Composition for encapsulating organic light emitting diodes and organic light emitting diodes display comprising organic layer prepared using the same

Abstract

(A) a photocurable polyfunctional monomer; (B) a photocurable monofunctional monomer; (C) a silsesquioxane having one or two photocurable functional groups and a substituted or unsubstituted alkyl group; and (D) a photopolymerization initiator, wherein the composition comprises 20 to 70 parts by weight of (A), 10 to 60 parts by weight of (B), and 5 to 50 parts by weight of (C) out of a total of 100 parts by weight of (A), (B), (C), and (D). An organic light-emitting diode (OLED) encapsulation composition and an organic layer formed therefrom are provided.

Description

Technology Field

[0001] The present invention relates to a composition for encapsulating an organic light-emitting diode and an organic light-emitting diode display device comprising an organic layer prepared therefrom. Background Technology

[0003] If external moisture, oxygen, etc., penetrate organic light-emitting diodes, they can be easily damaged, lose functionality, and have reduced reliability. Therefore, organic light-emitting diodes must be encapsulated by an encapsulation layer comprising an organic layer and an inorganic layer formed from a composition for encapsulating organic light-emitting diodes.

[0004] The encapsulation layer may include a structure in which organic and inorganic layers are repeatedly formed. For example, in an organic light-emitting diode, the encapsulation layer is formed by the alternating and repeated formation of organic and inorganic layers, such as organic layer-inorganic layer-organic layer-inorganic layer. Unlike the organic layer, the inorganic layer may be formed from inorganic materials. Generally, the inorganic layer can be formed by plasma processes, vacuum processes, such as sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma vapor deposition, and combinations thereof.

[0005] The background technology of the present invention is described in Korean Published Patent No. 10-2016-0150255, etc. The problem to be solved

[0007] The object of the present invention is to provide a composition for encapsulating organic light-emitting diodes that provides an organic layer having a significantly low dielectric constant over a wide frequency range after curing.

[0008] Another objective of the present invention is to provide a composition for encapsulating organic light-emitting diodes with excellent inkjet processability.

[0009] Another objective of the present invention is to provide a composition for encapsulating organic light-emitting diodes with a high photocuring rate.

[0010] Another objective of the present invention is to provide a composition for encapsulating organic light-emitting diodes that provides an organic layer with excellent pencil hardness after curing. means of solving the problem

[0012] One aspect of the present invention is a composition for encapsulating organic light-emitting diodes.

[0013] A composition for encapsulating an organic light-emitting diode comprises (A) a photocurable polyfunctional monomer; (B) a photocurable monofunctional monomer; (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups; and (D) a photopolymerization initiator, wherein the composition comprises, based on 100 parts by weight of the total sum of (A), (B), (C), and (D), 20 to 70 parts by weight of (A), 10 to 60 parts by weight of (B), and 5 to 50 parts by weight of (C).

[0014] The organic light-emitting diode display device of the present invention includes an organic layer formed of the composition for encapsulating an organic light-emitting diode of the present invention. Effects of the invention

[0016] The present invention provides a composition for encapsulating organic light-emitting diodes that provides an organic layer having a significantly low dielectric constant over a wide frequency range after curing.

[0017] The present invention provides a composition for encapsulating organic light-emitting diodes with excellent inkjet processability.

[0018] The present invention provides a composition for encapsulating organic light-emitting diodes with a high photocuring rate.

[0019] The present invention provides a composition for encapsulating organic light-emitting diodes that realizes an organic layer having excellent pencil hardness after curing. Brief explanation of the drawing

[0021] FIG. 1 is a cross-sectional view of an organic light-emitting display device according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of an organic light-emitting display device of another embodiment of the present invention. Specific details for implementing the invention

[0022] The present invention is described in detail with reference to the attached drawings and embodiments so that those skilled in the art can easily implement it. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In the drawings, parts unrelated to the description have been omitted to clearly explain the present invention, and identical or similar components throughout the specification are given the same reference numerals. The lengths and sizes of each component in the drawings are for the purpose of explaining the present invention, and the present invention is not limited to the lengths and sizes of each component described in the drawings.

[0023] In this specification, “(meth)acrylic” means acrylic and / or methacrylic.

[0024] In this specification, "substituted" may mean that, unless otherwise defined, one or more hydrogen atoms of the functional groups of the present invention are substituted with a halogen (F, Cl, Br or I), a hydroxyl group, a nitro group, a cyano group, an imino group (=NH, =NR, where R is an alkyl group having 1 to 10 carbon atoms), an amino group (-NH2, -NH(R'), -N(R")(R"'), R', R", R"' are each independently an alkyl group having 1 to 10 carbon atoms), an amidino group, a hydrazine or hydrazone group, a carboxyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, a cycloalkyl group having 3 to 30 carbon atoms, a heteroaryl group having 3 to 30 carbon atoms, or a heterocycloalkyl group having 2 to 30 carbon atoms.

[0025] When describing numerical ranges in this specification, "X to Y" means X or greater and Y or less (X ≤ and ≤Y).

[0026] The composition for encapsulating an organic light-emitting diode according to one embodiment of the present invention (hereinafter also referred to as the "composition") not only forms an organic layer with a significantly low dielectric constant over a wide frequency range after curing, but also has excellent inkjet processability. In one embodiment, the frequency range may be 100 kHz to 1000 kHz.

[0027] The organic layer formed after curing of the composition of the present invention may have a dielectric constant of 2.80 or less over a wide frequency range, for example, 2.00 to 2.80 or 2.40 to 2.80. Within the above range, the performance of the organic light-emitting diode can be well realized without being affected by external static electricity or electricity.

[0028] In this specification, "excellent inkjet processability" means that when a composition is applied with an inkjet printer, the composition does not clump and has excellent spreadability, so the thickness of the final manufactured organic layer becomes uniform. If the inkjet processability is excellent, the thickness of the organic layer becomes uniform, which can improve screen quality when operating a display device.

