Printed circuit board assembly including spacer with self-alignment and electronic device comprising the same

Abstract

In one embodiment, a printed circuit board assembly comprises a first printed circuit board including a first pad having a first recessed groove formed with a side that is inclinedly recessed, a second printed circuit board including a second pad and laminated to the first printed circuit board such that the second pad faces the first pad, a spacer positioned between the first pad and the second pad, and solder applied on the first pad or the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer may include a main body and a first protruding body that protrudes with a side that is inclinedly protruded from one side of the main body and inserted into the first recessed groove. Various other embodiments are possible.

Description

Technology Field

[0001] Various embodiments of this document relate to a printed circuit board assembly including a spacer having a self-alignment function and an electronic device including the same. Background Technology

[0002] The electronic device may include at least one printed circuit board disposed in an internal space. A plurality of printed circuit boards disposed in the internal space of the electronic device may be arranged in a stacked manner to secure efficient placement space. The problem to be solved

[0003] A printed circuit board assembly can be formed by stacking multiple printed circuit boards. The multiple printed circuit boards can generally be electrically connected to each other by solder applied to pads formed on each printed circuit board. Meanwhile, a thermal interface material (TIM) for heat dissipation may be applied inside the printed circuit board assembly. Since this TIM has its own volume, a slight gap may occur between two printed circuit boards that are stacked together. To prevent bonding defects between the pads and solder of the printed circuit boards caused by this gap, a process of applying pressure to the stacked printed circuit boards may be applied. However, during the process of applying pressure to the stacked printed circuit boards, the alignment between the two printed circuit boards may become misaligned. If the alignment between the two printed circuit boards becomes misaligned, a bridge may occur where the solder applied to adjacent pads connects to each other.

[0004] According to various embodiments, a printed circuit board assembly capable of maintaining a constant height between two printed circuit boards stacked together and an electronic device including the same can be provided.

[0005] According to various embodiments, a printed circuit board assembly and an electronic device including the same can be provided, wherein the relative positions of two printed circuit boards can be aligned during the process of pressing two printed circuit boards stacked together. means of solving the problem

[0006] In one embodiment, the printed circuit board assembly (300) comprises a first printed circuit board (310) including a first pad (311) having a first recessed groove (312) formed so that the side (3121) is inclinedly recessed, a second printed circuit board (320) including a second pad (321) and the second pad (321) being laminated on the first printed circuit board (310) so that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other, and the spacer (330) includes a main body (331) and a side (3321) inclined from one side of the main body (331). It may include a first protruding body (332) that protrudes and is inserted into the first recessed groove (312).

[0007] In one embodiment, the printed circuit board assembly (300) comprises a first printed circuit board (310) having a first recessed groove (312) formed on a side (3121) that is inclinedly recessed, a second printed circuit board (320) having a second recessed groove (322) formed on a side (3221) that is inclinedly recessed, and the second printed circuit board (320) which is laminated to the first printed circuit board (310) such that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and a solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other, and the spacer (330) is a main It may include a body (331), a first protruding body (332) that protrudes from one side of the main body (331) in a shape corresponding to the first recessed groove (312) and is inserted into the first recessed groove (312), and a second protruding body (333) that protrudes from the other side of the main body (331) in a shape corresponding to the second recessed groove (322) and is inserted into the second recessed groove (322).

[0008] In one embodiment, the electronic device (101) includes at least one printed circuit board assembly (300) disposed inside the electronic device (101), and the printed circuit board assembly (300) includes a first printed circuit board (310) having a first recessed groove (312) formed such that the side (3121) is inclinedly recessed, a second printed circuit board (320) which includes a second pad (321) and is laminated on the first printed circuit board (310) such that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and a solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other. A spacer (330) may include a main body (331) and a first protruding body (332) that has a side (3321) protruding obliquely from one side of the main body (331) and is inserted into the first recessed groove (312). In one embodiment, a printed circuit board assembly includes a first printed circuit board having a first recessed groove formed with a side that is obliquely recessed; a second printed circuit board having a second pad and a second printed circuit board laminated on the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and solder positioned on the first pad and the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer comprises a main body; and includes a first protruding body that protrudes obliquely from one side of the main body and is received in the first recessed groove, and the solder can be positioned to surround the spacer between the first pad and the second pad.In one embodiment, a printed circuit board assembly comprises: a first printed circuit board including a first pad having a first recessed groove formed with a side that is inclinedly recessed; a second printed circuit board including a second pad having a second recessed groove formed with a side that is inclinedly recessed, and the second pad being laminated to the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and a solder positioned on the first pad and the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer comprises a main body; a first protruding body protruding from one side of the main body in a shape corresponding to the first recessed groove and being received in the first recessed groove; and a second protruding body protruding from the other side of the main body in a shape corresponding to the second recessed groove and being received in the second recessed groove. The solder may be positioned to surround the spacer between the first pad and the second pad. In one embodiment, the electronic device comprises at least one printed circuit board assembly disposed inside the electronic device, and the printed circuit board assembly comprises: a first printed circuit board comprising a first pad having a first recessed groove formed with a side that is inclinedly recessed; a second printed circuit board comprising a second pad, wherein the second pad is laminated to the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and a solder positioned on the first pad and the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer comprises a main body; and a first protruding body that protrudes from one side of the main body with a side that is inclinedly protruded and received in the first recessed groove, and the solder may be positioned to surround the spacer between the first pad and the second pad. Effects of the invention

