Method for manufacturing a display device

Abstract

A method for manufacturing a display device capable of shortening the takt time is provided. The method comprises a transfer process in which an anisotropic conductive adhesive layer formed on a substrate that is transparent to laser light is positioned opposite a wiring board, and a laser light is irradiated from the substrate side to transfer and align the anisotropic conductive adhesive layer at a predetermined location on the wiring board, and a mounting process in which a light-emitting element is mounted on the anisotropic conductive adhesive layer aligned at the predetermined location on the wiring board. By irradiating the laser light, the anisotropic conductive adhesive layer can be transferred and aligned with high precision and high efficiency.

Description

Technology Field

[0001] The present invention relates to a method for manufacturing a display device formed by arranging light-emitting elements. In particular, it relates to a method for manufacturing a display device formed by arranging LED elements such as mini LEDs and micro LEDs. The present application claims priority based on Japanese Patent Application No. 2021-054138 filed in Japan on March 26, 2021, and this application is incorporated into the present application by reference. Background Technology

[0002] Conventionally, a display device has been proposed that forms a light-emitting element array by arranging multiple light-emitting elements such as LEDs (Light Emitting Diodes). Patent Document 1 discloses a method of bonding LEDs with an anisotropic conductive adhesive such as ACF (Anisotropic Conductive Film).

[0003] In the method described in Patent Document 1, since the ACF is attached to the device mounting surface of the substrate all at once, the adhesive resin and conductive particles of the ACF remain between each LED pitch. Therefore, when light transmittance is required for a light-emitting device array, light transmission is obstructed, and excellent light transmittance cannot be obtained.

[0004] On the other hand, if the ACF is attached only directly below the LED, a considerable amount of time is required for attachment alone, and the takt time deteriorates. Prior art literature

[0005] Specification of U.S. Patent Application Publication No. 2015 / 0255505 The problem to be solved

[0006] The present technology is proposed in consideration of such conventional conditions and provides a method for manufacturing a display device capable of shortening the takt time. means of solving the problem

[0007] A method for manufacturing a display device related to the present technology comprises a transfer process in which an anisotropic conductive adhesive layer formed on a substrate having transmittance to laser light is positioned opposite a wiring substrate, and a laser light is irradiated from the substrate side to transfer and arrange the anisotropic conductive adhesive layer at a predetermined location on the wiring substrate, and a mounting process in which a light-emitting element is mounted on the arrangement of the anisotropic conductive adhesive layer at the predetermined location on the wiring substrate.

[0008] A method for manufacturing a display device related to the present invention comprises: a transfer process in which an anisotropic conductive adhesive layer formed on a substrate having transmittance to laser light is positioned oppositely to a light-emitting element arranged on a transfer substrate, and laser light is irradiated from the substrate side to transfer a portion of the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate; a re-transfer process in which the light-emitting element onto which the portion has been transferred is re-transferred onto a wiring substrate; and a mounting process in which the light-emitting element arranged at a predetermined position on the wiring substrate is mounted via the portion. Effects of the invention

[0009] According to the present technology, since the anisotropic conductive adhesive layer can be reorganized and arranged with high precision and high efficiency by irradiation with laser light, the takt time can be shortened. Brief explanation of the drawing

[0010] FIG. 1 is a cross-sectional view schematically showing an anisotropic conductive adhesive layer formed on a substrate and a wiring board facing each other. FIG. 2 is a cross-sectional view schematically showing the state in which an anisotropic conductive adhesive layer is transferred to a predetermined location on a wiring board and arranged by irradiating a laser light from the substrate side. FIG. 3 is a cross-sectional view schematically showing a state in which a light-emitting element is mounted on a reorganized structure arranged at a predetermined position on a wiring board. FIG. 4 is a cross-sectional view schematically showing the state in which an anisotropic conductive adhesive layer is transferred at an electrode position on a wiring board and arranged by irradiating a laser light from the substrate side. FIG. 5 is a cross-sectional view schematically showing the state in which a light-emitting element is mounted on a reorganized structure arranged in electrode units on a wiring board. FIG. 6 is a cross-sectional view schematically showing the state in which an anisotropic conductive adhesive layer formed on a substrate and a light-emitting element arranged on a transfer substrate are facing each other. FIG. 7 is a cross-sectional view schematically showing an anisotropic conductive adhesive layer formed on a substrate. FIG. 8 is a cross-sectional view schematically showing the state in which a reorganization of an anisotropic conductive adhesive layer is transferred onto a light-emitting element arranged on a transfer substrate by irradiating laser light from the substrate side. FIG. 9 is a cross-sectional view schematically showing the state of re-transferring a light-emitting element with a reorganized structure onto a wiring board. Figure 10 is a metallographic image showing the arrangement of an anisotropic conductive adhesive layer arranged on pure glass. Figure 11 is an enlarged photograph of the metal microscope image shown in Figure 10. Specific details for implementing the invention

[0011] Hereinafter, embodiments of the present technology will be described in detail in the following order with reference to the drawings.

[0012] 1. Method for manufacturing a display device

[0013] 2. Examples

[0014] <1. Method of manufacturing a display device>

[0015] [First Embodiment]

[0016] A method for manufacturing a display device related to a first embodiment comprises a transfer process in which an anisotropic conductive adhesive layer formed on a substrate having transmittance to laser light is positioned opposite a wiring substrate, and a laser light is irradiated from the substrate side to transfer and align the anisotropic conductive adhesive layer to a predetermined position on the wiring substrate, and a mounting process in which a light-emitting element is mounted on the anisotropic conductive adhesive layer aligned at a predetermined position on the wiring substrate. Since the anisotropic conductive adhesive layer can be transferred and aligned with high precision and high efficiency by irradiating the laser light, the takt time can be shortened.

[0017] Hereinafter, with reference to FIGS. 1 to 3, a transfer process (A) for transferring and arranging an anisotropic conductive adhesive layer at a predetermined location on a wiring substrate, and a mounting process (B) for mounting a light-emitting element on the layer arranged at a predetermined location on the wiring substrate will be described.

[0018] [Transfer Process (A)]

[0019] FIG. 1 is a cross-sectional view schematically showing an anisotropic conductive adhesive layer formed on a substrate and a wiring substrate facing each other. As shown in FIG. 1, first, in a transfer process (A), an anisotropic conductive adhesive layer substrate (10) and a wiring substrate (20) are faced each other.

[0020] An anisotropic conductive adhesive layer substrate (10) comprises a substrate (11) and an anisotropic conductive adhesive layer (12), and an anisotropic conductive adhesive layer (12) is formed on the surface of the substrate (11). The substrate (11) only needs to be transparent to laser light, and among them, it is preferable that it be quartz glass having high light transmittance over the entire wavelength.