[0029] In the present specification, if there are multiple [ ] and / or ( ) described in the chemical formulas, they may be identical or different from each other.

[0030] The composition of the present invention comprises (A) a photocurable polyfunctional monomer; (B) a photocurable monofunctional monomer; (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups; and (D) a photopolymerization initiator, wherein (A), (B), and (C) are each included in the content ranges described below. Through this, the composition of the present invention can not only realize an organic layer with a significantly low dielectric constant after curing, but also facilitate excellent inkjet processability, a high photocuring rate, and an organic layer with high pencil hardness after curing.

[0031] Hereinafter, each component of the composition of one embodiment of the present invention will be described in detail.

[0032] Photocurable polyfunctional monomer

[0033] (A) A photocurable polyfunctional monomer can be combined with (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups as described below to provide the effect of lowering the dielectric constant after curing of the composition and improving inkjet processability.

[0034] Regarding inkjet processability, (A) a photocurable polyfunctional monomer should be included in an appropriate amount relative to (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups. (A) The photocurable polyfunctional monomer may be included in an amount of 50 to 450 parts by weight, preferably 100 to 400 parts by weight, relative to 100 parts by weight of (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups. Within this range, it may help improve inkjet processability.

[0035] In one embodiment, (A) the photocurable polyfunctional monomer may be a non-aromatic monomer that does not have an aromatic group.

[0036] (A) The photocurable polyfunctional monomer may include a monomer having two or more photocurable functional groups, for example, (meth)acrylate groups, for example, 2 to 10.

[0037] (A) The photocurable polyfunctional monomer may include one or more of a non-silicon photocurable polyfunctional monomer that does not have silicon and a silicon photocurable polyfunctional monomer that has silicon. One or more of the non-silicon photocurable polyfunctional monomer and the silicon photocurable polyfunctional monomer may each be included in the composition.

[0038] The non-silicon-based photocurable polyfunctional monomer may include a di(meth)acrylate having a straight-chain or branched-chain alkylene group having 1 to 20 carbon atoms, specifically a di(meth)acrylate having 2 to 10 functional (meth)acrylates, or a tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, or hexa(meth)acrylate having 3 to 20 carbon atoms, which is substituted or unsubstituted.

[0039] For example, the di(meth)acrylate may include one or more of hexanediol di(meth)acrylate, heptanediol di(meth)acrylate, octanediol di(meth)acrylate, nonanediol di(meth)acrylate, decanediol di(meth)acrylate, undecanediol di(meth)acrylate, dodecanediol di(meth)acrylate including 1,12-dodecanediol di(meth)acrylate, tridecanediol di(meth)acrylate, and tetradecanediol di(meth)acrylate including 1,14-tetradecanediol di(meth)acrylate. Tri(meth)acrylates may include triol, tetraol, pentaol, or hexaol tri(meth)acrylates having 3 to 20 carbon atoms, including trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, etc. Tetra(meth)acrylates may include tetraol, pentaol, or hexaol tetra(meth)acrylates having 4 to 20 carbon atoms, including pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, etc. Penta(meth)acrylate may further include penta(meth)acrylates of pentaol or hexaol having 4 to 20 carbon atoms, including dipentaerythritol penta(meth)acrylate, etc. Hexa(meth)acrylate may include hexa(meth)acrylates of hexanol having 4 to 20 carbon atoms, including dipentaerythritol hexa(meth)acrylate, etc.

[0040] The silicon-based photocurable polyfunctional monomer is a silicon monomer having a siloxane group (*-Si-O-Si-*), and the photocurable functional group may be bonded to both ends of the main chain or to a side chain of the polyfunctional monomer.

[0041] In one embodiment, the silicon-based photocurable polyfunctional monomer can be represented by the following chemical formula 1:

[0042] [Chemical Formula 1]

[0043]

[0044] (In the above chemical formula 1,

[0045] R1, R2, R3, R4, and R5 are each independently hydrogen, a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted alkyl ether group having 1 to 30 carbon atoms, *-N(R')(R") (where * is the linking site of the elements, R' and R" are the same or different, and are hydrogen or a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms), a substituted or unsubstituted alkyl sulfide group having 1 to 30 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted arylalkyl group having 7 to 30 carbon atoms, and

[0046] Y1, Y2, and Y3 are each independently a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms, a substituted or unsubstituted monoalkylsilyloxy group having 1 to 10 carbon atoms, a substituted or unsubstituted dialkylsilyloxy group having 1 to 10 carbon atoms, a substituted or unsubstituted trialkylsilyloxy group having 1 to 10 carbon atoms, or the following chemical formula 2.

[0047] [Chemical Formula 2]

[0048]

[0049] (In the above chemical formula 2,

[0050] * is the connection point of the element,

[0051] R6 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms,

[0052] R7 is hydrogen or methyl group),

[0053] n is 0 to 20, m is 0 to 20, n + m is greater than 0, and

[0054] Y1 and Y2 are the above chemical formula 2 or

[0055] Y3 is the above chemical formula 2 and n is 2 to 10).

[0056] In the above Formula 1, in the substituted or unsubstituted monoalkylsilyloxy group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in one alkyl group. In the above Formula 1, in the substituted or unsubstituted dialkylsilyloxy group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in each of one alkyl group. In the above Formula 1, in the substituted or unsubstituted trialkylsilyloxy group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in each of one alkyl group.

[0057] Preferably, R1, R2, R3, R4, and R5 may each be independently a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms.

[0058] Preferably, R6 may be a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, or a substituted or unsubstituted alkylene group having 1 to 3 carbon atoms.

[0059] In the above chemical formula 1, n and m are each average values ​​or integers, and can be 0 to 10 and 0 to 5.