[0009] According to various embodiments, a spacer is placed between two printed circuit boards stacked on top of each other, thereby maintaining a constant height between the two printed circuit boards.

[0010] According to various embodiments, the spacer and the pad are formed to have interlocking inclined surfaces, so that the relative positions of the two printed circuit boards can be aligned during the process of pressing the two printed circuit boards stacked together.

[0011] According to various embodiments, the bonding strength of the solder at the pad where the spacer is located can be improved. Brief explanation of the drawing

[0012] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. FIG. 2a is a schematic cross-sectional view of a printed circuit board assembly according to a comparative example. FIG. 2b is a schematic cross-sectional view illustrating the state in which a bridge occurs in a printed circuit board assembly according to a comparative example. FIG. 3a is a schematic cross-sectional view of a printed circuit board assembly according to one embodiment. FIG. 3b is a perspective view of a spacer according to one embodiment. FIG. 3c is a schematic cross-sectional view illustrating a misaligned state of a printed circuit board assembly according to one embodiment. FIG. 3d is a schematic cross-sectional view illustrating the self-alignment completed state of a printed circuit board assembly according to one embodiment. FIG. 3e is a schematic cross-sectional view of a first printed circuit board and a second printed circuit board according to one embodiment. Specific details for implementing the invention

[0013] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are given the same reference numeral regardless of the drawing number, and redundant descriptions thereof will be omitted.

[0015] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0016] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0017] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0018] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0019] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0020] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0021] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0022] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0023] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0024] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0025] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0026] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0027] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0028] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0029] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0030] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0031] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0032] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0033] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0034] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0035] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0036] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0038] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0039] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationally,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0040] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0041] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0042] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0043] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0045] FIG. 2a is a schematic cross-sectional view of a printed circuit board assembly according to a comparative example. FIG. 2b is a schematic cross-sectional view illustrating a state in which a bridge occurs in a printed circuit board assembly according to a comparative example.

[0046] Referring to FIGS. 2a and 2b, a printed circuit board assembly (900) according to a comparative example may include a first printed circuit board (910), a second printed circuit board (920), a spacer (930), and solder (940).

[0047] In a comparative example, the first printed circuit board (910) and the second printed circuit board (920) may be stacked together. The first pad (911) formed on the first printed circuit board (910) and the second pad (921) formed on the second printed circuit board (920) may be electrically connected by being joined together by solder (940). Multiple first pads (911) and second pads (921) may be formed, and a spacer (930) may be positioned between any first pad (911a) and second pad (921) facing each other. The spacer (930) may be configured to maintain the height between the first printed circuit board (910) and the second printed circuit board (920). The spacer (930) may be formed in a substantially flat cylindrical shape. For example, as shown in FIG. 2a, one first pad (911a) and the second pad (921a) may be electrically connected by solder (940a), and another adjacent first pad (911b) and the second pad (921b) may be electrically connected by solder (940b).

[0048] In a comparative example, to prevent the first pad (911) and the second pad (921) from coming into contact with the solder (940) due to a gap existing between the first printed circuit board (910) and the second printed circuit board (920), a process of pressing the first printed circuit board (910) and the second printed circuit board (920) in a stacking direction (e.g., +z / -z direction) as shown in FIG. 2a may be applied. However, during such a process, a situation may occur where the alignment of the first printed circuit board (910) and the second printed circuit board (920) is misaligned as shown in FIG. 2b. If the alignment of the first printed circuit board (910) and the second printed circuit board (920) is misaligned, a bridge (B) may be formed in which the solder (940a, 940b) between adjacent pads (911a, 911b) is connected to each other. Since such a bridge (B) causes a short circuit between adjacent pads (911a, 911b), it may affect the normal operation of the printed circuit board assembly (900).