[0021] The anisotropic conductive adhesive layer (12) contains, for example, conductive particles (13) in a binder. Furthermore, the anisotropic conductive adhesive layer (12) is preferably configured such that, from the perspective of laser transferability, conductive particles (13) are aligned in a planar direction to ensure conductivity and to avoid short circuits. It is preferable that the alignment of the conductive particles be a regular arrangement. As an example, Japanese Patent No. 6119718 can be cited. As for the binder, for example, epoxy-based adhesives or acrylic-based adhesives can be cited, and among them, epoxy-based adhesives containing a resin having a maximum absorption wavelength of 180 nm to 360 nm or high-purity bisphenol A type epoxy resin can be preferably used. As a specific example of high-purity bisphenol A type epoxy resin, for example, the product name "YL980" manufactured by Mitsubishi Chemical Corporation can be cited. In addition, as the epoxy resin curing agent contained in the epoxy-based adhesive, for example, a cationic polymerization initiator or anionic polymerization initiator such as an aromatic sulfonium salt-based initiator may be preferably used. A specific example of an aromatic sulfonium salt-based cationic polymerization initiator is the product name "SI-60L" manufactured by Sanshin Chemical Industry Co., Ltd. In addition, the acrylic adhesive is an adhesive utilizing a radical polymerization reaction and contains, for example, a radical polymerizable material such as a (meth)acrylate compound and a radical polymerization initiator such as a peroxide. From the perspective of heat resistance and adhesion required when using a display device, an epoxy-based adhesive is preferred. Furthermore, although a thermally curable anisotropic conductive adhesive layer has been described here, a photocurable anisotropic conductive adhesive layer may be used when it is desired to avoid heat in subsequent processes. In that case, a photopolymerization initiator may be used instead of the aforementioned thermal polymerization initiator.

[0022] As for the conductive particles (13), those used in known anisotropic conductive films can be appropriately selected and used. For example, metal particles such as nickel (melting point 1455 °C), copper (melting point 1085 °C), silver (melting point 961.8 °C), gold (melting point 1064 °C), palladium (melting point 1555 °C), tin (melting point 231.9 °C), nickel boride (melting point 1230 °C), ruthenium (melting point 2334 °C), and solder which is a tin alloy; metal-coated resin particles in which the surface of resin particles, such as a polymer comprising at least one monomer selected from polyamide, polybenzoguanamine, styrene, and divinylbenzene as a monomer unit, is coated with a metal such as nickel, copper, silver, gold, palladium, tin, nickel boride, or ruthenium; and inorganic materials such as silica, alumina, barium titanate, zirconia, carbon black, silicate glass, borosilicate glass, lead glass, soda-lime glass, and alumina silicate glass. Examples include metal-coated inorganic particles in which the surface of the particles is coated with a metal such as nickel, copper, silver, gold, palladium, tin, nickel boride, or ruthenium. The metal particles may be coated with the metal described above. In addition, the metal layer in the metal-coated resin particles and metal-coated inorganic particles may be a single layer or may be formed as a multilayer of dissimilar metals.

[0023] Insulating coating treatment can be performed by coating these conductive particles with insulating particles, such as a resin layer, resin particles, or inorganic particles. The particle size of the conductive particles (13) is appropriately changed according to the area of ​​the electrode or bump of the optical element or wiring board to be mounted, but it is preferable to have a particle size of 1 to 30 μm, more preferable to have a particle size of 1 to 10 μm, and particularly preferable to have a particle size of 1 to 3 μm. When used for mounting a micro LED element, since the area of ​​the electrode or bump is small, the particle size is preferably 1 to 2.5 μm, more preferable to have a particle size of 1 to 2.2 μm, and particularly preferable to have a particle size of 1 to 2 μm. The particle size can be obtained by measuring more than 200 particles by microscopic observation (optical microscope, metallurgical microscope, electron microscope, etc.) and determining the particle size from the average.

[0024] In addition, regarding the conductive particles in which a metal is coated on resin particles or inorganic particles as described above, the thickness of the metal coating is preferably 0.005 μm or more, more preferably 0.01 μm or more, preferably 10 μm or less, more preferably 1 μm or less, and even more preferably 0.3 μm or less. This coating thickness is the total thickness of the metal coating when the metal coating is multilayered. If this coating thickness is above the lower limit and below the upper limit, sufficient conductivity is easily obtained, and the conductive particles do not become excessively hard, making it easy to utilize the characteristics of the resin particles or inorganic particles described above.

[0025] The above coating thickness can be measured, for example, by observing the cross-section of the conductive particle using a transmission electron microscope (TEM). Regarding the above coating thickness, it is preferable to calculate the average of five arbitrary coating thicknesses as the coating thickness of one conductive particle, and it is more preferable to calculate the average of the thickness of the entire coating portion as the coating thickness of one conductive particle. It is preferable to obtain the above coating thickness by calculating the average of the coating thicknesses of each conductive particle for 10 arbitrary conductive particles.

[0026] In addition, the shapes of the conductive particles may include spherical, ellipsoidal, spike-like, and irregular shapes. Among these, spherical conductive particles are preferred because they allow for easy control of particle size and particle size distribution. These conductive particles may also have protrusions on their surface to improve connectivity.

[0027] The film thickness of the anisotropic conductive adhesive layer is appropriately changed according to the height of the electrode or bump of the optical element or wiring board to be mounted, but it is preferably 1 to 30 μm, and more preferably 1 to 10 μm. When used for mounting a micro LED element, since the height of the electrode or bump is low, the film thickness is preferably 1 to 6 μm, more preferably 1 to 5 μm, and particularly preferably 1 to 4 μm.

[0028] By making the anisotropic conductive adhesive layer into a film, it becomes easier to form the anisotropic conductive adhesive layer on the substrate. From the perspective of handling ease, it is preferable to form a release film, such as a polyethylene terephthalate film, on one or both sides of the anisotropic conductive adhesive layer.

[0029] An anisotropic conductive adhesive layer may be laminated onto a substrate by transferring the anisotropic conductive adhesive layer on the film onto the substrate, or an anisotropic conductive adhesive layer may be laminated onto the substrate by manufacturing the anisotropic conductive adhesive layer on the substrate. Methods for manufacturing an anisotropic conductive adhesive layer on a substrate include, for example, applying and drying a solution of an anisotropic conductive adhesive onto a substrate, or forming an adhesive layer that does not contain conductive particles on a substrate and fixing conductive particles to the obtained adhesive layer.

[0030] A wiring board (20) has a circuit pattern for a first conductivity type and a circuit pattern for a second conductivity type on a substrate (21), and has a first electrode (22) and a second electrode (23) respectively at positions corresponding to, for example, the first conductivity type electrode on the p side and the second conductivity type electrode on the n side so that a light-emitting element is arranged in units of subpixels (subpixels) constituting one pixel. In addition, the wiring board (20) forms a circuit pattern such as a data line or an address line of matrix wiring, for example, to enable the light-emitting element corresponding to each subpixel constituting one pixel to be turned on or off. One pixel may be composed of, for example, three subpixels of R (red), G (green), and B (blue), four subpixels of RGBW (white) and RGBY (yellow), or two subpixels of RG and GB. Additionally, the wiring substrate (20) is preferably a light-transmitting substrate, the substrate (21) is preferably glass, PET (Polyethylene Terephthalate), etc., and the circuit pattern, the first electrode (22), and the second electrode (23) are preferably transparent conductive films such as ITO (Indium-Tin-Oxide), IZO (Indium-Zinc-Oxide), ZnO (Zinc-Oxide), IGZO (Indium-Gallium-Zinc-Oxide).

