Substrate processing apparatus and maintenance method for substrate processing apparatus

Abstract

[Project] To provide a technology that enables easy maintenance of the inner wall member of a substrate processing device. [Solution] The disclosed substrate processing apparatus comprises a chamber, a substrate support, a support member, an inner wall member, a contact member, and an actuator. The substrate support is installed within the chamber. The support member is installed above the substrate support. The inner wall member includes a ceiling portion that can be positioned above the substrate support or below the support member. The contact member is mounted on one of the support member and the inner wall member. The contact member is configured to detachably secure the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member. The actuator is configured to move the inner wall member downward to release the securing of the inner wall member to the support member.

Description

Technology Field

[0001] An exemplary embodiment of the present disclosure relates to a substrate processing apparatus and a maintenance method for the substrate processing apparatus. Background Technology

[0002] A substrate processing device is used for processing a substrate. The substrate processing device comprises a chamber and a substrate support. The substrate support supports the substrate within the chamber. The substrate is processed within the chamber. In a plasma processing device, which is a type of substrate processing device, the substrate is processed by chemical species from plasma generated from a processing gas within the chamber. Patent Document 1 below discloses such a plasma processing device. Prior art literature

[0003] Japanese Patent Publication No. 2019-197849 The problem to be solved

[0004] The present disclosure provides a technology that enables easy maintenance of an inner wall member of a substrate processing device. means of solving the problem

[0005] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus comprises a chamber, a substrate support, a support member, an inner wall member, a contact member, and an actuator. The chamber includes a side wall providing an opening. The substrate support is installed within the chamber. The support member is installed above the substrate support. The inner wall member includes a ceiling portion that can be positioned above the substrate support and below the support member. The contact member is mounted on one of the support member and the inner wall member. The contact member is configured to detachably secure the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member. The actuator is configured to move the inner wall member downward to release the securing of the inner wall member to the support member. Effects of the invention

[0006] According to one exemplary embodiment, it is possible to easily maintain the inner wall member of the substrate processing device. Brief explanation of the drawing

[0007] FIG. 1 is a drawing illustrating a substrate processing system according to one exemplary embodiment. FIG. 2 is a schematic diagram illustrating a substrate processing apparatus according to one exemplary embodiment. FIG. 3 is a partial enlarged cross-sectional view of a substrate processing apparatus according to one exemplary embodiment. FIG. 4 is a partial enlarged cross-sectional view of a substrate processing apparatus according to one exemplary embodiment. FIG. 5 is a plan view illustrating an example contact member in a substrate processing apparatus according to one exemplary embodiment. FIG. 6 is a plan view illustrating another example of a contact member in a substrate processing apparatus according to one exemplary embodiment. FIG. 7 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 8 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 9 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 10 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 11 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 12 is a drawing illustrating the state of a substrate processing apparatus when a maintenance method according to one exemplary embodiment is performed. FIG. 13 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to another exemplary embodiment. FIG. 14 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to another exemplary embodiment. FIG. 15 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to another exemplary embodiment. FIG. 16 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 17 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. Figures 18 (a) and (b) are each plan views illustrating an enlarged portion of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. FIG. 19 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 20 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. FIG. 21 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 22 is an enlarged perspective view illustrating a part of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. FIG. 23 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 24 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. FIG. 25 is a partial enlarged cross-sectional view of a contact mechanism according to another exemplary embodiment. FIG. 26 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. Figures 27 (a) and (b) are each partially enlarged cross-sectional views of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. FIG. 28 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 29 is a partial enlarged cross-sectional view of a substrate processing device according to another exemplary embodiment. FIG. 30 is a partial enlarged cross-sectional view of a substrate processing device according to another exemplary embodiment. FIG. 31 is a partial enlarged cross-sectional view of a substrate processing device according to another exemplary embodiment. Specific details for implementing the invention

[0008] Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, identical or substantial parts in each drawing are given the same reference numerals.

[0009] FIG. 1 is a drawing illustrating a substrate processing system according to one exemplary embodiment. The substrate processing system (PS) illustrated in FIG. 1 comprises process modules (PM1 to PM6), a transport module (CTM), and a control unit (MC).

[0010] The substrate processing system (PS) may additionally be equipped with supports (2a to 2d), containers (4a to 4d), an aligner (AN), load lock modules (LL1, LL2), and a conveying module (TM). Additionally, the number of supports, containers, and load lock modules in the substrate processing system (PS) may be any number of one or more. Additionally, the number of process modules in the substrate processing system (PS) may be any number of one or more.

[0011] Supports (2a to 2d) are arranged along one edge of the loader module (LM). Containers (4a to 4d) are each mounted on the supports (2a to 2d). Each of the containers (4a to 4d) is a container called, for example, a FOUP (Front Opening Unified Pod). Each of the containers (4a to 4d) is configured to accommodate a substrate (W) inside.

[0012] The loader module (LM) is equipped with a chamber. The pressure inside the chamber of the loader module (LM) is set to atmospheric pressure. The loader module (LM) is equipped with a conveying device (TU1). The conveying device (TU1) is, for example, a conveying robot and is controlled by a control unit (MC). The conveying device (TU1) is configured to convey a substrate (W) through the chamber of the loader module (LM). The conveying device (TU1) can convey the substrate (W) between each of the containers (4a to 4d) and the aligner (AN), between the aligner (AN) and each of the load lock modules (LL1, LL2), and between each of the load lock modules (LL1, LL2) and each of the containers (4a to 4d). The aligner (AN) is connected to the loader module (LM). The aligner (AN) is configured to perform position adjustment (position correction) of the substrate (W).