[0050] FIG. 3a is a schematic cross-sectional view of a printed circuit board assembly according to one embodiment. FIG. 3b is a perspective view of a spacer according to one embodiment.

[0051] Referring to FIGS. 3a and 3b, in one embodiment, a printed circuit board assembly (300) can be applied to various electronic devices (e.g., the electronic device (101) of FIG. 1). At least one printed circuit board assembly (300) can be placed inside the electronic device (101) to implement various functions of the electronic device (101). For example, the printed circuit board assembly (300) can be applied to a smartphone, a tablet, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), or a navigation system. However, this is exemplary, and the electronic device (101) to which the printed circuit board assembly (300) can be applied is not limited thereto.

[0052] In one embodiment, the printed circuit board assembly (300) may include a first printed circuit board (310), a second printed circuit board (320), a spacer (330), and solder (340).

[0053] In one embodiment, the first printed circuit board (310) and the second printed circuit board (320) may be boards on which various electronic components (not shown) are placed. An electrical circuit (not shown) that electrically connects various electronic components may be formed on the first printed circuit board (310) and the second printed circuit board (320). The first printed circuit board (310) and the second printed circuit board (320) may be formed in various shapes and / or sizes. For example, the first printed circuit board (310) and the second printed circuit board (320) may be formed in a flat shape or formed flexibly.

[0054] In one embodiment, the first printed circuit board (310) and the second printed circuit board (320) may be stacked and arranged together. For example, the first printed circuit board (310) may be a main printed circuit board and the second printed circuit board (320) may be an auxiliary printed circuit board. Alternatively, for example, the first printed circuit board (310) may be a main printed circuit board and the second printed circuit board (320) may be an interposer. However, this is exemplary and the types of the first printed circuit board (310) and the second printed circuit board (320) are not limited thereto.

[0055] In one embodiment, the first printed circuit board (310) may include a first pad (311), and the second printed circuit board (320) may include a second pad (321). The first printed circuit board (310) and the second printed circuit board (320) may be electrically connected through the first pad (311), the second pad (321), and solder (340). The first pad (311) and the second pad (321) may be formed in a corresponding number and positioned to face each other. Although FIG. 3a shows one first pad (311) and one second pad (321) respectively, this is for convenience of explanation and the number of the first pad (311) and the second pad (321) is not limited thereto. For example, the first pad (311) and the second pad (321) may each be formed in one or multiple numbers. The first pad (311) and the second pad (321) can be electrically connected to an electrical circuit (not shown) formed on the first printed circuit board (310) and the second printed circuit board (320), respectively.

[0056] In one embodiment, the first pad (311) may be formed on one side (e.g., the +z direction side) of the first printed circuit board (310). The first pad (311) may be formed of a metal material to be electrically conductive. A first recessed groove (312) may be formed in the first pad (311). The first recessed groove (312) may be formed by being recessed from the outer side (e.g., the +z direction side) of the first pad (311) toward the inner side (e.g., the -z direction). The first recessed groove (312) may be formed with a side (3121) that is inclined. For example, the first recessed groove (312) may be formed such that the recessed space substantially has a truncated cone shape or a conical shape.

[0057] In one embodiment, the second pad (321) may be formed on one side (e.g., the -z direction side) of the second printed circuit board (310). The second pad (321) may be formed in a position facing the corresponding first pad (311). The second pad (321) may be formed of a metal material to be electrically conductive. A second recessed groove (322) may be formed in the second pad (321). The second recessed groove (322) may be formed by being recessed from the outer side (e.g., the -z direction side) of the second pad (321) toward the inside (e.g., the +z direction). The second recessed groove (322) may be formed with a slanted side (3221). For example, the second recessed groove (322) may be formed such that the recessed space substantially has a truncated cone shape or a conical shape.

[0058] In one embodiment, the spacer (330) may be positioned between the first pad (311) and the second pad (321). The spacer (330) may maintain the height (e.g., height in the z-direction) between the first printed circuit board (310) and the second printed circuit board (320) at a specified height.

[0059] In one embodiment, the spacer (330) may include a main body (331), a first protruding body (332), and a second protruding body (333).