[0031] FIG. 2 is a cross-sectional view schematically showing the state in which an anisotropic conductive adhesive layer is transferred and arranged at a predetermined location on a wiring board by irradiating a laser light from the substrate side. As shown in FIG. 2, in the transfer process (A), a laser light is irradiated from the substrate (11) side to transfer and arrange an anisotropic conductive adhesive layer (12) at a predetermined location on a wiring board (21).

[0032] Here, in order to efficiently transfer the anisotropic conductive adhesive layer from the substrate, the anisotropic conductive adhesive layer formed on the substrate may be pretreated so that the anisotropic conductive adhesive layer is arranged in a matrix. For example, such a pretreatment may be a method of forming a grid-like incision on the anisotropic conductive adhesive layer in which a plurality of longitudinal and transverse incisions intersect. This incision may be formed by a mechanical method or a chemical method. Of course, the incision may also be formed by destroying it with a laser light. By performing such a treatment, the anisotropic conductive adhesive layer fragments on the substrate can be arranged in a matrix, making it easier to transfer the fragments by laser light. Furthermore, this incision does not necessarily have to be deep enough to expose the substrate; even if the incision is deep enough so that the substrate is not exposed, transferability by laser light is improved. This pretreatment may be performed after forming an anisotropic conductive adhesive layer on the substrate, or before forming the anisotropic conductive adhesive layer on the substrate, that is, at the stage of the film-type anisotropic conductive adhesive layer.

[0033] In the transfer process (A), the arrangement (12a) of the anisotropic conductive adhesive layer (12) can be arranged in units of 1 pixel (e.g., 1 pixel, which is a set of RGB), or can be arranged in units of subpixels (e.g., any RGB) that constitute 1 pixel. By doing so, it is possible to support light-emitting element arrays from high PPI (Pixels Per Inch) to low PPI.

[0034] Additionally, in the transfer process (A), it is preferable to arrange the anisotropic conductive adhesive layer (12) (12a) in units of one pixel or multiple pixels. For example, in the case of RGB, since the light-emitting element is arranged in sets of three pixels or a total of six pixels including three pixels of RGB circuits, the anisotropic conductive film may be transferred to one set of six pixels, transferred in units of one pixel, or further arranged in units of electrodes. Meanwhile, to increase productivity, the anisotropic conductive film may be transferred in a range that does not impair transparency, for example, a range of 1 mm × 1 mm.

[0035] In addition, when the anisotropic conductive adhesive layer is arranged in units of one pixel, the film-shaped anisotropic conductive adhesive layer is made into a tape shape, and by making its width equal to one pixel, the aforementioned cutting can be performed in only one direction (the width direction of the tape). This tape width equal to one pixel varies depending on the spacing between pixels, but it does not mean a length equivalent to the size of one pixel, but rather a length that does not interfere with adjacent pixels.

[0036] In addition, the distance between the sections arranged at a predetermined position on the wiring board (20) is preferably 3 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. In addition, the upper limit of the distance between the sections is preferably 3000 μm or less, more preferably 1000 μm or less, and even more preferably 500 μm or less. If the distance between the sections is excessively small, it is preferable to attach an anisotropic conductive film to the entire surface of the wiring board (20), and if the distance between the sections is excessively large, it is preferable to attach an anisotropic conductive film to a predetermined position on the wiring board (20). The distance between the sections can be measured using microscopic observation (optical microscope, metallurgical microscope, electron microscope, etc.).

[0037] For the transfer of the anisotropic conductive adhesive layer (12) and the reorganization (12a), for example, a lift (Laser Induced Forward Transfer) device may be used. The lift device is equipped with, for example, a telescope that makes the pulsed laser light emitted from a laser device into parallel light, a shaping optical system that uniformly shapes the spatial intensity distribution of the pulsed laser light passing through the telescope, a mask that passes the pulsed laser light shaped by the shaping optical system into a predetermined pattern, a field lens located between the shaping optical system and the mask, and a projection lens that projects the laser light passing through the pattern of the mask into a reduced size on a donor substrate, and holds the anisotropic conductive adhesive layer substrate (10), which is the donor substrate, on a donor stage, and holds the wiring substrate (21), which is the receptor substrate, on a receptor stage. The distance between the anisotropic conductive adhesive layer (12) and the wiring substrate (20) is preferably 10 to 1000 μm, more preferably 50 to 500 μm, and even more preferably 80 to 200 μm.

[0038] As a laser device, for example, an excimer laser that emits laser light with a wavelength of 180 nm to 360 nm can be used. The oscillation wavelength of the excimer laser is, for example, 193, 248, 308, 351 nm, and among these oscillation wavelengths, it can be preferably selected according to the light absorption properties of the material of the anisotropic conductive adhesive layer (12).

[0039] The mask uses a pattern in which an array of windows of a predetermined size is formed at a predetermined pitch so that the projection at the interface between the substrate (11) and the anisotropic conductive adhesive layer (12) becomes an array of desired laser light. In the mask, the pattern is formed on the substrate (11), for example, by chrome plating, so that the window portions where chrome plating is not performed transmit laser light, and the portions where chrome plating is performed block laser light.

[0040] The light emitted from the laser device is incident on the telescopic optical system and propagates to the angular optical system in front of it. Just before being incident on the angular optical system, the laser light is adjusted by the telescopic optical system so that it becomes generally parallel light at any position within the movement range of the X-axis of this donor stage, so it is always incident on the angular optical system at generally the same size and the same angle (perpendicular).

[0041] The laser light passing through the angular optical system passes through a field lens that constitutes an image-side telecentric reduction projection optical system in combination with a projection lens and is incident on the mask. The laser light passing through the mask pattern changes its propagation direction to a vertical downward direction by a drop mirror and is incident on the projection lens. The laser light emitted from the projection lens is incident from the side of the substrate (11) and is accurately projected at a predetermined position of the anisotropic conductive adhesive layer (12) formed on its surface (bottom surface) in a reduced size of the mask pattern.

[0042] The pulse energy of the laser light formed by imaging at the interface between the anisotropic conductive adhesive layer and the substrate is preferably 0.001 to 2 J, more preferably 0.01 to 1.5 J, and even more preferably 0.1 to 1 J. The fluence is preferably 0.001 to 2 J / cm², more preferably 0.01 to 1 J / cm², and even more preferably 0.05 to 0.5 J / cm². The pulse width (irradiation time) is preferably 0.01 to 1 × 10⁻⁶. 9 It is picoseconds, and more preferably 0.1 to 1 × 10⁻⁶ 7 It is picoseconds, and more preferably 1 to 1 × 10⁻⁶ 5 It is a picosecond. The pulse frequency is preferably 0.1 to 10,000 Hz, more preferably 1 to 1,000 Hz, and even more preferably 1 to 100 Hz. The number of irradiation pulses is preferably 1 to 30,000,000.