[0013] Each of the load lock module (LL1) and the load lock module (LL2) is installed between the loader module (LM) and the return module (TM). Each of the load lock module (LL1) and the load lock module (LL2) provides a preliminary depressurization chamber. Each of the load lock module (LL1) and the load lock module (LL2) is connected to the loader module (LM) via a gate valve. Additionally, each of the load lock module (LL1) and the load lock module (LL2) is connected to the return module (TM) via a gate valve.

[0014] The return module (TM) is equipped with a return chamber (TC) capable of depressurizing. The return module (TM) is equipped with a return device (TU2). The return device (TU2) is, for example, a return robot and is controlled by a control unit (MC). The return device (TU2) is configured to return a substrate (W) through the return chamber (TC). The return device (TU2) can return a substrate (W) between each of the load lock modules (LL1, LL2) and each of the process modules (PM1 to PM6), and between any two process modules among the process modules (PM1 to PM6).

[0015] Each of the process modules (PM1 to PM6) is connected to a return module (TM) via a gate valve. Each of the process modules (PM1 to PM6) is a device configured to perform dedicated substrate processing. At least one of the process modules (PM1 to PM6) is a substrate processing device according to an exemplary embodiment described below.

[0016] The transfer module (CTM) is equipped with a chamber and a transfer device. The transfer module (CTM) is controlled by a control unit (MC). The transfer module (CTM) is configured to be movable in order to connect to the chamber of the substrate processing device. Additionally, the transfer module (CTM) is configured to connect the internal space of the chamber of the substrate processing device and the internal space of the chamber of the transfer module (CTM) to each other while the internal spaces are in a depressurized state. The transfer device of the transfer module (CTM) is equipped with a transfer arm (CA) (see FIG. 7). The transfer arm (CA) is configured to transfer an inner wall member of the substrate processing device between the internal space of the chamber of the substrate processing device and the outside (in one example, the internal space of the chamber of the transfer module (CTM)).

[0017] The control unit (MC) is configured to control each part of the substrate processing system (PS). The control unit (MC) may be a computer equipped with a processor, a memory device, an input device, a display device, etc. The control unit (MC) executes a control program stored in the memory device and controls each part of the substrate processing system (PS) based on recipe data stored in the memory device. The maintenance method according to the exemplary embodiment described below can be executed in the substrate processing system (PS) by controlling each part of the substrate processing system (PS) by the control unit (MC).

[0018] Hereinafter, a substrate processing apparatus according to an exemplary embodiment will be described with reference to FIGS. 2 to 4. FIG. 2 is a schematic drawing illustrating a substrate processing apparatus according to one exemplary embodiment. FIGS. 3 and FIGS. 4 are each partially enlarged cross-sectional views of a substrate processing apparatus according to one exemplary embodiment. The substrate processing apparatus (1) illustrated in FIGS. 2 to 4 can be used as one or more process modules of a substrate processing system (PS).

[0019] The substrate processing device (1) is a capacitively coupled plasma processing device. The substrate processing device (1) comprises a chamber (10), a substrate support (12), a support member (14), an inner wall member (16), one or more contact members (18), and an actuator (20).

[0020] The chamber (10) provides an internal space therein. The chamber (10) is formed of a metal such as aluminum. The chamber (10) is electrically grounded. A corrosion-resistant film may be formed on the surface of the chamber (10). The corrosion-resistant film is formed of a material such as, for example, aluminum oxide or yttrium oxide.

[0021] The chamber (10) includes a side wall (10s). The side wall (10s) has a roughly cylindrical shape. The central axis of the side wall (10s) extends in a vertical direction and is shown as the axis (AX) in FIG. 2. The side wall (10s) provides a passage (10p). The internal space of the chamber (10) is connected to the internal space of the return chamber (TC) of the return module (TM) via the passage (10p). The passage (10p) can be opened and closed by a gate valve (10g). When a substrate (W) is returned between the internal space of the chamber (10) and the outside of the chamber (10) (i.e., the internal space of the return chamber (TC)), it passes through the passage (10p).

[0022] The side wall (10s) additionally provides an opening (10o). The opening (10o) has a size through which the inner wall member (16) can pass. The internal space of the chamber (10) can be connected to the internal space of the chamber of the return module (CTM) through the opening (10o). The opening (10o) can be opened and closed by a gate valve (10v).

[0023] The chamber (10) may additionally include an upper section (10u). The upper section (10u) extends from the top of the side wall (10s) in a direction intersecting the axis (AX). The upper section (10u) provides an opening in the area intersecting the axis (AX).

[0024] The substrate processing device (1) is additionally equipped with an exhaust device (11). The exhaust device (11) includes a pressure regulator, such as an automatic pressure control valve, and a pressure reducing pump, such as a turbo molecular pump. The exhaust device (11) is connected to the internal space of the chamber (10) through the bottom portion of the chamber (10).