[0060] For example, the silicone-based photocurable polyfunctional monomer may include one or more of (meth)acryloxypropyl terminated polydimethylsiloxane (e.g., Formula 1-1), (meth)acryloxypropylmethylsiloxane dimethylsiloxane (e.g., Formula 1-2), and (meth)acrylic-modified reactive silicone fluid (e.g., Formula 1-3):

[0061] [Chemical Formula 1-1]

[0062]

[0063] (In Chemical Formula 1-1, R7 is hydrogen or a methyl group, n is 0 to 20)

[0064] [Chemical Formula 1-2]

[0065]

[0066] (In Chemical Formula 1-2, R7 is hydrogen or a methyl group, n is 2 to 10, and m is 0 to 20)

[0067] [Chemical Formula 1-3]

[0068]

[0069] (In Chemical Formula 1-3, R6 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, R7 is a hydrogen or methyl group, and m is 0 to 20)

[0070] Silicon-based photocurable polyfunctional monomers can be manufactured using commercially available products or by conventional methods known to those skilled in the art.

[0071] (A) The photocurable polyfunctional monomer is included in an amount of 20 to 70 parts by weight of the total of 100 parts by weight of (A), (B), (C), and (D). Preferably, it may be included in an amount of 30 to 60 parts by weight. Within the above range, a coating film can be formed by photocuring.

[0072] (A) The photocurable polyfunctional monomer may be contained in an amount of 95 parts by weight or more, preferably 99 to 100 parts by weight, more preferably 100 parts by weight, of the total photocurable polyfunctional monomer contained in the composition. Within this range, the effects of the present invention may be easily realized.

[0073] Photocurable monofunctional monomer

[0074] (B) Photocurable monofunctional monomers can increase the hardness of the organic layer after curing of the composition and facilitate the formation of the matrix of the organic layer.

[0075] In one embodiment, (B) the photocurable monofunctional monomer may be a non-aromatic monomer that does not have an aromatic group.

[0076] (B) The photocurable monofunctional monomer may include a monomer having one photocurable functional group, for example, a (meth)acrylate group.

[0077] (B) The photocurable monofunctional monomer may include one or more of a non-silicon-based photocurable monofunctional monomer that does not have silicon, and a silicon-based photocurable monofunctional monomer that has silicon. One or more of each of the non-silicon-based photocurable monofunctional monomer and the silicon-based photocurable monofunctional monomer may be included in the composition.

[0078] The non-silicon-based photocurable monofunctional monomer may include a mono(meth)acrylate having a substituted or unsubstituted straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms. For example, the non-silicon-based photocurable monofunctional monomer may include one or more of the following: octyl (meth)acrylate, nonyl (meth)acrylate, lauryl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, 2-decyl tetradecyl (meth)acrylate, substituted tetradecyl (meth)acrylate, and isostearyl (meth)acrylate.

[0079] Preferably, the non-silicon-based photocurable monofunctional monomer may be a mono(meth)acrylate having a substituted or unsubstituted alkyl group having 10 to 20 carbon atoms, preferably a substituted or unsubstituted alkyl group having 10 to 15 carbon atoms.

[0080] The silicon-based photocurable monofunctional monomer may be a silicon monomer having a siloxane group (*-Si-O-Si-*). In one embodiment, the silicon-based photocurable monofunctional monomer may be represented by the following chemical formula 3:

[0081] [Chemical Formula 3]

[0082]

[0083] (In the above chemical formula 3,

[0084] R 11 A single bond or a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms,

[0085] R 12 is hydrogen or a methyl group,

[0086] R 13 , R 14 , R 15 Each is independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 alkyl ether group, *-N(R')(R") (where * is the linking site of the elements, R' and R" are the same or different, hydrogen or a substituted or unsubstituted C1 to C30 alkyl group), a substituted or unsubstituted C1 to C30 alkyl sulfide group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyloxy group, a substituted or unsubstituted C1 to C10 dialkylsilyloxy group, a substituted or unsubstituted C1 to C10 trialkylsilyloxy group, a substituted or unsubstituted C1 to C10 monoalkylsilyl group, a substituted or unsubstituted C1 to C10 1 to 10 dialkylsilyl groups, substituted or unsubstituted 1 to 10 carbon trialkylsilyl groups, or the following chemical formula 4)

[0087] [Chemical Formula 4]

[0088]

[0089] (In the above chemical formula 4,

[0090] * is the connection point of the element,

[0091] R 16 , R 17 , R 18Each is independently hydrogen, a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyl group, a substituted or unsubstituted C1 to C10 dialkylsilyl group, a substituted or unsubstituted C1 to C10 trialkylsilyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyloxy group, a substituted or unsubstituted C1 to C10 dialkylsilyloxy group, or a substituted or unsubstituted C1 to C10 trialkylsilyloxy group, and

[0092] n is an integer from 1 to 20).

[0093] In the above formulas 3 and 4, in the substituted or unsubstituted monoalkylsilyloxy group or monoalkylsilyl group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in one alkyl group. In the above formulas 3 and 4, in the substituted or unsubstituted dialkylsilyloxy group or dialkylsilyl group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in each of one alkyl group. In the above formulas 3 and 4, in the substituted or unsubstituted trialkylsilyloxy group or trialkylsilyl group having 1 to 10 carbon atoms, 1 to 10 carbon atoms refers to the number of carbon atoms contained in each of one alkyl group.

[0094] Preferably, R 11 It may be a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms.

[0095] Preferably, R 13 , R 14 , R 15 Each is independently a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms or the above formula 4, and in the above formula 4, R 16 , R 17 , R 18 Each can be an independently substituted or unsubstituted alkyl group having 1 to 5 carbon atoms.