[0043] By using such a lift device, a shock wave is generated on the anisotropic conductive adhesive layer (12) irradiated with laser light at the interface between the substrate (11) and the anisotropic conductive adhesive layer (12), thereby peeling off a plurality of fragments (12a) from the substrate (11) and lifting them toward the wiring board (20), and allowing the plurality of fragments (12a) to land on a predetermined position on the wiring board (20). This transfer method is called laser lift-off and is, for example, a method using ablation by a laser. By doing so, the fragments (12a) of the anisotropic conductive adhesive layer (12) can be transferred and arranged on the wiring board (20) with high precision and high efficiency, thereby allowing for a reduction in takt time.

[0044] The reaction rate of the reorganization (12a) of the anisotropic conductive adhesive layer (12) after the transfer process (A) is preferably 25% or less, more preferably 20% or less, and even more preferably 15% or less. Since the reaction rate of the reorganization (12a) is 25% or less, it becomes possible to thermally press the light-emitting element in the mounting process (B). The reaction rate can be measured, for example, using FT-IR.

[0045] [Processing Process (B)]

[0046] FIG. 3 is a cross-sectional view schematically showing a state in which a light-emitting element is mounted on a section arranged at a predetermined position on a wiring board. As shown in FIG. 3, in the mounting process (B), a light-emitting element (30) is mounted on a section (12a) arranged at a predetermined position on a wiring board (20).

[0047] The light-emitting element (30) comprises a main body (31), a first conductivity type electrode (32), and a second conductivity type electrode (33), and has a horizontal structure in which the first conductivity type electrode (32) and the second conductivity type electrode (33) are arranged on the same plane side. The main body (31) comprises a first conductivity type clad layer made of, for example, n-GaN, and, for example, In x Al y Ga 1-x-y It has an active layer made of an N layer and a second conductivity type clad layer made of, for example, p-GaN, to have a so-called double heterostructure. A first conductivity type electrode (32) is formed in a part of the first conductivity type clad layer by a passivation layer, and a second conductivity type electrode (33) is formed in a part of the second conductivity type clad layer. When a voltage is applied between the first conductivity type electrode (32) and the second conductivity type electrode (33), carriers concentrate in the active layer and recombin, thereby producing light emission.

[0048] The method of mounting the light-emitting element (30) onto the wiring substrate (20) is not particularly limited, but, for example, a method of directly transferring and placing the light-emitting element (30) from the wafer substrate to the wiring substrate (20) by a laser lift-off method (LLO method), or a method of transferring and placing the light-emitting element (30) from the transfer substrate to the wiring substrate (20) using a transfer substrate to which the light-emitting element (30) is pre-attached. As for the method of heat-pressing the light-emitting element (30) onto the wiring substrate (20), a connection method used in known anisotropic conductive films can be appropriately selected and used. In this way, the light-emitting element (30) can be anisotropically connected on the wiring substrate (20) in a state where the wiring substrate (20) is exposed without an anisotropic conductive adhesive layer between the light-emitting elements (30). In addition, by making the wiring substrate (20) a light-transmitting substrate, excellent light transmittance can be obtained compared to the case where an anisotropic conductive film is attached to the entire surface of the wiring substrate (20).

[0049] As explained above, according to the method for manufacturing a display device related to the first embodiment, the anisotropic conductive adhesive layer (12) can be transferred and arranged on a wiring substrate (20) with high precision and high efficiency by irradiation with laser light, thereby allowing for a reduction in takt time. In the above-described embodiment, a method for manufacturing a display device as a display was given as an example, but the present technology is not limited to this and can be applied, for example, to a method for manufacturing a light-emitting device as a light source.

[0050] [A variation of the first embodiment]

[0051] In the transfer process (A) of the first embodiment described above, as shown in FIG. 2, the anisotropic conductive adhesive layer (12) is arranged in a plurality of pixel units, in a single pixel unit, or in a sub-pixel unit constituting a single pixel on the wiring substrate (21), but is not limited to these, and may be arranged in, for example, electrode units.

[0052] FIG. 4 is a cross-sectional view schematically showing the state in which an anisotropic conductive adhesive layer is transferred and arranged at electrode positions on a wiring board by irradiating laser light from the substrate side, and FIG. 5 is a cross-sectional view schematically showing the state in which a light-emitting element is mounted on the arranged layer arranged in electrode units on the wiring board.

[0053] As shown in FIG. 4, in the transfer process (A), for example, the first electrode (22) and the second electrode (23) corresponding to the first conductivity type electrode (32) on the p side and the second conductivity type electrode (33) on the n side of the light-emitting element (30), respectively, the first section (14) and the second section (15) may be transferred, and as shown in FIG. 5, in the mounting process (B), the light-emitting element (30) may be mounted on the section arranged in electrode units on the wiring substrate (20). By doing so, the transparency of the display device can be improved.

[0054] [Second Embodiment]

[0055] A method for manufacturing a display device related to a second embodiment comprises a transfer process in which an anisotropic conductive adhesive layer formed on a substrate that is transparent to laser light is positioned oppositely to a light-emitting element arranged on a transfer substrate, and a laser light is irradiated from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate; a re-transfer process in which the light-emitting element onto which the anisotropic conductive adhesive layer has been transferred is re-transferred onto a wiring substrate; and a mounting process in which the light-emitting element arranged at a predetermined position on the wiring substrate is mounted via the anisotropic conductive adhesive layer. Since the anisotropic conductive adhesive layer can be transferred and arranged with high precision and high efficiency by irradiating the laser light, the takt time can be shortened.

[0056] Hereinafter, with reference to FIGS. 6 to 9, a transfer process (A1) for transferring a reorganized anisotropic conductive adhesive layer onto a light-emitting element arranged on a transfer substrate, a retransfer process (A2) for retransferring the light-emitting element onto a wiring substrate, and a mounting process (BB) for mounting the light-emitting element arranged at a predetermined position on the wiring substrate via the reorganized layer will be described. Additionally, components identical to those in the first embodiment are given the same reference numerals, and descriptions are omitted.

[0057] [Transfer Process (A1)]

[0058] FIG. 6 is a cross-sectional view schematically showing an anisotropic conductive adhesive layer formed on a substrate and a light-emitting element arranged on a transfer substrate facing each other, and FIG. 7 is a cross-sectional view schematically showing an anisotropic conductive adhesive layer formed on a substrate. As shown in FIG. 6, first, in the transfer process (A1), an anisotropic conductive adhesive layer substrate (10) and a transfer substrate (40) are faced each other.

[0059] The transfer substrate (40) comprises a substrate (41) and a light-emitting element (30) arranged on the substrate (41).