[0060] In one embodiment, the main body (331) may be formed in a substantially flat cylindrical shape. As shown in FIG. 3a, the cross-sectional area of ​​the main body (331) with respect to the xy plane may be formed to be larger than the first recessed groove (312) and / or the second recessed groove (322) with respect to the xy plane.

[0061] In one embodiment, the first protruding body (332) may be formed by protruding from one side (e.g., the -z direction side) of the main body (331). The first protruding body (332) may be formed with a side (3321) that is inclined. For example, the first protruding body (332) may be formed substantially in a truncated cone shape or a conical shape. The corners of the ends (e.g., the -z direction ends) of the first protruding body (332) may be rounded. However, this is exemplary and the shape of the first protruding body (332) is not limited thereto.

[0062] In one embodiment, the first protruding body (332) may be inserted into the first recessed groove (312) of the first pad (311). The first protruding body (332) and the first recessed groove (312) may be formed in substantially corresponding shapes. For example, the side angle (3321) of the first protruding body (332) may substantially correspond to the side angle (3121) of the first recessed groove (312). However, this is exemplary, and the side angle (3321) of the first protruding body (332) may be formed to be larger or smaller than the side angle (3121) of the first recessed groove (312).

[0063] In one embodiment, the height at which the first protruding body (332) protrudes from the main body (331) (e.g., height in the z direction) may be substantially equal to or smaller than the depth at which the first recessed groove (312) is recessed from the outer surface (e.g., +z direction surface) of the first pad (311) (e.g., depth in the z direction). According to such a structure, a small gap may be formed between the first protruding body (332) and the first recessed groove (312) where solder (340) can be positioned. However, this is exemplary, and the height at which the first protruding body (332) protrudes from the main body (331) (e.g., height in the z direction) may be smaller than the depth at which the first recessed groove (312) is recessed from the outer surface (e.g., +z direction surface) of the first pad (311) (e.g., depth in the z direction).

[0064] In one embodiment, the volume of the first protruding body (332) may be formed to be substantially equal to or smaller than the volume of the first recessed groove (312). However, as this is exemplary, the volume of the first protruding body (332) may be formed to be larger than the volume of the first recessed groove (312).

[0065] In one embodiment, the second protruding body (333) may be formed by protruding from the other side (e.g., the +z direction side) of the main body (331). The second protruding body (333) may be formed with a side (3331) that is inclined. For example, the second protruding body (333) may be formed substantially in a truncated cone shape or a conical shape. The corners of the ends (e.g., the +z direction ends) of the second protruding body (333) may be rounded. However, this is exemplary and the shape of the second protruding body (333) is not limited thereto.

[0066] In one embodiment, the second protruding body (333) may be inserted into the second recessed groove (322) of the second pad (321). The second protruding body (333) and the second recessed groove (322) may be formed in substantially corresponding shapes. For example, the side angle (3331) of the second protruding body (333) may substantially correspond to the side angle (3221) of the second recessed groove (322). However, this is exemplary, and the side angle (3331) of the second protruding body (333) may be formed to be larger or smaller than the side angle (3221) of the second recessed groove (322).

[0067] In one embodiment, the height at which the second protruding body (333) protrudes from the main body (331) (e.g., height in the z direction) may be substantially equal to or smaller than the depth at which the second recessed groove (322) is recessed from the outer surface (e.g., -z direction surface) of the second pad (321) (e.g., depth in the z direction). According to such a structure, a small gap may be formed between the second protruding body (333) and the second recessed groove (322) where solder (340) can be positioned. However, this is exemplary, and the height at which the second protruding body (333) protrudes from the main body (331) (e.g., height in the z direction) may be smaller than the depth at which the second recessed groove (322) is recessed from the outer surface (e.g., -z direction surface) of the second pad (321) (e.g., depth in the z direction).

[0068] In one embodiment, the volume of the second protruding body (333) may be formed to be substantially equal to or smaller than the volume of the second recessed groove (322). However, as this is exemplary, the volume of the second protruding body (333) may be formed to be larger than the volume of the second recessed groove (322).

[0069] In one embodiment, the first protruding body (332) and the second protruding body (333) may be formed substantially symmetrically with respect to the main body (331). However, this is exemplary, and the first protruding body (332) and the second protruding body (333) may be formed asymmetrically with respect to the main body (331).