[0025] A substrate support (12) is installed within the chamber (10). The substrate support (12) is configured to support a substrate (W) mounted thereon. The substrate support (12) may include a base (22) and an electrostatic chuck (24). The base (22) has a roughly disc shape. The central axis of the base (22) roughly coincides with the axis (AX). The base (22) is formed of a conductor such as aluminum. The base (22) provides a flow path (22f) within it. The flow path (22f) is, for example, spirally connected. The flow path (22f) is connected to a chiller unit (23). The chiller unit (23) is installed outside the chamber (10). The chiller unit (23) supplies a heat medium (for example, a refrigerant) to the flow path (22f). The heat medium supplied to the Euro (22f) flows inside the Euro (22f) and returns to the chiller unit (23).

[0026] The electrostatic chuck (24) is installed on a base (22). The electrostatic chuck (24) includes a main body and a chuck electrode. The main body of the electrostatic chuck (24) has a roughly disc shape. The central axis of the electrostatic chuck (24) roughly coincides with the axis (AX). The main body of the electrostatic chuck (24) is formed of ceramic. A substrate (W) is mounted on the upper surface of the main body of the electrostatic chuck (24). The chuck electrode is a film formed of a conductor. The chuck electrode is installed within the main body of the electrostatic chuck (24). The chuck electrode is connected to a DC power source via a switch. When voltage from the DC power source is applied to the chuck electrode, an electrostatic attraction is generated between the electrostatic chuck (24) and the substrate (W). Due to the generated electrostatic attraction, the substrate (W) is pulled towards the electrostatic chuck (24) and held by the electrostatic chuck (24). The substrate processing device (1) may provide a gas line that supplies a heating gas (e.g., helium gas) to the gap between the electrostatic chuck (24) and the back surface of the substrate (W).

[0027] The substrate support (12) may additionally support an edge ring (ER) placed thereon. The substrate (W) is mounted on the electrostatic chuck (24) within an area surrounded by the edge ring (ER). The edge ring (ER) is formed of, for example, silicon, quartz, or silicon carbide.

[0028] The substrate processing device (1) may additionally be provided with an insulating part (26). The insulating part (26) is formed of an insulating material such as quartz. The insulating part (26) may be approximately tubular in shape. The insulating part (26) extends along the outer circumference of the base (22) and the outer circumference of the electrostatic chuck (24).

[0029] The substrate processing device (1) may additionally be provided with a conductor portion (28). The conductor portion (28) is formed of a conductor such as aluminum. The conductor portion (28) may be approximately tubular in shape. The conductor portion (28) extends along the outer surface of the insulating portion (26). The conductor portion (28) extends in the circumferential direction from the outer diameter direction of the insulating portion (26). In addition, the diameter direction and the circumferential direction are each directions based on the axis (AX). The conductor portion (28) is connected to ground. In one example, the conductor portion (28) is connected to ground through the chamber (10). The conductor portion (28) may be a part of the chamber (10).

[0030] The substrate processing device (1) may additionally be equipped with a high-frequency power supply (31) and a bias power supply (32). The high-frequency power supply (31) is a power supply that generates source high-frequency power. The source high-frequency power has a frequency suitable for generating plasma. The frequency of the source high-frequency power is, for example, 27 MHz or higher. The high-frequency power supply (31) is electrically connected to an electrode within the substrate support (12) via a matching device (31m). The high-frequency power supply (31) may also be electrically connected to the support (22). The matching device (31m) is equipped with a matching circuit for matching the impedance of the load side of the high-frequency power supply (31) to the output impedance of the high-frequency power supply (31). Additionally, the high-frequency power supply (31) may be electrically connected to another electrode within the substrate support (12). Alternatively, the high-frequency power supply (31) may be connected to an upper electrode via a matching device (31m).

[0031] The bias power supply (32) is a power source that generates electric bias energy. The electric bias energy is supplied to the electrodes of the substrate support (12) to attract ions from the plasma to the substrate (W). The electric bias energy may be bias high-frequency power. The waveform of the bias high-frequency power is a sinusoidal wave having a bias frequency. The bias frequency is, for example, 13.56 MHz or less. In this case, the bias power supply (32) is electrically connected to the electrodes of the substrate support (12) via a matching unit (32m). The bias power supply (32) may also be electrically connected to the support (22). The matching unit (32m) is equipped with a matching circuit for matching the impedance of the load side of the bias power supply (32) to the output impedance of the bias power supply (32). Additionally, the bias power supply (32) may be electrically connected to another electrode within the substrate support (12).

[0032] Alternatively, the electric bias energy may be a voltage pulse generated periodically at time intervals that are the inverse of the bias frequency described above. The voltage pulse may have negative polarity. The voltage pulse may be a pulse generated as a negative DC voltage.

[0033] The support member (14) is installed above the substrate support (12). The support member (14) is installed below the upper part (10u) of the chamber (10) and also inside the side wall (10s). The support member (14) is configured to be movable upward and downward within the chamber (10).

[0034] The substrate processing device (1) may additionally be equipped with a lift mechanism (34). The lift mechanism (34) is configured to move the support member (14) upward and downward. The lift mechanism (34) includes a driving device (e.g., a motor) that generates power to move the support member (14). The lift mechanism (34) may be installed outside the chamber (10) and also above or above the upper part (10u).

[0035] The substrate processing device (1) may additionally be equipped with a bellows (36). The bellows (36) is installed between the support member (14) and the upper part (10u). The bellows (36) separates the internal space of the chamber (10) from the outside of the chamber (10). The lower end of the bellows (36) is fixed to the support member (14). The upper end of the bellows (36) is fixed to the upper part (10u).

