravity.

[0029] In the first step (S10) above, the substrate (10) may be a quartz glass substrate (10) which is a high-purity silicon dioxide substrate (10). The quartz glass substrate (10) has, firstly, high heat resistance, having excellent heat resistance reaching, for example, a continuous use temperature of 1,000°C and a softening point of about 1,700°C; secondly, it has a very low coefficient of thermal expansion, so there is almost no deformation due to heat, making it excellent for forming high-precision circuit patterns; and thirdly, it has excellent optical transmittance, having a high transmittance of over 90% in a wide wavelength range from ultraviolet (UV) to infrared (IR), and has the advantage that even when a laser is irradiated from the bottom of the substrate (10) to irradiate light onto a heat-removable adhesive tape (20) located on the upper part of the substrate (10) of the present invention, the irradiated light of the laser passes through the substrate (10) without transmission loss.

[0030] The above-described heat-removable adhesive tape (20) contains fine thermally expandable microcapsules within the adhesive layer, and when a set peeling temperature is reached, these capsules expand to minimize the adhesive area, thereby significantly reducing the adhesive strength. Since the above-described heat-removable adhesive tape (20) is separated using only heat without using chemical solvents, no adhesive remains on the surface of the substrate, which can shorten the subsequent cleaning process. In addition, it maintains strong adhesive strength at room temperature, preventing parts from bouncing or sliding during high-speed dicing or polishing processes. The peeling temperature of the above-described heat-removable adhesive tape (20) can be selected according to process conditions, such as 90°C, 120°C, or 150°C, and a PET (Polyethylene Terephthalate) film with excellent heat resistance is mainly used as the base film. The adhesive strength changes with heat and exhibits strong adhesive strength in the range of about 3 N / 25 mm to 5 N / 25 mm at room temperature, but becomes about 0.1 N / 25 mm or less after heating.

[0031] In the second step (S20) above, the step of cutting the MLCC chip (30) into individual MLCC chips (30) by a cutting machine can be performed by cutting in the horizontal and vertical directions using a dicing saw equipped with a diamond blade, and a wet method or a dry method can be selected and used by spraying pure water to remove frictional heat and debris.

[0032] In the above 2-1 step (S21), the heat-removable adhesive tape of the above 2 step can be loaded onto the bottom of the roll-to-roll process tape. When multiple heat-removable adhesive tapes are attached to the roll-to-roll process tape, a continuous process becomes possible.

[0033] In the third step (S30) above, the laser heating module (40) uses a line or surface laser to heat the thermal release tape, thereby causing the adhesive force of the tape to be lost and separating the material and the tape. Here, the heating area of ​​the line or surface laser can be freely adjusted through the adjustment of the optical and mechanical systems, allowing for active response to materials of various sizes. Specifically, the process flow of the laser-based chip separation device is such that after cutting and slicing, a robot automatically transfers the material to a heating process stage, and the MLCC chip (30) and the thermal release adhesive tape (20) are separated by heating the tape with a line or surface laser to induce thermal release. The advantage of the laser-based chip separation device is that productivity can be improved by fully automating the section where worker intervention was essential in the conventional process. In addition, by selectively applying heat only to the tape through laser heating, the raw material is not affected by unnecessary heat, so an improvement in yield can be expected. Furthermore, compared to an oven-based process, peeling individual MLCC chips (30) from a thermal peelable adhesive tape (20) by a laser heating module (40) has a faster heating response speed and a shorter time until thermal peeling is completed, which can significantly increase the overall production speed.

[0034] After completing the laser irradiation by the laser heating module (40) in the third step (S30) above, if the operation of moving the roll-to-roll process tape 1 cm to 3 cm and then stopping is repeated 1 to 5 times, some MLCC chips (30) that are attached without falling off the heat-removable adhesive tape (20) can be dropped to the lower tray (60) by the recoil of the roll-to-roll process tape.

[0035] The laser heating module (40) can raise the temperature of the heat-removable adhesive tape (20) by utilizing an IR laser or a UV laser to irradiate light onto the heat-removable adhesive tape (20). More preferably, the laser heating module (40) can use an IR laser, for example, an IR laser with a wavelength of 1080 nm and an output of 100 W to 500 W. By optical design, linear or planar irradiation light can be irradiated onto the heat-removable adhesive tape (20), but preferably, planar irradiation light can be irradiated onto the heat-removable adhesive tape (20).