[0070] In one embodiment, the solder (340) can electrically connect the first pad (311) and the second pad (321). The solder (340) may be applied to the first pad (311) and / or the second pad (321). For example, the solder (340) may be a SAC (Sn / Ag / Cu) series solder or a Bi (bismuth) series solder. However, this is exemplary and the type of solder (340) is not limited thereto.

[0071] Meanwhile, in one embodiment, the printed circuit board assembly (300) may further include a thermal interface material (not shown) (TIM). The thermal interface material may form a thermal conduction path for releasing heat from inside the printed circuit board assembly (300) to the outside. For example, the thermal interface material may be placed between the first printed circuit board (310) and the second printed circuit board (320). However, this is exemplary, and the location where the thermal interface material is placed is not limited thereto.

[0073] FIG. 3c is a schematic cross-sectional view illustrating a misaligned state of a printed circuit board assembly according to one embodiment. FIG. 3d is a schematic cross-sectional view illustrating a self-aligned state of a printed circuit board assembly according to one embodiment.

[0074] Referring to FIGS. 3C and 3D, in one embodiment, a first printed circuit board (310) and a second printed circuit board (320) may each include a plurality of first pads (311a, 311b) and a plurality of second pads (321a, 321b). A spacer (330) may be placed between at least some of the first pads (311a) and second pads (321a) among several pairs of first pads (311a, 311b) and second pads (321a, 321b). For example, when the first printed circuit board (310) and the second printed circuit board (320) are stacked together, the spacer (330) may be placed between the first pads (311a) and second pads (321a) formed in a portion susceptible to bending. For example, the spacer (330) may be placed between the first pad (311a) and the second pad (321a) formed near the corners and / or edges of the first printed circuit board (310) and the second printed circuit board (320). However, this is exemplary, and the location where the spacer (330) is placed is not limited thereto. Meanwhile, the first pad (311b) and the second pad (321b) where the spacer (330) is not placed may not have a recessed groove formed.

[0075] In one embodiment, each solder (340a, 340b) may be applied on each first pad (311a, 311b) of the first printed circuit board (310). A spacer (330) may be placed on at least some of the first pads (311a). The second printed circuit board (320) may be laminated to the first printed circuit board (310) such that each second pad (321a, 321b) of the second printed circuit board (320) is positioned to face each first pad (311a, 311b) of the first printed circuit board (310). However, this is exemplary and the order in which the printed circuit board assembly (300) is manufactured is not limited thereto.

[0076] In one embodiment, the first printed circuit board (310) and the second printed circuit board (320) may be pressed in a stacking direction (e.g., z-direction) to prevent each solder (340a, 340b) from having a bonding defect with the corresponding first pad (311a, 311b) and / or second pad (321a, 321b) due to a gap between the first printed circuit board (310) and the second printed circuit board (320) (e.g., a gap caused by the self-volume of a heat-conducting member (not shown)). During the process of pressing the first printed circuit board (310) and the second printed circuit board (320), the shape in which the spacer (330) and the pads (311a, 321a) interlock at an angle with each other may cause self-alignment between the first printed circuit board (310) and the second printed circuit board (320). For example, by a vertical force (e.g., +z / -z direction) pressing the first printed circuit board (310) and the second printed circuit board (320), the inclined side (3321, 3331) of the protruding body (332, 333) and the inclined side (3121a, 3221a) of the recessed groove (312a, 322a) can slide relative to each other in the direction of the bold arrow shown in FIG. 3c. By such sliding, the relative positions of the first printed circuit board (310), the spacer (330), and the second printed circuit board (320) can be aligned to the correct position, as shown in FIG. 3d. Accordingly, in the printed circuit board assembly (300) according to one embodiment, misalignment between the first printed circuit board (310) and the second printed circuit board (320) can be prevented, and furthermore, solder (340a, 340b) applied to adjacent first pads (311a, 311b) can be connected to each other to prevent the occurrence of a bridge.