[0096] For example, the silicone-based photocurable monofunctional monomer may include one or more of mono(meth)acryloxypropyl terminated polydimethylsiloxane (e.g., Formula 3-1 below), 3-(meth)acryloxy)propyltris(trimethylsiloxy)silane (e.g., Formula 3-2 below), (3-(meth)acryloxypropyl)tris(pentamethyldisiloxy)silane (e.g., Formula 3-3 below), and (meth)acryloxypropyl T-structure siloxane (e.g., Formula 3-4 below):

[0097] [Chemical Formula 3-1]

[0098]

[0099] [Chemical Formula 3-2]

[0100]

[0101] [Chemical Formula 3-3]

[0102]

[0103] [Chemical Formula 3-4]

[0104]

[0105] (In the above chemical formulas 3-1 to 3-4, R 12 , n is the same as defined in Chemical Formulas 3 and 4 above).

[0106] Photocurable monofunctional monomers can be produced using commercially available products or by conventional methods known to those skilled in the art.

[0107] The photocurable monofunctional monomer is included in an amount of 10 to 60 parts by weight of the total of 100 parts by weight of (A), (B), (C), and (D). Preferably, it may be included in an amount of 20 to 50 parts by weight. Within the above range, a low dielectric constant effect may be achieved.

[0108] (C) Silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups

[0109] (C) Silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups can form an organic layer with a significantly low dielectric constant over a wide frequency range after curing. The present invention lowers the dielectric constant of an organic layer by including silsesquioxane in a composition, and uses a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkylene groups as the silsesquioxane, and also improves inkjet processability while lowering the dielectric constant of the organic layer by using a photocurable polyfunctional monomer together.

[0110] Silsesquioxane has a photocurable functional group, for example, a (meth)acrylate group, and the photocurable functional group may be directly bonded to silicon in the silsesquioxane or bonded through a linker, for example, a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms. The alkyl group in the silsesquioxane may be a substituted or unsubstituted straight-chain or branched-chain alkyl group having 3 to 10 carbon atoms, and may be directly bonded to silicon in the silsesquioxane.

[0111] In one embodiment, one or two of the silicon constituting the silsesquioxane may have a photocurable functional group attached, and the remaining silicon may have a substituted or unsubstituted alkyl group attached.

[0112] In one embodiment, the silsesquioxane may be a non-aromatic silsesquioxane that does not have an aromatic group.

[0113] In one embodiment, silsesquioxane can be represented by the following chemical formula 5:

[0114] [Chemical Formula 5]

[0115] [R 1 SiO 3 / 2 ] n [R 2 SiO 3 / 2 ] m

[0116] (In the above chemical formula 5,

[0117] R2 is a substituted or unsubstituted, straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms,

[0118] R 1 is the following chemical formula 6, and

[0119] [Chemical Formula 6]

[0120]

[0121] (In the above chemical formula 6,

[0122] * is the bonding site for silicone,

[0123] R 3 A substituted or unsubstituted alkylene group having 1 to 10 carbon atoms,

[0124] R 4 is hydrogen or a methyl group,

[0125] n is 1 or 2, m is greater than 0 and less than or equal to 10).

[0126] Preferably, R 2 may be a substituted or unsubstituted, straight-chain or branched-chain alkyl group having 4 to 20 carbon atoms. For example, R 2 It can be one or more of isobutyl group, neopentyl, isooctyl group, 2,4,4-trimethylpentyl group, dodecyl, octadecyl, and isooctadecyl.

[0127] Preferably, R 3 It may be a substituted or unsubstituted alkylene group having 1 to 6 carbon atoms, or a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms.

[0128] Silsesquioxane may have a partial cage structure, a ladder structure, or a random structure, but preferably, a polyhedral oligomeric silsesquioxane (POSS) structure of Formula 7 below may be preferred:

[0129] [Chemical Formula 7]

[0130]

[0131] (In the above chemical formula 7,

[0132] One or two of R are R 1 ,

[0133] 6 to 7 of R are R 2 ,

[0134] R 1 , R 2 Each is the same as defined in Chemical Formula 5 above).

[0135] For example, silsesquioxane may include one or more of the following chemical formulas 7-1 and 7-2:

[0136] [Chemical Formula 7-1]

[0137]

[0138] (In the above chemical formula 7-1,

[0139] R 11 One or two of them or (R 4 is hydrogen or methyl group),

[0140] R 11 Six to seven of them are )

[0141] [Chemical Formula 7-2]

[0142]

[0143] (In the above chemical formula 7-2,

[0144] R 13 One or two of them or (R 4 is hydrogen or methyl group),

[0145] R 13 Six or eight of them are )

[0146] Silsesquioxane can be produced from commercially available products or by ordinary methods known to those skilled in the art.

[0147] Silsesquioxane having one or two photocurable functional groups and substituted or unsubstituted alkyl groups is included in an amount of 5 to 50 parts by weight of the total of 100 parts by weight of (A), (B), (C), and (D). Preferably, it may be included in an amount of 10 to 35 parts by weight. Within the above range, there may be an effect of lowering the dielectric constant.

[0148] The total sum of (A), (B), and (C) in the above composition may be 90 parts by weight or more, preferably 90 to 99 parts by weight. Within this range, the effects of the present invention may be easily realized.

[0149] (B) The total of the photocurable monofunctional monomer and (C) the silsesquioxane having one photocurable functional group and one or more substituted or unsubstituted alkyl groups may be contained in an amount of at least 95 parts by weight, preferably 99 parts by weight to 100 parts by weight, more preferably 100 parts by weight, of the total photocurable monofunctional monomer contained in the composition. Within this range, the effects of the present invention may be easily realized.

[0150] (D) Photopolymerization initiator

[0151] The photopolymerization initiator may include, without limitation, conventional photopolymerization initiators capable of carrying out a photocurable reaction. For example, the photopolymerization initiator may include triazine-based, acetophenone-based, benzophenone-based, thioxantone-based, benzoin-based, phosphorus-based, oxime-based, or mixtures thereof.