[0060] The substrate (41) is appropriately selected according to the transfer method of the retransfer process (A2) described later. For example, when using a transfer method using laser ablation, the substrate (41) only needs to be transparent to laser light, and among them, it is preferable to be quartz glass having high light transmittance over the entire wavelength. Also, for example, when the transfer substrate (40) is bonded to the wiring substrate (20) to electrodeposit the light-emitting element (30), for example, a silicone rubber layer may be formed.

[0061] In the transfer process (A1), a transfer method using ablation by a laser, such as called laser lift-off, can be used, just like in the first embodiment described above. When using ablation, as shown in FIG. 7, it is preferable that conductive particles do not exist in the region X of 0 to 0.05 μm in the thickness direction from the side where the substrate (11) of the anisotropic conductive adhesive layer (12) is formed.

[0062] In the region X of the anisotropic conductive adhesive layer (12), from the side where the substrate (11) is formed, there is a strong influence of ablation in the thickness direction from 0 to 0.05 μm. Therefore, it is desirable that no conductive particles exist in this region X. In other words, it is desirable that all conductive particles do not protrude and remain in the portion of the anisotropic conductive adhesive layer excluding the region X. Here, the state in which no conductive particles exist in a certain region means, for example, not only a state in which all of the conductive particles do not exist in that region, but also a state in which even a part of the conductive particles is not included.

[0063] In terms of productivity of the anisotropic conductive adhesive layer, if conductive particles are incorporated into region X, it is preferable that the number of conductive particles incorporated into region X be 5% or less of the total number of conductive particles included in the anisotropic conductive adhesive layer, and more preferable that it be 1% or less.

[0064] Here, the thickness (t) of region X of the anisotropic conductive adhesive layer (12) may be 0 to 0.05 μm in the thickness direction from the side where the substrate (11) is formed, and in order to more reliably suppress the degradation of conductive particles due to ablation, this thickness (t) may be 0 to 0.1 μm, more preferably 0 to 0.15 μm, and particularly preferably 0 to 0.2 μm, and it is preferable that no conductive particles exist in this region. In other words, it is preferable that all conductive particles do not protrude in the portion of the anisotropic conductive adhesive layer excluding these regions. Also, in the same way, from the perspective of the productivity of the anisotropic conductive adhesive layer, if conductive particles are mixed into these regions, it is preferable that the number of conductive particles mixed into the region be 5% or less of the total number of conductive particles included in the anisotropic conductive adhesive layer, and more preferable that it be 1% or less.

[0065] In addition, to increase the ablation resistance of the conductive particles, it is preferable that the conductive particles be composed of metals, including those with a melting point of 1400°C or higher, among the metals constituting the aforementioned conductive particles. For ease of availability, it is preferable that the upper limit of the melting point be approximately 3500°C. From the same perspective, it is preferable that the metal constituting the conductive particles include nickel, palladium, or ruthenium.

[0066] When using metal-coated resin particles in which the surface of the aforementioned resin particles is coated with metal, or metal-coated inorganic particles in which the surface of the inorganic particles is coated with metal, in order to minimize the effect of ablation on the resin particles or inorganic particles, it is preferable to have a coating thickness of 0.08 μm or more, more preferable to have 0.1 μm or more, particularly preferable to have 0.15 μm or more, and most preferable to have 0.2 μm or more. The upper limit of this coating thickness depends on the diameter of the conductive particles, but it is preferable to have 20% of the diameter of the conductive particles or about 0.5 μm.

[0067] Such anisotropic conductive adhesive layer is applicable not only to the second embodiment, but also to the first embodiment, variations thereof, and other forms.

[0068] FIG. 8 is a cross-sectional view schematically showing the state in which a reorganization of an anisotropic conductive adhesive layer is transferred onto a light-emitting element arranged on a transfer substrate by irradiating laser light from the substrate side. As shown in FIG. 8, in the transfer process (A1), a laser light is irradiated from the substrate (11) side to transfer and arrange the reorganization (16) of the anisotropic conductive adhesive layer (12) at a predetermined location on the wiring substrate (21). A laser light is irradiated from the substrate (11) side to transfer the reorganization (16) of the anisotropic conductive adhesive layer (12) onto a light-emitting element (30) arranged on the transfer substrate.

[0069] In the same manner as the first embodiment described above, a lift device may be used for transferring the anisotropic conductive adhesive layer (12) and the anisotropic conductive adhesive layer (12). By using a lift device, a shock wave is generated on the anisotropic conductive adhesive layer (12) irradiated with laser light at the interface between the substrate (11) and the anisotropic conductive adhesive layer (12), and a plurality of the anisotropic conductive adhesive layers (16) are peeled off from the substrate (11) and lifted toward the light-emitting element (30) arranged on the transfer substrate, thereby allowing the anisotropic conductive adhesive layer (16) to be placed on the light-emitting element (30) with high precision, thereby enabling a reduction in the tact time.

[0070] [Retransfer Process (A2)]

[0071] FIG. 9 is a cross-sectional view schematically illustrating the state of re-transferring a light-emitting element with a re-transferred portion onto a wiring substrate. As shown in FIG. 9, in the re-transfer process (A2), a light-emitting element (30) with a re-transferred portion (16) is re-transferred onto a wiring substrate. The method of re-transferring is not particularly limited, but examples include a method of directly transferring and placing the light-emitting element (30) with a re-transferred portion (16) from a transfer substrate (40) to a wiring substrate (20) by a laser lift-off method (LLO method), or a method of transferring and placing the light-emitting element (30) from a transfer substrate (40) to a wiring substrate (20) using a transfer substrate to which the light-emitting element (30) with a re-transferred portion (16) has been previously attached.

[0072] In addition, in the retransfer process (A2), it is preferable to transfer the light-emitting element (30) in units of subpixels constituting one pixel. By doing so, it is possible to support light-emitting element arrays from high PPI (Pixels Per Inch) to low PPI.

[0073] [Packaging Process (BB)]

[0074] In the mounting process (BB), a light-emitting element (30) arranged at a predetermined position on a wiring board (20) is mounted by interposing a rearrangement (16). The state in which the light-emitting element (30) is mounted is the same as in FIG. 3. As a method for mounting the light-emitting element (30) on the wiring board (20), a connection method such as thermal compression, which is used in known anisotropic conductive films, can be appropriately selected and used. Thus, the light-emitting element (30) can be anisotropically connected on the wiring board (20) in a state where the wiring board (20) is exposed and there is no anisotropic conductive adhesive layer between the light-emitting elements (30). In addition, by making the wiring board (20) a light-transmitting substrate, excellent light transmittance can be obtained compared to the case where the anisotropic conductive film is attached to the entire surface of the wiring board (20).

[0075] As explained above, according to the manufacturing method of the display device related to the second embodiment, the anisotropic conductive adhesive layer (12) can be transferred and arranged to the light-emitting element (30) with high precision and high efficiency by irradiation of laser light, so the takt time can be shortened.