[0078] Referring to FIG. 2a and FIG. 3d, the bonding strength of the solder (340a) in the printed circuit board assembly (300) according to one embodiment may be improved compared to the printed circuit board assembly (900) according to a comparative example. For example, as in FIG. 2a, in the printed circuit board assembly (900) according to a comparative example, the gap (d1) between the first pad (911a) and the spacer (930) is narrow, so the amount of solder (940a) located between the first pad (911a) and the spacer (930) may be small. On the other hand, as in FIG. 3d, in the printed circuit board assembly (300) according to one embodiment, the gap (d2) between the first pad (311a) and the spacer (330) is relatively wide, so the amount of solder (340a) located between the first pad (311a) and the spacer (330) may be increased. Accordingly, in the case of the printed circuit board assembly (300) according to one embodiment, the bonding strength of the solder (340a) can be improved as the amount of solder (340a) located between the first pad (311a) and the spacer (330) increases compared to the printed circuit board assembly (900) according to the comparative example. Meanwhile, in describing the improvement in bonding strength of the solder (340a), the description was made based on the first pad (311a) and the spacer (330), but this is for convenience of explanation, and the above description can be applied in the same way to the solder (340a) located between the second pad (321a) and the spacer (330).

[0080] FIG. 3e is a schematic cross-sectional view of a first printed circuit board and a second printed circuit board according to one embodiment.

[0081] Referring to FIG. 3e, in one embodiment, a first printed circuit board (310) may include a plurality of first layers (3101) and first via holes (3102). The plurality of first layers (3101) may be stacked on top of each other. FIG. 3e shows eight first layers (3101), but this is exemplary and the number of first layers (3101) is not limited thereto. The first via holes (3102) may be formed to penetrate at least a portion of the plurality of first layers (3101). The first via holes (3102) may be filled with a conductive material or plated through via fill. Meanwhile, a first recessed groove (312) may be formed by not performing via fill on at least a portion of the first via holes (3102). For example, as shown in FIG. 3e, the first recessed groove (312) can be formed by not performing via filling on the two first layers (3101). In this case, the plated portion on the surface of the first via hole (3102) can function as the first pad (311). However, this is exemplary, and the first recessed groove (312) may also be formed by performing via filling on all or part of the first via hole (3102) and then removing some of the via filling.

[0082] In one embodiment, the second printed circuit board (320) may include a plurality of second layers (3201) and second via holes (3202). The plurality of second layers (3201) may be stacked on top of each other. Although three second layers (3201) are shown in FIG. 3e, this is exemplary and the number of second layers (3201) is not limited thereto. The second via holes (3202) may be formed to penetrate at least a portion of the plurality of second layers (3201). The second via holes (3202) may be filled with a conductive material or plated through via fill. Meanwhile, a second recessed groove (322) may be formed by not performing via fill on at least a portion of the second via holes (3202). For example, as shown in FIG. 3e, a second recessed groove (322) can be formed by not performing via filling on one of the second layers (3201). In this case, the plated portion on the surface of the second via hole (3202) can function as a second pad (321). However, this is exemplary, and the second recessed groove (322) may also be formed by performing via filling on all or part of the second via hole (3202) and then removing some of the via fill.

[0084] In one embodiment, the printed circuit board assembly (300) comprises a first printed circuit board (310) including a first pad (311) having a first recessed groove (312) formed so that the side (3121) is inclinedly recessed, a second printed circuit board (320) including a second pad (321) and the second pad (321) being laminated on the first printed circuit board (310) so that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other, and the spacer (330) includes a main body (331) and a side (3321) inclined from one side of the main body (331). It may include a first protruding body (332) that protrudes and is inserted into the first recessed groove (312).

[0085] In one embodiment, the first recessed groove (312) and the first protruding body (332) are formed in corresponding shapes, in a printed circuit board assembly (300).

[0086] In one embodiment, the side angle (3121) of the first recessed groove (312) and the side angle (3321) of the first protruding body (332) correspond to each other, in a printed circuit board assembly (300).

[0087] In one embodiment, the height at which the first protruding body (332) protrudes is equal to or smaller than the depth at which the first recessed groove (312) is recessed, in a printed circuit board assembly (300).

[0088] In one embodiment, the first printed circuit board (310) and the second printed circuit board (320) are pressed in a stacking direction, forming a printed circuit board assembly (300).

[0089] A printed circuit board assembly (300) in which, in one embodiment, the relative positions of the first printed circuit board (310) and the second printed circuit board (320) are aligned by sliding between the inclined side (3321) of the first protruding body (332) and the inclined side (3121) of the first recessed groove (312) during the process in which the first printed circuit board (310) and the second printed circuit board (320) are pressed in a stacking direction.

[0090] In one embodiment, the second pad (321) has a second recessed groove (322) formed in which a side (3221) is inclinedly recessed, and the spacer (330) further includes a second protruding body (333) that is inserted into the second recessed groove (322) and has a side (3331) that protrudes inclinedly from the other side of the main body (331). Printed circuit board assembly (300).