[0152] Preferably, the photopolymerization initiator may include a phosphorus-based initiator having a maximum absorption wavelength of 360 nm to 400 nm. When using the phosphorus-based initiator, the composition of the present invention may exhibit better initiation performance at long-wavelength UV (e.g., 300 nm to 400 nm). The phosphorus-based initiator may be diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide, 2,4,6-trimethylbenzoyl diphenylphosphinate, or a mixture thereof. For example, the initiator may be included alone or as a mixture of two or more types. The "maximum absorption wavelength" may be a value obtained by measuring by conventional methods known to those skilled in the art or by referring to a product catalog.

[0153] The photopolymerization initiator may be included in an amount of 1 to 10 parts by weight, preferably 1 to 5 parts by weight, of the total 100 parts by weight of (A), (B), (C), and (D). Within this range, the photocuring rate of the composition is increased, and a residual amount of initiator can be prevented from remaining and lowering the light transmittance.

[0154] The composition of the present invention can be formed by mixing (A), (B), (C), and (D). For example, the composition of the present invention can be formed as a solvent-free type that does not contain a solvent.

[0155] The composition of the present invention is a photocurable composition, with a UV wavelength of 10 mW / cm² 2 Up to 500 mW / cm 2 A bag layer can be formed by photocuring by irradiation for 1 to 50 seconds.

[0156] The composition of the present invention may further include conventional additives known to those skilled in the art. Such additives may include, but are not limited to, heat stabilizers, antioxidants, UV absorbers, etc.

[0157] The composition of the present invention may have a viscosity of 7 cps to 100 cps, preferably 7 cps to 60 cps, more preferably 7 cps to 50 cps at 25 ± 2°C (23°C to 27°C). In the above range, the ink jetting properties of the encapsulation composition may be excellent.

[0158] The composition of the present invention may have a photocurable rate of 90% to 100%, preferably 91% to 99%, and more preferably 91% to 93%. Within this range, it may function as an organic layer. The photocurable rate can be calculated from the following Formula 2.

[0159] The pencil hardness of the organic layer formed after photocuring the composition of the present invention can be 4B or higher, for example, 4B to B.

[0160] The composition of the present invention can be used to encapsulate an organic light-emitting diode. Specifically, the composition can form an organic layer in an encapsulation structure in which an inorganic layer and an organic layer are formed sequentially.

[0161] The composition of the present invention may also be used for encapsulating device components, particularly display device components, which may decompose or become defective due to the permeation of gases or liquids in the surrounding environment, such as oxygen and / or moisture and / or water vapor in the atmosphere, and chemicals used during processing into electronic products. For example, the device components may be, but are not limited to, lighting devices, metal sensor pads, microdisk lasers, electrochromic devices, photochromic devices, microelectromechanical systems, solar cells, integrated circuits, charge coupling devices, light-emitting polymers, etc.

[0162] The organic light-emitting diode display device of the present invention may include an organic layer formed from the composition for encapsulating an organic light-emitting diode according to one embodiment of the present invention. Specifically, the organic light-emitting diode display device includes an organic light-emitting diode and a barrier stack formed on the organic light-emitting diode and comprising an inorganic layer and an organic layer, and the organic layer may be formed from the composition for encapsulating an organic light-emitting diode according to an embodiment of the present invention. As a result, the reliability of the organic light-emitting diode display device may be improved.

[0163] Hereinafter, an organic light-emitting diode display device according to one embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view of an organic light-emitting diode display device according to one embodiment of the present invention.

[0164] Referring to FIG. 1, an organic light-emitting diode display device (100) comprises a substrate (10), an organic light-emitting diode (20) formed on the substrate (10), and a barrier stack (30) formed on the organic light-emitting diode (20) and including an inorganic layer (31) and an organic layer (32), wherein the inorganic layer (31) is in contact with the organic light-emitting diode (20), and the organic layer (32) can be formed from an organic light-emitting diode encapsulation composition of an embodiment of the present invention.

[0165] The substrate (10) is not particularly limited as long as it is a substrate on which an organic light-emitting diode can be formed. For example, it may be made of a material such as transparent glass, a plastic sheet, silicon, or a metal substrate.

[0166] The organic light-emitting element (20) is typically used in organic light-emitting element display devices and, although not shown in FIG. 1, includes a first electrode, a second electrode, and an organic light-emitting film formed between the first electrode and the second electrode. The organic light-emitting film may be formed by sequentially stacking a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, but is not limited thereto.

[0167] The barrier stack (30) includes an organic layer and an inorganic layer, and the organic layer and the inorganic layer each have different components constituting the layer, so they can each implement an organic light-emitting diode encapsulation function.

[0168] The inorganic layer can complement the effect of the organic layer by having a different composition from the organic layer. For example, the inorganic layer may be a metal, a nonmetal, an intermetallic compound or alloy, an intermetallic compound or alloy, an oxide of a metal or nonmetal, a fluoride of a metal or nonmetal, a nitride of a metal or nonmetal, a carbide of a metal or nonmetal, an oxynitride of a metal or nonmetal, a boride of a metal or nonmetal, an oxyboride of a metal or nonmetal, a silicide of a metal or nonmetal, or a mixture thereof. The metal or nonmetal may be silicon (Si), aluminum (Al), selenium (Se), zinc (Zn), antimony (Sb), indium (In), germanium (Ge), tin (Sn), bismuth (Bi), transition metals, lanthanide metals, etc., but is not limited thereto. Specifically, the inorganic layer can be silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), ZnSe, ZnO, Sb2O3, Al2O3, In2O3, SnO2, etc.

[0169] The inorganic layer can be deposited by plasma processes, vacuum processes, for example, sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma vapor deposition, and combinations thereof.

[0170] When organic layers are deposited alternately with inorganic layers, the smoothing characteristics of the inorganic layer can be secured, and defects in the inorganic layer can be prevented from propagating to another inorganic layer.