[0076] [A variation of the second embodiment]

[0077] In the transfer process (A1) of the second embodiment described above, as shown in FIG. 8, the anisotropic conductive adhesive layer (12) is transferred to the light-emitting element (30), but this is not limited to this, and for example, the anisotropic conductive adhesive layer may be transferred to the light-emitting element in electrode units. That is, for example, the first transfer and the second transfer may be transferred to the first conductivity type electrode (32) on the p side and the second conductivity type electrode (33) on the n side of the light-emitting element (30), respectively. By doing so, the transparency of the display device can be improved.

[0078] Examples

[0079] <2. Examples>

[0080] In this embodiment, an anisotropic conductive adhesive layer formed on quartz glass was placed facing pure glass, and a laser light was irradiated from the substrate side to transfer and align the anisotropic conductive adhesive layer at a predetermined location on the pure glass. Then, the alignment on the pure glass was evaluated visually using a metallographic microscope. Furthermore, this embodiment is not limited to these examples.

[0081] [Fabrication of Anisotropic Conductive Adhesive Layer]

[0082] An anisotropic conductive adhesive layer substrate was prepared by laminating an anisotropic conductive adhesive layer, in which conductive particles with an average particle size of 2.2 μm were aligned, onto quartz glass, and forming an anisotropic conductive adhesive layer with a thickness of 4 μm on the quartz glass. The binder of the anisotropic conductive adhesive layer was prepared by mixing 42 parts by mass of phenoxy resin (product name: PKHH, manufactured by Tomoe Chemical Industry Co., Ltd.), 40 parts by mass of high-purity bisphenol A type epoxy resin (product name: YL-980, manufactured by Mitsubishi Chemical Co., Ltd.), 10 parts by mass of hydrophobic silica (product name: R202, manufactured by Nippon Aerosil Co., Ltd.), 3 parts by mass of acrylic rubber (product name: SG80H, manufactured by Nagase Chemtex Co., Ltd.), and 5 parts by mass of cation polymerization initiator (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.), applying it onto a PET film with a thickness of 50 μm, and drying it to prepare a resin layer. Conductive particles (average particle size 2.2 μm, resin core metal-coated fine particles, Ni plating thickness 0.2 μm, manufactured by Sekisui Chemical Industry Co., Ltd.) from the obtained resin layer were aligned so that the interface of one side of the resin layer and the conductive particles approximately coincided by the method described in Japanese Patent No. 6187665. The alignment of the conductive particles in the planar view of the anisotropic conductive adhesive layer was such that the distance between the conductive particles was twice the particle diameter in a hexagonal lattice arrangement.

[0083] [Transfer of Anisotropic Conductive Adhesive Layer]

[0084] Using a lift device (MT-30C200), the anisotropic conductive adhesive layer was transferred to pure glass. As described above, the lift device comprises a telescope that converts pulsed laser light emitted from a laser device into parallel light, a shaping optical system that uniformly shapes the spatial intensity distribution of the pulsed laser light passing through the telescope, a mask that passes the pulsed laser light shaped by the shaping optical system into a predetermined pattern, a field lens located between the shaping optical system and the mask, and a projection lens that projects the laser light passing through the pattern of the mask onto a donor substrate in a reduced size. The anisotropic conductive adhesive layer substrate, which is the donor substrate, is held on a donor stage, and the pure glass, which is the receptor substrate, is held on a receptor stage, so that the distance between the anisotropic conductive adhesive layer and the pure glass is 100 μm.

[0085] The laser device used an excimer laser with an oscillation wavelength of 248 nm. The pulse energy of the laser light was 600 J, the fluence was 150 J / cm², the pulse width (irradiation time) was 30,000 picoseconds, the pulse frequency was 0.01 kHz, and the number of irradiation pulses was set to 1 pulse per ACF1 subpiece. The pulse energy of the laser light irradiated at the interface between the anisotropic conductive adhesive layer and the substrate was 0.001 to 2 J, the fluence was 0.001 to 2 J / cm², and the pulse width (irradiation time) was 0.01 to 1 × 10⁻⁶. 9 It was picoseconds, the pulse frequency was 0.1 to 10000 Hz, and the number of irradiation pulses was 1 to 30,000,000.

[0086] The mask used a pattern in which an array of windows of a predetermined size at a predetermined pitch was formed so that the projection at the interface between the anisotropic conductive adhesive layer of the donor substrate and the quartz glass was an array of laser light of 30 μm in height and 40 μm in width with a vertical pitch of 120 μm and a horizontal pitch of 160 μm.

[0087] [Warrior's Evaluation]

[0088] The reaction rate of the reorganization of the anisotropic conductive adhesive layer arranged on pure glass was measured to be 17.4%. The reaction rate was determined by the reduction rate of epoxy groups during the reorganization of the anisotropic conductive adhesive layer using FT-IR. In other words, the extent to which the epoxy groups during reorganization prior to transfer were reduced by transfer using laser light was determined by the 914 cm⁻¹ of the infrared absorption spectrum. -1 It was obtained by measuring the absorption.

[0089] Figure 10 is a metallographic micrograph showing the arrangement of an anisotropic conductive adhesive layer arranged on pure glass, and Figure 11 is an enlarged image of the metallographic micrograph shown in Figure 10. As shown in Figures 10 and 11, it was confirmed that the arrangement of the anisotropic conductive adhesive layer on pure glass was transferred according to the pattern of the mask. That is, it was found that the arrangement of the anisotropic conductive adhesive layer can be transferred and arranged with high precision and high efficiency by irradiation with laser light, thereby enabling a reduction in takt time.

[0090] Although embodiments of the present invention have been described in detail above, the present invention can be expressed from another perspective as follows (1) to (29) and (U1) to (U18).

[0091] (1) A transfer process in which an anisotropic conductive adhesive layer formed on a substrate that is transparent to laser light is placed opposite a wiring board, and a laser light is irradiated from the substrate side to transfer and arrange the anisotropic conductive adhesive layer at a predetermined location on the wiring board, and

[0092] A method for manufacturing a display device having a mounting process for mounting a light-emitting element on a reorganized portion arranged at a predetermined position on the above-mentioned wiring board.

[0093] (2) A method for manufacturing a display device described in (1), wherein the anisotropic conductive adhesive layer is arranged in a pixel-by-pixel manner in the above transfer process.

[0094] (3) A method for manufacturing a display device described in (1), wherein the anisotropic conductive adhesive layer is arranged in units of subpixels constituting one pixel in the above transfer process.

[0095] (4) A method for manufacturing a display device described in (1), wherein the anisotropic conductive adhesive layer is arranged in a plurality of pixel units in the above transfer process.

[0096] (5) A method for manufacturing a display device described in (1), wherein the anisotropic conductive adhesive layer is arranged in the above transfer process in the electrode unit of the light-emitting element.