[0091] In one embodiment, the second recessed groove (322) and the second protruding body (333) are formed in corresponding shapes, in a printed circuit board assembly (300).

[0092] In one embodiment, the side angle (3221) of the second recessed groove (322) and the side angle (3331) of the second protruding body (333) correspond to each other, in a printed circuit board assembly (300).

[0093] In one embodiment, the height at which the second protruding body (333) protrudes is equal to or smaller than the depth at which the second recessed groove (322) is recessed, in a printed circuit board assembly (300).

[0094] In one embodiment, the first recessed groove (312) is at least part of a via hole formed in the first printed circuit board (310), in a printed circuit board assembly (300).

[0095] In one embodiment, the main body (331) is formed in a cylindrical shape, the printed circuit board assembly (300).

[0096] In one embodiment, the first protruding body (332) is formed in a truncated cone shape or a cone shape, in a printed circuit board assembly (300).

[0097] In one embodiment, a printed circuit board assembly (300) in which a round is formed at the end edge of the first protruding body (332).

[0098] In one embodiment, the first printed circuit board (310) is a main printed circuit board and the second printed circuit board (320) is an interposer, a printed circuit board assembly (300).

[0099] In one embodiment, the printed circuit board assembly (300) comprises a first printed circuit board (310) having a first recessed groove (312) formed on a side (3121) that is inclinedly recessed, a second printed circuit board (320) having a second recessed groove (322) formed on a side (3221) that is inclinedly recessed, and the second printed circuit board (320) which is laminated to the first printed circuit board (310) such that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and a solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other, and the spacer (330) is a main It may include a body (331), a first protruding body (332) that protrudes from one side of the main body (331) in a shape corresponding to the first recessed groove (312) and is inserted into the first recessed groove (312), and a second protruding body (333) that protrudes from the other side of the main body (331) in a shape corresponding to the second recessed groove (322) and is inserted into the second recessed groove (322).

[0100] In one embodiment, the side (3321) of the first protruding body (332) is formed to be inclined at an angle corresponding to the side (3121) of the first recessed groove (312), and the side (3331) of the second protruding body (333) is formed to be inclined at an angle corresponding to the side (3221) of the second recessed groove (322).

[0101] In one embodiment, during the process in which the first printed circuit board (310) and the second printed circuit board (320) are pressed in the stacking direction, the relative positions of the first printed circuit board (310) and the second printed circuit board (320) can be aligned by sliding between the inclined side (3321) of the first protruding body (332) and the inclined side (3121) of the first recessed groove (312), or by sliding between the inclined side (3331) of the second protruding body (333) and the inclined side (3221) of the second recessed groove (322).

[0102] In one embodiment, the first recessed groove (312) may be at least part of a via hole formed in the first printed circuit board (310), and the second recessed groove (322) may be at least part of a via hole formed in the second printed circuit board (320).

[0103] In one embodiment, the electronic device (101) includes at least one printed circuit board assembly (300) disposed inside the electronic device (101), and the printed circuit board assembly (300) includes a first printed circuit board (310) having a first recessed groove (312) formed such that the side (3121) is inclinedly recessed, a second printed circuit board (320) which includes a second pad (321) and is laminated on the first printed circuit board (310) such that the second pad (321) faces the first pad (311), a spacer (330) positioned between the first pad (311) and the second pad (321), and a solder (340) applied on the first pad (311) or the second pad (321) so that the first pad (311) and the second pad (321) are electrically connected to each other. The spacer (330) may include a main body (331) and a first protruding body (332) that has a side (3321) protruding obliquely from one side of the main body (331) and is inserted into the first recessed groove (312).