[0036] The support member (14) has a roughly disc shape. The central axis of the support member (14) is the axis (AX). The support member (14) is formed of a conductor such as aluminum. In one embodiment, the support member (14) may form the upper electrode of a capacitively coupled plasma processing apparatus. The support member (14) may be grounded when the high-frequency power source (31) is electrically connected to the electrode within the substrate support (12). In this case, the support member (14) may be in contact with the inner wall surface of the chamber (10) via the connecting member (37).

[0037] In one embodiment, the support member (14) may form a shower head together with the ceiling portion of the inner wall member (16) described later. The shower head is configured to supply gas into the chamber (10) (or the processing space (S) described later). In this embodiment, the support member (14) provides a gas diffusion chamber (14d) and a plurality of gas holes (14h).

[0038] A gas diffusion chamber (14d) is provided within a support member (14). A gas supply unit (38) is connected to the gas diffusion chamber (14d). The gas supply unit (38) is installed outside the chamber (10). The gas supply unit (38) includes one or more gas sources, one or more flow controllers, and one or more valves used in the substrate processing device (1). Each of the one or more gas sources is connected to the gas diffusion chamber (14d) via a corresponding flow controller and a corresponding valve. A plurality of gas holes (14h) extend downward from the gas diffusion chamber (14d).

[0039] In one embodiment, the support member (14) may provide a flow path (14f) therein. The flow path (14f) is connected to a chiller unit (40). The chiller unit (40) is installed outside the chamber (10). The chiller unit (40) supplies a heat medium (e.g., a refrigerant) to the flow path (14f). The heat medium supplied to the flow path (14f) flows through the flow path (14f) and returns to the chiller unit (40).

[0040] The inner wall member (16) is configured to be conveyable between the inside and outside of the chamber (10). The inner wall member (16) may be conveyed between the inside and outside of the chamber (10) by means of a conveying arm (CA) through an opening (10o).

[0041] The inner wall member (16) is formed of a metal such as silicon, silicon carbide, or aluminum. A corrosion-resistant film may be formed on the surface of the inner wall member (16). The corrosion-resistant film is formed of a material such as aluminum oxide or yttrium oxide, for example.

[0042] The inner wall member (16) includes a ceiling portion (16c) that can be positioned above the substrate support (12) and below the support member (14). The ceiling portion (16c) is plate-shaped and also has a roughly disc shape. The ceiling portion (16c) is positioned such that its center axis is located above the axis (AX) within the chamber (10). The ceiling portion (16c) may be positioned directly below the support member (14) within the chamber (10). Alternatively, a heating sheet (42) may be clamped between the lower surface of the support member (14) and the ceiling portion (16c) of the inner wall member (16), as shown in FIG. 3.

[0043] As described above, the ceiling portion (16c) may provide a shower head together with a support member (14). In this case, the ceiling portion (16c) provides a plurality of gas holes (16h). The plurality of gas holes (16h) penetrate the ceiling portion (16c). The ceiling portion (16c) is positioned within the chamber (10) such that the plurality of gas holes (16h) each communicate with a plurality of gas holes (14h). Gas from the gas supply portion (38) described above is supplied into the chamber (10) (or processing space (S)) through the gas diffusion chamber (14d), the plurality of gas holes (14h), and the plurality of gas holes (16h).

[0044] In one embodiment, the inner wall member (16) may additionally include a side wall portion (16s). The side wall portion (16s) has a roughly tubular shape and extends downward from the periphery of the ceiling portion (16c). The side wall portion (16s) is positioned such that its central axis is located on the axis (AX) within the chamber (10). The inner wall member (16) may form a processing space (S) in which a substrate (W) mounted on the substrate support (12) is processed, together with the substrate support (12). In this case, the lower end of the side wall portion (16s) may be configured to contact the conductor portion (28).

[0045] The side wall portion (16s) may provide a plurality of through holes. The plurality of through holes of the side wall portion (16s) are connected to the space outside the side wall portion (16s) by the processing space (S). Gas within the processing space (S) is exhausted by the exhaust device (11) through the plurality of through holes of the side wall portion (16s) and the space outside the side wall portion (16s).

[0046] Hereinafter, together with FIGS. 2 to 4, FIGS. 5 and FIGS. 6 are referenced. FIG. 5 is a plan view illustrating one example of a contact member in a substrate processing apparatus according to one exemplary embodiment. FIG. 6 is a plan view illustrating another example of a contact member in a substrate processing apparatus according to one exemplary embodiment. The substrate processing apparatus (1) may have a plurality of contact members (18) as one or more contact members.

[0047] A plurality of contact members (18) may be formed of a conductor such as metal. A plurality of contact members (18) are mounted on one of the members of the support member (14) and the inner wall member (16). Each of the plurality of contact members (18) is deformed in the horizontal direction by the other member when the other member of the support member (14) and the inner wall member (16) is combined with the other member, thereby exerting a horizontal spring reaction force on the other member. By this, the plurality of contact members (18) detachably fix the inner wall member (16) to the support member (14).

[0048] In the embodiment illustrated in FIGS. 2 to 4, a plurality of contact members (18) are mounted on a support member (14). When the inner wall member (16) is combined with the support member (14), the plurality of contact members (18) are deformed in the horizontal direction by the inner wall member (16) and exert a horizontal spring reaction force on the inner wall member (16). By this, the plurality of contact members (18) detachably fix the inner wall member (16) to the support member (14).