[0171] The organic layer can be formed by a combination of coating, deposition, curing, etc., of the composition for encapsulating an organic light-emitting diode according to an embodiment of the present invention. For example, the composition for encapsulating an organic light-emitting diode is coated to a thickness of 1 μm to 50 μm, and 10 mW / cm² 2 Up to 500 mW / cm 2 It can be cured by irradiating for 1 to 50 seconds.

[0172] The barrier stack includes organic layers and inorganic layers, but the total number of organic layers and inorganic layers is not limited. The total number of organic layers and inorganic layers may be changed according to the level of resistance to permeation of oxygen and / or moisture and / or water vapor and / or chemicals. For example, the total number of organic layers and inorganic layers may be 10 layers or less, for example, 2 to 7 layers, and specifically, may be formed in the order of inorganic layer / organic layer / inorganic layer / organic layer / inorganic layer / organic layer / inorganic layer.

[0173] In a barrier stack, organic and inorganic layers can be deposited alternately. This is due to the effect on the organic layer generated by the physical properties of the aforementioned composition. Consequently, the organic and inorganic layers can complement or enhance the encapsulation effect on the device.

[0174] Hereinafter, an organic light-emitting diode display device of another embodiment of the present invention will be described with reference to FIG. 2. FIG. 2 is a cross-sectional view of an organic light-emitting diode display device of another embodiment of the present invention.

[0175] Referring to FIG. 2, an organic light-emitting diode display device (200) comprises a substrate (10), an organic light-emitting diode (20) formed on the substrate (10), and a barrier stack (30) formed on the organic light-emitting diode (20) and including an inorganic layer (31) and an organic layer (32). The inorganic layer (31) encapsulates an internal space (40) in which the organic light-emitting diode (20) is contained, and the organic layer (32) may be formed from an organic light-emitting diode encapsulation composition of an embodiment of the present invention. It is substantially identical to an organic light-emitting diode display device of an embodiment of the present invention, except that the inorganic layer does not come into contact with the organic light-emitting diode.

[0177] Hereinafter, the structure and operation of the present invention will be explained in more detail through preferred embodiments of the present invention. However, these are presented as preferred examples of the present invention and should not be interpreted in any way as limiting the present invention.

[0179] The specific specifications of the components used in the examples and comparative examples are as follows.

[0180] (A) Photocurable polyfunctional monomer

[0181] (A1)1,14-Tetradecanediol Dimethacrylate (Aldrich)

[0182] (A2) Methacryloxypropyl terminated polydimethylsiloxane (DMS-R11, Gelest)

[0183]

[0184] (A3)1,3-bis(3-methacryloxypropyl)tetramethyldisiloxane (Gelest)

[0185]

[0186] (A4)1,12-Dodecanediol Dimethacrylate (Aldrich)

[0187] (A5)RMS-083((Methacryloxypropyl)Methylsiloxane-Dimethylsiloxane Copolymer, Gelest, n is 2 or more)

[0188]

[0189] (A6)X-22-2445 (Acrylic-Modified Reactive Silicone Fluids, Shin-Etsu)

[0190]

[0191] (B) Photocurable monofunctional monomer

[0192] (B1) 2-decyl-1-tetradecyl acrylate

[0193] (B2) Lauryl acrylate

[0194] (B3) Monomethacryloxypropyl terminated polydimethylsiloxane (MCR-M07, Gelest)

[0195]

[0196] (B4)3-(methacryloyloxy)propyltris(trimethylsiloxy)silane

[0197]

[0198] (B5)(3-methacryloxypropyl)tris(pentamethyldisyloxy)silane

[0199]

[0200] (B6) Methacryloxypropyl T-structure siloxane (RTT-1011, Gelest)

[0201]

[0202] (C) Silsesquioxane

[0203] (C1)MA0719

[0204]

[0205] (R 11 silver , R 12 Is )

[0206] (C2)MAC-SQ SI-20

[0207]

[0208] (R 11 silver , R 13 Is )

[0209] (C3)MA0718

[0210]

[0211] (R 11 silver , R 12 Is )

[0212] (C4)MAC-SQ-TM-100

[0213]

[0214] (R is )

[0215] (D) Photopolymerization initiator: Phosphorus-based initiator (Irgacure TPO)

[0217] Example 1

[0218] 55 parts by weight of (A1), 22 parts by weight of (B1), 20 parts by weight of (C1), and 3 parts by weight of (D) were placed in a 125ml brown polypropylene bottle and mixed at room temperature for 3 hours using a shaker to prepare a composition for packaging.

[0220] Examples 2 to 10 and Comparative Examples 1 to 3

[0221] A packaging composition was prepared in the same manner as in Example 1, except that the content of each component in Example 1 was changed as shown in Table 1 below (unit: parts by weight). In Table 1 below, "-" indicates that the corresponding component is not contained.

[0223] The following physical properties were measured for the organic light-emitting diode encapsulation compositions prepared in the examples and comparative examples, and the results are shown in Table 1.

[0224] (1) Dielectric constant (unit: none): The encapsulation composition of the example and comparative example is applied to a chrome (Cr) plate to a predetermined thickness and 100 mW / cm² 2 A coating film with a thickness of 8 μm was formed by photocuring through UV irradiation for 10 seconds. After depositing an aluminum electrode (electrode for measuring dielectric constant) on the coating film, the dielectric constant was measured using an impedance analyzer (E4990A) at a frequency of 100 kHz to 1000 kHz and a temperature of 25 ℃, and the measurement result at 200 kHz was posted.

[0225] (2) Viscosity (unit: cps): The viscosity of the packaging compositions of the examples and comparative examples was measured at 24.8°C using a viscometer LV DV-II Pro (Brookfield) with spindle number 40.