Claims

Claim 1 A printed circuit board assembly comprising: a first printed circuit board including a first pad having a first recessed groove formed so as to be inclined on its side; a second printed circuit board including a second pad, wherein the second pad is laminated to the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and a solder positioned on the first pad and the second pad so as to electrically connect the first pad and the second pad to each other, wherein the spacer includes a main body; and a first protruding body that protrudes from one side of the main body at an inclined side and is received in the first recessed groove, and the solder is positioned to surround the spacer between the first pad and the second pad. Claim 2 A printed circuit board assembly according to claim 1, wherein the first recessed groove and the first protruding body are formed in shapes corresponding to each other. Claim 3 A printed circuit board assembly according to claim 1, wherein the lateral inclination angle of the first recessed groove and the lateral inclination angle of the first protruding body correspond to each other. Claim 4 A printed circuit board assembly according to claim 1, wherein the height at which the first protruding body protrudes is equal to or smaller than the depth at which the first recessed groove is recessed. Claim 5 In claim 1, the first printed circuit board and the second printed circuit board are pressed in the stacking direction, forming a printed circuit board assembly. Claim 6 A printed circuit board assembly according to claim 5, wherein the second pad has a second recessed groove formed therein with a side that is inclined and recessed, and the spacer further includes a second protruding body that protrudes inclinedly from the other side of the main body and is received in the second recessed groove, and wherein, during the process in which the first printed circuit board and the second printed circuit board are pressed in a stacking direction, the relative positions of the first printed circuit board and the second printed circuit board are aligned by sliding between the inclined side of the first protruding body and the inclined side of the first recessed groove or by sliding between the inclined side of the second protruding body and the inclined side of the second recessed groove. Claim 7 A printed circuit board assembly according to claim 1, wherein the second pad has a second recessed groove formed with a side that is inclined and recessed, and the spacer further includes a second protruding body that protrudes with a side that is inclined and protrudes from the other side of the main body and is received in the second recessed groove. Claim 8 A printed circuit board assembly according to claim 7, wherein the second recessed groove and the second protruding body are formed in shapes corresponding to each other. Claim 9 A printed circuit board assembly according to claim 7, wherein the lateral inclination angle of the second recessed groove and the lateral inclination angle of the second protruding body correspond to each other. Claim 10 A printed circuit board assembly according to claim 7, wherein the height at which the second protruding body protrudes is equal to or smaller than the depth at which the second recessed groove is recessed. Claim 11 A printed circuit board assembly according to claim 1, wherein the first recessed groove is at least part of a via hole formed in the first printed circuit board. Claim 12 A printed circuit board assembly according to claim 1, wherein the main body is formed in a cylindrical shape. Claim 13 A printed circuit board assembly according to claim 1, wherein the first protruding body is formed in a truncated cone shape or a cone shape. Claim 14 A printed circuit board assembly according to claim 1, wherein a round is formed at the end edge of the first protruding body. Claim 15 A printed circuit board assembly according to claim 1, wherein the first printed circuit board is a main printed circuit board and the second printed circuit board is an interposer. Claim 16 A printed circuit board assembly comprising: a first printed circuit board including a first pad having a first recessed groove formed with a side that is inclinedly recessed; a second printed circuit board including a second pad having a second recessed groove formed with a side that is inclinedly recessed, and the second pad being laminated to the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and a solder positioned on the first pad and the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer comprises: a main body; a first protruding body protruding from one side of the main body in a shape corresponding to the first recessed groove and being received in the first recessed groove; and a second protruding body protruding from the other side of the main body in a shape corresponding to the second recessed groove and being received in the second recessed groove, and the solder being positioned to surround the spacer between the first pad and the second pad. Claim 17 A printed circuit board assembly according to claim 16, wherein the side of the first protruding body is formed to be inclined at an angle corresponding to the side of the first recessed groove, and the side of the second protruding body is formed to be inclined at an angle corresponding to the side of the second recessed groove. Claim 18 A printed circuit board assembly according to claim 17, wherein, during the process in which the first printed circuit board and the second printed circuit board are pressed in a stacking direction, the relative positions of the first printed circuit board and the second printed circuit board are aligned by sliding between the inclined side of the first protruding body and the inclined side of the first recessed groove or by sliding between the inclined side of the second protruding body and the inclined side of the second recessed groove. Claim 19 A printed circuit board assembly according to claim 16, wherein the first recessed groove is at least part of a via hole formed in the first printed circuit board, and the second recessed groove is at least part of a via hole formed in the second printed circuit board. Claim 20 An electronic device comprising at least one printed circuit board assembly disposed inside the electronic device, wherein the printed circuit board assembly comprises: a first printed circuit board comprising a first pad having a first recessed groove formed with a side that is inclinedly recessed; a second printed circuit board comprising a second pad, wherein the second pad is laminated to the first printed circuit board such that the second pad faces the first pad; a spacer positioned between the first pad and the second pad; and a solder positioned on the first pad and the second pad so that the first pad and the second pad are electrically connected to each other, wherein the spacer comprises a main body; and a first protruding body that protrudes from one side of the main body with a side that is inclinedly recessed and is received in the first recessed groove, and wherein the solder is positioned to surround the spacer between the first pad and the second pad.

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