[0049] In one embodiment, the lower surface (14b) of the support member (14) may provide a plurality of concave portions (14r). The plurality of concave portions (14r) are open toward downward. Additionally, the upper surface (16t) of the ceiling portion (16c) may provide a plurality of concave portions (16r). The plurality of concave portions (16r) are open toward upward. Each of the plurality of contact members (18) may include a first portion (181) and a second portion (182). The first portion (181) is fitted into the corresponding concave portion (14r) of the support member (14). The second portion (182) extends downward from the first portion (181) and is equipped with a spring. The spring of the second part (182) exerts a spring reaction force by being fitted into the corresponding concave part (16r) of the ceiling part (16c).

[0050] In one embodiment, a plurality of contact members (18) may be configured to be detachable from the support member (14). The first portion (181) has elasticity so that it can be pulled out from the corresponding concave portion (14r) by deformation in the horizontal direction when the contact member (18) is separated from the support member (14). In one embodiment, each of the plurality of concave portions (14r) of the support member (14) may be narrowed at the lower opening.

[0051] In one embodiment, the first part (181) may have an arc shape in any cross section including the axis (AX), and its interior may be hollow. Additionally, the first part (181) may be open at its lower end. This first part (181) has elasticity in the horizontal direction. The first part (181) passes through the lower opening of each of the plurality of concave parts (14r) in a horizontally contracted state and is drawn out from the corresponding concave part (14r).

[0052] In one embodiment, the second part (182) may extend downward from the bottom of the first part (181) and may extend obliquely upward from the bottom to provide a leaf spring. The second part (182) may provide an opening at its bottom. When the second part (182) is fitted into a corresponding recess (16r) of the ceiling part (16c), it is reduced horizontally by a wall surface that partitions the recess (16r) and exerts a spring reaction force against said wall surface. By this, a plurality of contact members (18) detachably fix the inner wall member (16) to the support member (14).

[0053] In one embodiment, as shown in FIG. 5, a plurality of contact members (18) may have an annular shape extending in the circumferential direction. In this embodiment, each of the plurality of concave portions (14r) and the plurality of concave portions (16r) also has an annular shape extending in the circumferential direction. Furthermore, in this embodiment, when the inner wall member (16) is fixed to the support member (14) within the chamber (10), the plurality of contact members (18), the plurality of concave portions (14r), and the plurality of concave portions (16r) extend in the circumferential direction around the axis (AX).

[0054] In another embodiment, the plurality of contact members (18) may be arranged along a single circle or a plurality of concentric circles, as shown in FIG. 6. In this embodiment, each of the plurality of concave portions (14r) and the plurality of concave portions (16r) is also arranged along a single circle or a plurality of concentric circles. Furthermore, in this embodiment, when the inner wall member (16) is fixed to the support member (14) within the chamber (10), the plurality of contact members (18), the plurality of concave portions (14r), and the plurality of concave portions (16r) are arranged along the circumferential direction around the axis (AX).

[0055] Refer again to FIGS. 2 to 4. The actuator (20) is configured to move the inner wall member (16) downward in order to release the fixation of the inner wall member (16) to the support member (14). In one embodiment, the actuator (20) includes a driving device (20d). The actuator (20) may include a plurality of rods (20r).

[0056] The driving device (20d) is installed outside the chamber (10). The driving device (20d) generates power to move the driving shaft (20m) up and down. The driving device (20d) may include a power cylinder such as an air cylinder or a motor. The driving device (20d) is fixed to a support member (44) outside the chamber (10).

[0057] A plurality of rods (20r) are coupled to a drive shaft (20m). A plurality of rods (20r) extend downward from the drive shaft (20m). A plurality of rods (20r) are arranged along the circumferential direction around an axis (AX). A plurality of rods (20r) may be arranged at equal intervals.

[0058] The support member (14) provides a plurality of through holes extending in a vertical direction. The plurality of through holes penetrate the support member (14) from the upper surface of the support member (14) through the gas diffusion chamber (14d) to the lower surface of the support member (14). A plurality of rods (20r) are inserted into the plurality of through holes of the support member (14). A sealing member (48), such as an O-ring, is installed between the support member (14) and each of the plurality of rods (20r). Additionally, the plurality of rods (20r) pass through the inside of the tubular member (46) within the gas diffusion chamber (14d).

[0059] A plurality of rods (20r) are moved up and down by a driving device (20d). When the inner wall member (16) is fixed to the support member (14), the plurality of rods (20r) are positioned such that their lower ends are at the same horizontal level as the upper surface (16t) of the ceiling portion (16c) of the inner wall member (16) or are positioned above the upper surface (16t). When the inner wall member (16) is removed from the support member (14), the plurality of rods (20r) are moved by the driving device (20d) to move the inner wall member (16) downward while their lower ends are in contact with the upper surface (16t) of the ceiling portion (16c) of the inner wall member (16).

[0060] According to the substrate processing device (1), a plurality of contact members (18) exert a spring reaction force in the horizontal direction against the inner wall member (16) by being deformed by the inner wall member (16). By this, the inner wall member (16) is fixed to the support member (14). Additionally, by moving the inner wall member (16) downward by an actuator (20) in resistance to the spring reaction force of the plurality of contact members (18), the fixation of the inner wall member (16) to the support member (14) is easily released. The inner wall member (16), which has been released from fixation to the support member (14), can be removed from the inside of the chamber (10) to the outside through the opening (10o) of the side wall (10s) of the chamber (10). Therefore, according to the substrate processing device (1), it is possible to easily maintain the inner wall member (16).