[0097] (6) A method for manufacturing a display device as described in any one of (1) to (5), wherein the distance between the reorganizations arranged at a predetermined position on the wiring board is 3 μm or more.

[0098] (7) A method for manufacturing a display device as described in any one of (1) to (6), wherein the reaction rate of the reorganization after the above transfer process is 25% or less.

[0099] (8) The wavelength of the laser light is 180 nm to 360 nm, and

[0100] A method for manufacturing a display device as described in any one of claims (1) to (7), wherein the above-mentioned anisotropic conductive adhesive layer comprises a resin having a maximum absorption wavelength of 180 nm to 360 nm.

[0101] (9) The above anisotropic conductive adhesive layer is a method for manufacturing a display device as described in any one of (1) to (8) containing conductive particles.

[0102] (10) A method for manufacturing a display device described in any one of (1) to (9), wherein the anisotropic conductive adhesive layer is configured by aligning the conductive particles in a plane direction.

[0103] (11) A method for manufacturing a display device described in (9) or (10) in which the conductive particles are not present in the region of 0 to 0.05 μm in the thickness direction from the side on which the substrate is formed of the anisotropic conductive adhesive layer.

[0104] (12) The conductive particles are metal-coated resin particles in which the surface of a resin particle is coated with metal, or metal-coated inorganic particles in which the surface of a resin inorganic particle is coated with metal, and

[0105] A method for manufacturing a display device described in any one of claims (9) to (11), wherein the thickness of the coating by the above metal is 0.15 μm or more.

[0106] (13) A method for manufacturing a display device as described in any one of claims (9) to (12), wherein the metal constituting the conductive particles comprises a metal having a melting point of 1400°C or higher.

[0107] (14) A transfer process in which an anisotropic conductive adhesive layer formed on a substrate that is transparent to laser light is positioned opposite a light-emitting element arranged on a transfer substrate, and a laser light is irradiated from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate, and

[0108] A retransfer process for retransferring the light-emitting element on which the above reorganization has been transferred onto the wiring substrate, and

[0109] A method for manufacturing a display device having a mounting process for mounting a light-emitting element arranged at a predetermined position on the wiring board by means of the above-mentioned reorganization.

[0110] (15) A method for manufacturing a display device described in (14), wherein the anisotropic conductive adhesive layer is transferred in electrode units onto the light-emitting element in the above transfer process.

[0111] (16) A method for manufacturing a display device described in (14) or (15), wherein in the above retransfer process, the light-emitting element is transferred in units of subpixels constituting one pixel.

[0112] (17) A method for manufacturing a wiring board with an anisotropic conductive adhesive layer attached, comprising the steps of: facing the wiring board with an anisotropic conductive adhesive layer formed on a substrate, and irradiating a laser light from the substrate side to transfer the anisotropic conductive adhesive layer to a predetermined location on the wiring board.

[0113] (18) A method for manufacturing a light-emitting element having an anisotropic conductive adhesive layer attached thereto, wherein the anisotropic conductive adhesive layer formed on the substrate and the light-emitting element arranged on the transfer substrate are positioned opposite each other, and a laser light is irradiated from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate.

[0114] (19) Anisotropic conductive adhesive layer on a film used for transfer by laser lift-off.

[0115] (20) Anisotropic conductive adhesive layer on a film as described in (19) containing conductive particles.

[0116] (21) A film-like anisotropic conductive adhesive layer described in (20) in which the conductive particles are not present in the thickness direction from the surface of the substrate formed during the transfer by the laser lift-off.

[0117] (22) The conductive particles are metal-coated resin particles in which the surface of a resin particle is coated with metal, or metal-coated inorganic particles in which the surface of a resin inorganic particle is coated with metal, and

[0118] The thickness of the coating by the above metal is 0.15 μm or more, and the film-like anisotropic conductive adhesive layer described in (20) or (21).

[0119] (23) A film-like anisotropic conductive adhesive layer described in any one of claims (20) to (22), wherein the metal constituting the conductive particles comprises a metal having a melting point of 1400°C or higher.

[0120] (24) The metal constituting the conductive particles is a film-like anisotropic conductive adhesive layer described in any one of claims (20) to (23), comprising nickel, palladium or ruthenium.

[0121] (25) A substrate with an anisotropic conductive adhesive layer laminated thereon, used for transfer by laser lift-off.

[0122] (26) Application of an anisotropic conductive adhesive layer, anisotropic conductive adhesive layer for laser lift-off transfer.

[0123] (27) Application for manufacturing an anisotropic conductive adhesive layer, anisotropic conductive adhesive layer for laser lift-off transfer.

[0124] (28) Application for manufacturing a substrate laminated with an anisotropic conductive adhesive layer, used for transfer by laser lift-off of anisotropic conductive adhesive layer.

[0125] (29) Application of anisotropic conductive adhesive layer to laser lift-off.

[0126] (U1) A transfer mechanism that places an anisotropic conductive adhesive layer formed on a substrate having transparency to laser light and a wiring board facing each other, and irradiates laser light from the substrate side to transfer and arrange the anisotropic conductive adhesive layer at a predetermined location on the wiring board, and

[0127] A manufacturing system for a display device having a mounting mechanism for mounting a light-emitting element on a reorganization arranged at a predetermined position on the above-mentioned wiring board.

[0128] (U2) A manufacturing system for a display device described in (U1) in which the anisotropic conductive adhesive layer is arranged in units of 1 pixel in the above-described transfer mechanism.

[0129] (U3) A manufacturing system for a display device described in (U1) in which the anisotropic conductive adhesive layer is arranged in units of subpixels constituting one pixel in the above-described transfer mechanism.

[0130] (U4) A manufacturing system for a display device described in (U1) in which the anisotropic conductive adhesive layer is arranged in a plurality of pixel units in the above-described transfer mechanism.

[0131] (U5) A manufacturing system for a display device described in (U1) in which the anisotropic conductive adhesive layer is arranged in the above-described transfer mechanism in the electrode unit of the above-described light-emitting element.

[0132] (U6) A manufacturing system for a display device described in any one of (U1) to (U5), wherein the distance between the reorganizations arranged at a predetermined position on the wiring board is 3 μm or more.

[0133] (U7) A manufacturing system for a display device described in any one of (U1) to (U6), wherein the reaction rate of reorganization after transfer by the above-mentioned transfer mechanism is 25% or less.

[0134] (U8) The wavelength of the laser light is 180 nm to 360 nm, and

[0135] A manufacturing system for a display device described in any one of claims (U1) to (U7), wherein the above-mentioned anisotropic conductive adhesive layer comprises a resin having a maximum absorption wavelength at 180 nm to 360 nm.

[0136] (U9) The above anisotropic conductive adhesive layer is a manufacturing system for a display device described in any one of (U1) to (U8) containing conductive particles.

[0137] (U10) A manufacturing system for a display device described in (U9), wherein the anisotropic conductive adhesive layer is configured by aligning the conductive particles in a planar direction.