[0036] In the above fourth step (S40), the individualized MLCC chip (30) can also continuously perform preparation work for subsequent process input through an automated device. For example, in an automated facility for a roll-to-roll process, a method can be used to drop the MLCC chip (30), which has lost its adhesive force, onto a tray (60) by applying vibration.

[0037] Meanwhile, in the third step, a laser can be irradiated from a laser heating module to control the heating temperature of the heat-removable adhesive tape to 150°C or lower. To ensure stable drop of the MLCC, adhesive residue must be minimized. Additionally, laser parameters must be adjusted to ensure that the foaming agent expands sufficiently. Furthermore, using pulse control instead of a continuous laser operation can prevent damage to the substrate or burning of the heat-removable adhesive tape, and an infrared thermometer (IR sensor) can be used to monitor in real time whether the surface temperature of the MLCC exceeds 150°C.

[0038] Furthermore, in the third step, when the laser of the laser heating module is irradiated in a downward direction, the method may further include a step of cooling the individual MLCC chip by applying pressure from the bottom to the top direction for a certain period of time using a Peltier module. FIG. 7 shows a schematic diagram of a chip separation device using a laser and a Peltier. As shown in FIG. 7, when the MLCC chip is cooled by contacting the MLCC chip and applying pressure to one end of the MLCC chip with a certain pressure, the temperature of the entire MLCC decreases, thereby minimizing thermal deformation of the MLCC caused by the irradiation light irradiated by the laser heating module and preventing the MLCC chip from sticking together. In addition, by pressing down on the gaps between the roll-to-roll process tape and the heat-removable adhesive tape, and between the heat-removable adhesive tape and the MLCC chip, the substrate and the heat-removable adhesive tape, and the heat-removable adhesive tape and the MLCC chip are in close contact, so that the irradiation light irradiated by the laser heating module can be uniformly irradiated onto the heat-removable adhesive tape, thereby minimizing errors caused by laser irradiation and preventing the occurrence of uneven heat distribution. Furthermore, the Peltier module can be moved left and right while applying pressure to the individual MLCC chip, and by partially moving the MLCC chip on the heat-removable adhesive tape with weakened adhesive strength, it has the advantage of reducing the force required to separate the individual MLCC chip in the fourth step.

[0040] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. Explanation of the symbols

[0041] 10 substrates 20 Heat-Release Adhesive Tapes 30 MLCC chips 40 laser heating modules 50 Peltier Modules 60 trays

Claims

Claim 1 delete Claim 2 delete Claim 3 A first step of loading a heat-removable adhesive tape onto a substrate and mounting a bar-type MLCC chip onto the heat-removable adhesive tape; a second step of cutting the mounted bar-type MLCC chip from the first step into individual MLCC chips using a cutting machine; a second-1 step of separating the heat-removable adhesive tape from the second step from the substrate and loading it onto the underside of a roll-to-roll process tape selected from polyethylene terephthalate, polyethylene naphthalate, polypropylene, and polytetrafluoroethylene; and a third step of irradiating a laser from a laser heating module positioned spaced apart from the upper side of the roll-to-roll process tape from the second-1 step, which irradiates planar or linear irradiation light, so that the laser passes through the roll-to-roll process tape and is irradiated onto the heat-removable adhesive tape to heat the heat-removable adhesive tape. A method for separating chips using a laser in a roll-to-roll process, comprising: a fourth step in which the individual MLCC chips are separated by a load from the heat-removable adhesive tape heated in the third step and loaded onto a tray spaced apart from the bottom of the roll-to-roll process tape. Claim 4 A chip separation method using a laser in a roll-to-roll process according to claim 3, wherein the third step further comprises the step of cooling the individual MLCC chip while applying pressure from the bottom to the top direction for a certain period of time when the laser of the laser heating module is irradiated. Claim 5 Claim 3: A chip separation method using a laser in a roll-to-roll process in which a laser heating laser is irradiated so that the heating temperature of the heat-removable adhesive tape is controlled to 150°C or less in the third step.

Images