[0061] Additionally, the substrate processing device (1) may include a single contact member (18). In this case, the number of each of the concave portion (14r) and the concave portion (16r) is one.

[0062] Hereinafter, with reference to FIGS. 7 to 12, a maintenance method for a substrate processing apparatus according to one exemplary embodiment will be described. Each of FIGS. 7 to 12 is a drawing illustrating the state of the substrate processing apparatus when the maintenance method according to one exemplary embodiment is performed. In the maintenance method, each part of the substrate processing system (PS) is controlled by a control unit (MC).

[0063] In the maintenance method, a plurality of contact members (18) are mounted on one of the members, either the support member (14) or the inner wall member (16). When the maintenance method is applied to a substrate processing device (1), a plurality of contact members (18) are mounted on the support member (14). Specifically, as shown in FIG. 7, a base (50) is brought into the chamber (10) from outside the chamber (10) by a return arm (CA). The base (50) provides a plurality of concave portions on its upper surface. A second portion (182) of the plurality of contact members (18) is fitted into the plurality of concave portions of the base (50). The base (50) is returned into the chamber (10) such that the plurality of contact members (18) are each positioned below the plurality of concave portions (14r) of the support member (14).

[0064] Next, the return arm (CA) is moved upward, or the support member (14) is moved downward by the lift mechanism (34). As a result, as shown in FIG. 8, the first portion (181) of the plurality of contact members (18) is inserted into the plurality of recesses (14r) of the support member (14), and the plurality of contact members (18) are mounted on the support member (14). After that, the return arm (CA) is withdrawn from the inside of the chamber (10) to the outside.

[0065] Next, the inner wall member (16) is brought from the outside of the chamber (10) into the inside of the chamber (10) through the opening (10o) by the return arm (CA). Next, the support member (14) or the inner wall member (16) is moved along the vertical direction. That is, the support member (14) is moved downward by the lift mechanism (34), or the inner wall member (16) is moved upward by the return arm (CA). As a result, as shown in FIG. 9, the inner wall member (16) is detachably fixed to the support member (14).

[0066] A plurality of contact members (18) are deformed in the horizontal direction by the other member among the support member (14) and the inner wall member (16), and exert a spring reaction force on said other member. In the substrate processing device (1), the other member is the inner wall member (16). Specifically, each second part (182) of the plurality of contact members (18) is fitted into a corresponding concave portion (16r) and reduced in the horizontal direction, and exerts a spring reaction force on the wall surface that forms the corresponding concave portion (16r). By this, the inner wall member (16) is fixed to the support member (14). After the inner wall member (16) is fixed to the support member (14), the return arm (CA) is withdrawn from the inside of the chamber (10) to the outside.

[0067] In the maintenance method, the inner wall member (16) is removed from the inside of the chamber (10) to the outside of the chamber (10) for maintenance (e.g., replacement). For this reason, a return arm (CA) enters from the outside of the chamber (10) into the inside of the chamber (10) through an opening (10o).

[0068] Next, the inner wall member (16) is moved downward by the actuator (20) in resistance to the spring reaction force of the plurality of contact members (18). By this, the fixation of the inner wall member (16) by the plurality of contact members (18) is released. The inner wall member (16) moved downward is transferred to the return arm (CA) as shown in FIG. 10. Next, the inner wall member (16) is discharged from the inside of the chamber (10) to the outside of the chamber (10) by the return arm (CA) through the opening (10o).

[0069] In the maintenance method, a plurality of contact members (18) may be separated for their maintenance (e.g., such replacement). For this reason, as shown in FIG. 11, a base (54) is brought from the outside of the chamber (10) into the inside of the chamber (10) through an opening (10o) by a return arm (CA). The base (54) provides a plurality of recesses (54r) on its upper surface. Each of the plurality of recesses (54r) is narrowed by a protrusion (54p) at its upper opening. The base (54) is positioned so that the plurality of recesses (54r) are located below the plurality of contact members (18).

[0070] Next, the return arm (CA) is moved upward, or the support member (14) is moved downward by the lift mechanism (34). As a result, each second part (182) of the plurality of contact members (18) is fitted into the corresponding recess (54r). Each second part (182) of the plurality of contact members (18) passes through the upper opening of the corresponding recess (54r) and then expands to have a width greater than the width of the upper opening. Next, the return arm (CA) is moved downward, or the support member (14) is moved upward by the lift mechanism (34). As a result, as shown in FIG. 12, the plurality of contact members (18) are separated from the support member (14) and transferred to the base (54). After that, multiple contact members (18) are removed from inside the chamber (10) to outside the chamber (10) by a return arm (CA).

[0071] Hereinafter, with reference to FIG. 13, a support member, an inner wall member, and a contact member according to another exemplary embodiment will be described. FIG. 13 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to another exemplary embodiment. The support member, an inner wall member, and a contact member of the embodiment shown in FIG. 13 may be employed in a substrate processing apparatus (1).