[0138] (U11) A manufacturing system for a display device described in (U9) or (U10) in which the conductive particles are not present in a region of 0 to 0.05 μm in the thickness direction from the side on which the substrate is formed of the anisotropic conductive adhesive layer.

[0139] (U12) The conductive particles are metal-coated resin particles in which the surface of a resin particle is coated with metal, or metal-coated inorganic particles in which the surface of an inorganic particle is coated with metal, and

[0140] A manufacturing system for a display device described in any one of claims (U9) to (U11), wherein the coating thickness by the above metal is 0.15 μm or more.

[0141] (U13) A manufacturing system for a display device as described in any one of claims (U9) to (U12), wherein the metal constituting the conductive particles comprises a metal having a melting point of 1400°C or higher.

[0142] (U14) A transfer mechanism that places an anisotropic conductive adhesive layer formed on a substrate that is transparent to laser light and a light-emitting element arranged on a transfer substrate facing each other, and irradiates laser light from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate, and

[0143] A retransfer mechanism for retransferring the light-emitting element, on which the above-mentioned reorganization has been transferred, onto the wiring board, and

[0144] A manufacturing system for a display device having a mounting mechanism for mounting a light-emitting element arranged at a predetermined position on the wiring board by means of the above-mentioned reorganization.

[0145] (U15) A manufacturing system for a display device described in (U14) in which the anisotropic conductive adhesive layer is reorganized and transferred onto the light-emitting element in electrode units.

[0146] (U16) A manufacturing system for a display device described in (U14) or (U15) that transfers the light-emitting element in units of subpixels constituting one pixel in the above retransfer mechanism.

[0147] (U17) A manufacturing system for a wiring board having an anisotropic conductive adhesive layer attached thereto, comprising a mechanism for positioning an anisotropic conductive adhesive layer formed on a substrate and a wiring board facing each other, and irradiating a laser light from the substrate side to transfer the anisotropic conductive adhesive layer to a predetermined location on the wiring board.

[0148] (U18) A manufacturing system for a light-emitting element having an anisotropic conductive adhesive layer attached thereto, comprising a transfer mechanism in which an anisotropic conductive adhesive layer formed on a substrate and a light-emitting element arranged on a transfer substrate are positioned opposite each other, and a laser light is irradiated from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate.

[0149] Each component requirement in the many embodiments described above can be subdivided and each subdivided component requirement can be introduced into these (1) to (29) and (U1) to (U18) individually or in combination. Explanation of the symbols

[0150] 10 : Substrate 11 : Entry 12: Anisotropic conductive adhesive layer 12a : Reorganization 13: Challenge Particles 20 : Wiring board 21 : Entry 22: First electrode 23: Second electrode 30 : Light-emitting element 31, 32: First conductivity type electrode 33 : Second conductivity type electrode 40: Transfer substrate 41 : Entry

Claims

Claim 1 A method for manufacturing a display device comprising: a transfer process in which an anisotropic conductive adhesive layer formed on a substrate having transmittance to laser light is positioned opposite a wiring substrate, and a laser light is irradiated from the substrate side to transfer and arrange the anisotropic conductive adhesive layer at a predetermined location on the wiring substrate; and a mounting process in which a light-emitting element is mounted on the arrangement of the anisotropic conductive adhesive layer at a predetermined location on the wiring substrate. Claim 2 A method for manufacturing a display device according to claim 1, wherein in the transfer process, the anisotropic conductive adhesive layer is arranged in units of one pixel. Claim 3 A method for manufacturing a display device according to claim 1, wherein in the transfer process, the anisotropic conductive adhesive layer is arranged in units of subpixels constituting one pixel. Claim 4 A method for manufacturing a display device according to claim 1, wherein in the transfer process, the anisotropic conductive adhesive layer is arranged in a plurality of pixel units. Claim 5 A method for manufacturing a display device according to claim 1, wherein in the transfer process, the anisotropic conductive adhesive layer is arranged in units of electrodes of the light-emitting element. Claim 6 A method for manufacturing a display device according to any one of claims 1 to 5, wherein the distance between the arrangements arranged at a predetermined position on the wiring board is 3 μm or more. Claim 7 A method for manufacturing a display device according to any one of claims 1 to 5, wherein the reaction rate of the reorganization after the transfer process is 25% or less. Claim 8 A method for manufacturing a display device according to any one of claims 1 to 5, wherein the wavelength of the laser light is 180 nm to 360 nm, and the anisotropic conductive adhesive layer comprises a resin having a maximum absorption wavelength at a wavelength of 180 nm to 360 nm. Claim 9 A method for manufacturing a display device containing conductive particles, wherein the anisotropic conductive adhesive layer in any one of claims 1 to 5. Claim 10 A method for manufacturing a display device according to claim 9, wherein the anisotropic conductive adhesive layer is configured by aligning the conductive particles in a planar direction. Claim 11 A method for manufacturing a display device according to claim 9, wherein the conductive particles are not present in a region of 0 to 0.05 μm in the thickness direction from the side on which the substrate is formed in the anisotropic conductive adhesive layer. Claim 12 A method for manufacturing a display device according to claim 9, wherein the conductive particles are metal-coated resin particles in which the surface of a resin particle is coated with metal, or metal-coated inorganic particles in which the surface of an inorganic particle is coated with metal, and the coating thickness by the metal is 0.15 μm or more. Claim 13 A method for manufacturing a display device according to claim 9, wherein the metal constituting the conductive particles comprises a metal having a melting point of 1400°C or higher. Claim 14 A method for manufacturing a display device comprising: a transfer process in which an anisotropic conductive adhesive layer formed on a substrate having transmittance to laser light is positioned oppositely to a light-emitting element arranged on a transfer substrate, and a laser light is irradiated from the substrate side to transfer a portion of the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate; a re-transfer process in which the light-emitting element onto which the portion has been transferred is re-transferred onto a wiring substrate; and a mounting process in which the light-emitting element arranged at a predetermined position on the wiring substrate is mounted via the portion. Claim 15 In claim 14, a method for manufacturing a display device wherein, in the transfer process, the anisotropic conductive adhesive layer is transferred to the light-emitting element in electrode units. Claim 16 A method for manufacturing a display device according to claim 14 or 15, wherein in the retransfer process, the light-emitting element is transferred in units of subpixels constituting one pixel. Claim 17 A method for manufacturing a wiring board having an anisotropic conductive adhesive layer attached thereto, comprising a process of facing an anisotropic conductive adhesive layer formed on a substrate and a wiring board, and irradiating a laser light from the substrate side to transfer the anisotropic conductive adhesive layer to a predetermined location on the wiring board. Claim 18 A method for manufacturing a light-emitting element having an anisotropic conductive adhesive layer attached thereto, comprising a transfer process in which an anisotropic conductive adhesive layer formed on a substrate is positioned opposite a light-emitting element arranged on a transfer substrate, and a laser light is irradiated from the substrate side to transfer the anisotropic conductive adhesive layer onto the light-emitting element arranged on the transfer substrate.

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