[0226] (3) Inkjet processability (Unit: None): 500g of the composition of the example and comparative example was dropped using an inkjet printer (OMNIJET 300, Konica Minolta KM1024i head, Unijet). The inkjet printer head temperature was set to 25℃. The occurrence of dropping and the possibility of jetting during dropping were evaluated. ○ was evaluated if the shape of the drop during dropping allowed for uniform inkjetting and the dropped drop spread by more than 120% without problems, and x was evaluated if the shape of the drop during dropping was non-uniform, inkjetting was impossible, or the dropped drop did not spread by more than 120%.

[0227] (4) Photocuring rate (Unit: %): For the compositions of the examples and comparative examples, 1635 cm² was measured using FT-IR (NICOLET 4700, Thermo). -1 Nearby (C=C), 1720cm -1 The intensity of the absorption peak near (C=O) is measured. The encapsulation composition is sprayed onto a glass substrate and 100 mW / cm² 2 UV curing is performed by irradiation for 20 seconds to obtain a specimen measuring 20 cm x 20 cm x 3 µm (width x height x thickness). The cured film is taken, and 1635 cm is measured using FT-IR (NICOLET 4700, Thermo). -1 Nearby (C=C), 1720cm -1 The intensity of the absorption peak in the vicinity (C=O) is measured. The photocuring rate is calculated according to Equation 1 below.

[0228] [Equation 1]

[0229] Photocuring rate (%) = |1 - (A / B)| x 100

[0230] (In Equation 1 above, A is 1720 cm for the cured film -1 1635 cm⁻¹ for the intensity of the absorption peak near -1 It is the ratio of the intensities of absorption peaks in the vicinity, and

[0231] B is 1720 cm for the packaging composition -1 1635 cm⁻¹ for the intensity of the absorption peak near -1 It is the ratio of the intensities of the absorption peaks in the vicinity).

[0232] (5) Pencil hardness: The encapsulation compositions of the examples and comparative examples were coated on a glass substrate and 100 mW / cm² 2 UV curing was performed by UV irradiating for 10 seconds to obtain an organic layer specimen with a thickness of 8 μm. Pencil hardness was measured on the organic layer specimen. For the pencil hardness measurement, an electric pencil hardness tester (Lab-Q D300A) and Mitsubishi pencils ranging from 6B to 9H were used. The pencil load on the specimen was set to 200g, the drawing angle to 45°, and the drawing speed to 48 mm / min. If a scratch occurred at least once during five evaluations, the measurement was performed using a pencil of a lower hardness level, and the maximum pencil hardness value was obtained when no scratches occurred in all five evaluations.

[0233] Examples Comparative example 1 2 3 4 5 6 7 8 9 10 1 2 3 4 A A1 55 - - 50 55 - - - - - - 55 - - A2 - 54 - - - 53 - 39 38 - - - - 10 A3 - - 40 - - - - - - - - - - - A4 - - - - - - - - - - 62 - - - A5 - - - - - - - - - 48 - - - - A6 - - - - - - 51 - - - - - - - B B1 22 - - - 22 - - - - - 35 22 - 67 B2 - - - 22 - - - - - - - - 77 - B3 - 29 - - - - 24 - - 29 - - - - B4 - - - - - 24 - 29 - - - - - - B5 - - 40 - - - - - - - - - - - B6 - - - - - - - - 25 - - - - - C C1 20 14 17 25 - 20 - 29 34 - - - - 20 C2 - - - - - - 22 - - 20 - - - - C3 - - - - 20 - - - - - - - - - C4 - - - - - - - - - - - 20 20 - D 3 3 3 3 3 3 3 3 3 3 3 3 3 3 permittivity 2.58 2.49 2.45 2.53 2.68 2.48 2.45 2.50 2.80 2.60 3.05 2.95 - 2.57 viscosity 19.2 17.6 18.2 22.6 21.2 20.1 18.2 22.6 17.2 21.1 19.8 26.8 17.5 16.5 Inkjet processability ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ × × ○ Photocuring rate 92.4 93.5 92.2 93.6 92.1 93.4 91.2 92.6 91.2 90.8 93.6 91.2 Uncured 75.8 Pencil hardness 3B 3B 4B 3B 3B 3B 4B 3B B B B 2B - 6B

[0235] As shown in Table 1 above, the composition for encapsulating organic light-emitting diodes according to the present invention provides an organic layer having a significantly low dielectric constant over a wide frequency range after curing, excellent inkjet processability, a high photocuring rate, and excellent pencil hardness after curing.

[0237] Simple variations or modifications of the present invention can be easily implemented by those skilled in the art, and all such variations or modifications are considered to be included within the scope of the present invention.