[0072] In the embodiment illustrated in FIG. 13, the upper surface (16t) of the ceiling portion (16c) provides a plurality of convex portions (16p). The plurality of convex portions (16p) protrude upward from other parts of the upper surface (16t) of the ceiling portion (16c). Additionally, in the embodiment illustrated in FIG. 13, the lower surface (14b) of the support member (14) provides a plurality of concave portions (14r). The plurality of concave portions (14r) are open toward the downward.

[0073] In the embodiment illustrated in FIG. 13, a plurality of contact members (18) may be formed of a conductor such as metal. A plurality of contact members (18) are fixed within a plurality of concave portions (14r). The wall surface of the support member (14) that partitions each of the plurality of concave portions (14r) may be provided with a female screw. The outer surface of each of the plurality of contact members (18) may be provided with a male screw. Each of the plurality of contact members (18) is fixed within a corresponding concave portion (14r) by being screwed into a female screw within the corresponding concave portion (14r).

[0074] Each of the plurality of contact members (18) provides a recess (18r) that is open toward the downward. Each of the plurality of contact members (18) includes a spring (183). The spring (183) is installed within the recess (18r). The lower end of the spring (183) is fixed directly or indirectly to a wall surface that forms the recess (18r) so that the spring (183) can deform in the horizontal direction. When the corresponding convex portion (16p) is fitted into the recess (18r), the spring (183) deforms in the horizontal direction and exerts a spring reaction force in the horizontal direction against the convex portion (16p). By this, the inner wall member (16) is fixed to the support member (14). In the embodiment illustrated in FIG. 13, when the inner wall member (16) is moved downward by the actuator (20), the fixation of the inner wall member (16) to the support member (14) is easily released.

[0075] As shown in FIG. 13, the spring (183) may be fixed to the wall forming the concave portion (18r) by the floating mechanism (184). The floating mechanism (184) absorbs the positional misalignment of the convex portion (16p) in the horizontal direction.

[0076] Hereinafter, with reference to FIG. 14, a support member, an inner wall member, and a contact member according to another exemplary embodiment will be described. FIG. 14 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. The support member, an inner wall member, and a contact member of the embodiment shown in FIG. 14 may be employed in a substrate processing apparatus (1).

[0077] In the embodiment illustrated in FIG. 14, the lower surface (14b) of the support member (14) provides a plurality of concave portions (14r). The plurality of concave portions (14r) are open toward the downward direction. In the embodiment illustrated in FIG. 14, the upper surface of the ceiling portion (16c) provides a plurality of convex portions (16p). The plurality of convex portions (16p) may include an upper portion (161) and a lower portion (162). The upper portion (161) is installed on top of the lower portion (162). The width of the upper portion (161) may be greater than the width of the lower portion (162).

[0078] In the embodiment illustrated in FIG. 14, a plurality of contact members (18) may be formed of a conductor such as metal. Each of the plurality of contact members (18) is fixed to a ceiling portion (16c) to cover a corresponding convex portion (16p). Each of the plurality of contact members (18) includes a cover portion (185). The cover portion (185) provides a cavity that is open at its lower end. The cover portion (185) covers the corresponding convex portion (16p) accommodated within the cavity. The wall surface of the cover portion (185) that forms the cavity contacts the outer surface of the upper (161) and lower (162) portions of the corresponding convex portion (16p). When the cover portion (185) is mounted on the corresponding convex portion (16p), it covers the corresponding convex portion (16p) with the opening at its lower end expanded.

[0079] Each of the plurality of contact members (18) further includes a spring (186). The spring (186) is installed on the side of the cover portion (185). The lower end of the spring (186) is fixed to the lower end of the cover portion (185). The spring (186) extends upward from the lower end of the cover portion (185) so as to be deformable in the horizontal direction. When the convex portion (16p) corresponding to each of the plurality of contact members (18) is fitted into the corresponding concave portion (14r), the spring (186) deforms in the horizontal direction and exerts a spring reaction force in the horizontal direction against the support member (14). By this, the inner wall member (16) is fixed against the support member (14). In the embodiment shown in FIG. 14, when the inner wall member (16) is moved downward by the actuator (20), the fixation of the inner wall member (16) against the support member (14) is easily released.

[0080] Hereinafter, with reference to FIG. 15, a support member, an inner wall member, and a contact member according to another exemplary embodiment will be described. FIG. 15 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. The support member, an inner wall member, and a contact member of the embodiment shown in FIG. 15 may be employed in a substrate processing apparatus (1).

[0081] In the embodiment illustrated in FIG. 15, the lower surface (14b) of the support member (14) provides a single concave portion. The concave portion provided by the lower surface (14b) of the support member (14) is approximately circular when viewed in a planar view. In the embodiment illustrated in FIG. 15, the upper surface (16t) of the ceiling portion (16c) provides a single convex portion. The convex portion provided by the upper surface (16t) of the ceiling portion (16c) is approximately circular when viewed in a planar view.

[0082] In the embodiment illustrated in FIG. 15, the contact member (18) is a spiral spring gasket. In the embodiment illustrated in FIG. 15, the contact member (18) may be formed from a conductor such as metal. The contact member (18) is installed to extend in a circumferential direction along the inner wall surface that forms the concave portion of the support member (14). The contact member (18), i.e., the spiral spring gasket, is clamped between the outer surface of the convex portion of the ceiling portion (16c) and the inner wall surface that forms the concave portion of the support member (14) by the convex portion of the ceiling portion (16c) being fitted into the concave portion of the support member (14). By this, the contact member (18) is deformed in the horizontal direction and exerts a spring reaction force against the inner wall member (16), i.e., the outer surface of the convex portion of the ceiling portion (16c). By this, the inner wall member (16) is fixed to the support member (14). In the embodiment illustrated in FIG. 15, when the inner wall member (16) is moved downward by the actuator (20), the fixation of the inner wall member (16) to the support member (14) is easily released.