Claims

Claim 1 A composition for encapsulating an organic light-emitting diode comprising: (A) a photocurable polyfunctional monomer; (B) a photocurable monofunctional monomer; (C) a silsesquioxane having one or two photocurable functional groups and one or more substituted or unsubstituted alkyl groups; and (D) a photopolymerization initiator, wherein the composition has a dielectric constant of the organic layer formed after curing of 2.80 or less, and wherein, in 100 parts by weight of the total sum of (A), (B), (C), and (D), the composition comprises 30 to 60 parts by weight of (A), 20 to 50 parts by weight of (B), and 10 to 35 parts by weight of (C). Claim 2 A composition for encapsulating an organic light-emitting diode according to claim 1, wherein (C) is represented by the following chemical formula 5: [Chemical Formula 5][R 1 SiO 3 / 2 ] n [R 2 SiO 3 / 2 ] m (In the above chemical formula 5, R 2 is a substituted or unsubstituted, straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms, R 1 is the following chemical formula 6, and [Chemical Formula 6] (In the above chemical formula 6, * is the binding site for silicon, R 3 Silver is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, R 4 is a hydrogen or methyl group, n is 1 or 2, m is greater than 0 and less than or equal to 10). Claim 3 In claim 2, the composition for encapsulating an organic light-emitting diode, wherein (C) has a POSS (polyhedral oligomeric silsesquioxane) structure of the following chemical formula 7: [Chemical Formula 7] (In the above chemical formula 7, one or two of R are R 1 ,6 to 7 of R are R 2 , R 1 , R 2 Each is the same as defined in Chemical Formula 5 above). Claim 4 In paragraph 2, R in the above chemical formula 5 2 A composition for encapsulating organic light-emitting diodes, comprising one or more of isobutyl, neopentyl, isooctyl, 2,4,4-trimethylpentyl, dodecyl, octadecyl, and isooctadecyl. Claim 5 A composition for encapsulating an organic light-emitting diode according to claim 1, wherein (A) is included in an amount of 100 to 450 parts by weight per 100 parts by weight of (C). Claim 6 A composition for encapsulating an organic light-emitting diode according to claim 1, wherein (A) comprises one or more of a non-silicon-based photocurable polyfunctional monomer and a silicon-based photocurable polyfunctional monomer. Claim 7 A composition for encapsulating an organic light-emitting diode according to claim 6, wherein the non-silicon-based photocurable polyfunctional monomer comprises one or more types of (meth)acrylates having 2 to 10 functionalities. Claim 8 In claim 6, the composition for encapsulating an organic light-emitting diode is represented by the following chemical formula 1, wherein the silicon-based photocurable polyfunctional monomer is: [Chemical Formula 1] (In the above Chemical Formula 1, R1, R2, R3, R4, and R5 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 alkyl ether group, *-N(R')(R") (where * is the connecting part of the elements, R' and R" are the same or different, hydrogen or a substituted or unsubstituted C1 to C30 alkyl group), a substituted or unsubstituted C1 to C30 alkyl sulfide group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C7 to C30 arylalkyl group, and Y1, Y2, and Y3 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyloxy group, a substituted or unsubstituted C1 to C10 A dialkylsilyloxy group, a substituted or unsubstituted trialkylsilyloxy group having 1 to 10 carbon atoms, or the following chemical formula 2, [Chemical Formula 2] (In the above chemical formula 2, * is the linking site of the element, R6 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, R7 is hydrogen or methyl group), n is 0 to 20, m is 0 to 20, n + m is greater than 0, Y1, Y2 is the above chemical formula 2 or, Y3 is the above chemical formula 2 and n is 2 to 10). Claim 9 A composition for encapsulating an organic light-emitting diode according to claim 8, wherein the silicon-based photocurable polyfunctional monomer comprises one or more of the following chemical formulas 1-1, 1-2, and 1-3: [Chemical Formula 1-1] (In Chemical Formula 1-1, R7 is a hydrogen or methyl group, n is 0 to 20)[Chemical Formula 1-2] (In Chemical Formula 1-2, R7 is hydrogen or a methyl group, n is 2 to 10, m is 0 to 20)[Chemical Formula 1-3] (In Chemical Formula 1-3, R6 is a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, R7 is a hydrogen or methyl group, and m is 0 to 20). Claim 10 A composition for encapsulating an organic light-emitting diode according to claim 1, wherein (B) comprises one or more of a non-silicon-based photocurable monofunctional monomer and a silicon-based photocurable monofunctional monomer. Claim 11 A composition for encapsulating an organic light-emitting diode according to claim 10, wherein the non-silicon-based photocurable monofunctional monomer comprises a mono(meth)acrylate having a substituted or unsubstituted straight-chain or branched-chain alkyl group having 1 to 20 carbon atoms. Claim 12 In claim 10, the above silicon-based photocurable monofunctional monomer is represented by the following chemical formula 3, a composition for encapsulating an organic light-emitting diode: [Chemical Formula 3] (In the above chemical formula 3, R 11 γ is a single bond or a substituted or unsubstituted alkylene group having 1 to 10 carbon atoms, R 12 is hydrogen or a methyl group, R 13 , R 14 , R 15 Each is independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C1 to C30 alkyl ether group, *-N(R')(R") (where * is the linking site of the elements, R' and R" are the same or different, hydrogen or a substituted or unsubstituted C1 to C30 alkyl group), a substituted or unsubstituted C1 to C30 alkyl sulfide group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyloxy group, a substituted or unsubstituted C1 to C10 dialkylsilyloxy group, a substituted or unsubstituted C1 to C10 trialkylsilyloxy group, a substituted or unsubstituted C1 to C10 monoalkylsilyl group, a substituted or unsubstituted C1 to C10 1 to 10 dialkylsilyl groups, substituted or unsubstituted 1 to 10 C-valence trialkylsilyl groups, or the following Chemical Formula 4)[Chemical Formula 4] (In the above chemical formula 4, * is the connecting site of the element, R 16 , R 17 , R 18 Each is independently hydrogen, a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyl group, a substituted or unsubstituted C1 to C10 dialkylsilyl group, a substituted or unsubstituted C1 to C10 trialkylsilyl group, a substituted or unsubstituted C1 to C10 monoalkylsilyloxy group, a substituted or unsubstituted C1 to C10 dialkylsilyloxy group, or a substituted or unsubstituted C1 to C10 trialkylsilyloxy group, where n is an integer from 1 to 20). Claim 13 In claim 12, the composition for encapsulating an organic light-emitting diode comprises one or more of the following chemical formulas 3-1 to 3-4, wherein the silicon-based photocurable monofunctional monomer comprises: [Chemical Formula 3-1] [Chemical Formula 3-2] [Chemical Formula 3-3] [Chemical Formula 3-4] (In the above chemical formulas 3-1 to 3-4, R 12 , n is the same as defined in Chemical Formulas 3 and 4 above). Claim 14 A composition for encapsulating an organic light-emitting diode according to claim 1, wherein, among 100 parts by weight of the total sum of (A), (B), (C), and (D), (D) is 1 to 5 parts by weight of (D). Claim 15 An organic light-emitting diode display device comprising an organic layer formed of an organic light-emitting diode encapsulation composition according to any one of claims 1 to 14.

Images