[0083] Hereinafter, a substrate processing apparatus according to another exemplary embodiment will be described with reference to FIG. 16. FIG. 16 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1B) illustrated in FIG. 16 differs from the substrate processing apparatus (1) in that it has an inner wall member (16B) that replaces the inner wall member (16). The inner wall member (16B) has a ceiling portion (16c) like the inner wall member (16), but does not have a side wall portion (16s). Other configurations of the substrate processing apparatus (1B) are identical to the corresponding configurations of the substrate processing apparatus (1).

[0084] Hereinafter, a substrate processing apparatus according to several additional exemplary embodiments is described. Each of the exemplary embodiments described below is provided with a contact mechanism that electrically connects an inner wall member (16) to a grounded conductor portion (28). The inner wall member (16) is formed of a conductive material. The conductor portion (28) has a tubular shape and is connected along the outer circumference of the substrate support (12). The contact mechanism electrically connects the lower end (16e) of the side wall portion (16s) of the inner wall member (16) to the conductor portion (28).

[0085] Refer to FIGS. 17 and FIGS. 18 (a) and (b). FIG. 17 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIGS. 18 (a) and (b) are each plan views illustrating an enlarged portion of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1C) illustrated in FIG. 17 differs from the substrate processing apparatus (1) in that it includes a contact mechanism (60C). As illustrated in FIGS. 17 and FIGS. 18 (a) and (b), the contact mechanism (60C) includes a tubular body (61), a pressing body (62), and a driving part (63).

[0086] The tubular body (61) is formed of a conductive material such as aluminum. The tubular body (61) is electrically connected to the conductor portion (28) and is connected along the outer circumference of the conductor portion (28). The pressing body (62) is formed of a conductive material such as aluminum. The pressing body (62) is positioned between the substrate support (12) and the tubular body (61). The driving unit (63) is configured to rotate the tubular body (61) in a circumferential direction. The driving unit (63) includes, for example, a motor. The contact mechanism (60C) presses the pressing body (62) against the outer circumference of the lower end (16e) of the side wall portion (16s) by the circumferential rotation of the tubular body (61). By this, the contact mechanism (60C) electrically connects the inner wall member (16) to the conductor part (28) via the pressing body (62) and the tubular body (61).

[0087] In one example, the conductor portion (28) includes a plurality of guides (28p) protruding in the radial direction. The plurality of guides (28p) are arranged along the circumferential direction. Additionally, the contact mechanism (60C) includes a plurality of pressure bodies (62). The plurality of pressure bodies (62) are arranged along the circumferential direction. Each of the plurality of pressure bodies (62) provides a hole (62h) into which a corresponding guide among the plurality of guides (28p) is inserted. Each of the plurality of pressure bodies (62) is movable along the radial direction by means of a corresponding guide inserted into the hole (62h). ​​Each of the plurality of pressure bodies (62) further includes a convex portion (62p) protruding outward in the radial direction. In the illustrated example, each of the plurality of pressure bodies (62) is provided with a pair of rib-shaped convex portions (62p) on both sides of the hole (62h). The tubular body (61) includes a plurality of convex portions (61p) protruding inward in the diameter direction. The plurality of convex portions (61p) are arranged along the circumference direction.

[0088] As illustrated in FIG. 18 (a), when the corresponding convex part (61p) among the plurality of convex parts (61p) is not in contact with each convex part (62p) of the plurality of pressure bodies (62), the plurality of pressure bodies (62) do not come into contact with the lower end (16e) of the side wall part (16s). By rotating the tubular body (61) so that the corresponding convex part (61p) among the plurality of convex parts (61p) comes into contact with each convex part (62p) of the plurality of pressure bodies (62) as illustrated in FIG. 18 (b), the pressure body (62) is pressed against the outer surface of the lower end (16e) of the side wall part (16s). As a result, the inner wall member (16) is electrically connected to the conductor part (28) through the pressure body (62) and the tubular body (61). In addition, in the state shown in Fig. 18 (b), the lower end (16e) of the side wall portion (16s) can be squeezed between each of the plurality of pressure bodies (62) and the insulating portion (26).

[0089] Refer to FIGS. 19 and FIGS. 20 below. FIG. 19 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 20 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1D) illustrated in FIG. 19 differs from the substrate processing apparatus (1) in that it includes a contact mechanism (60D).

[0090] As illustrated in FIGS. 19 and 20, in a substrate processing device (1D), the conductor portion (28) provides a recess (28r) that extends circumferentially at its upper end. The contact mechanism (60D) includes a contact member (64). The contact member (64) is an elastic conductive member, for example, a spiral spring gasket. The contact member (64) extends circumferentially within the recess (28r) and is electrically connected to the conductor portion (28). In the contact mechanism (60D), the contact member (64) elastically contacts the lower end (16e) of the side wall portion (16s) disposed within the recess (28r). By this, the contact mechanism (60D) electrically connects the inner wall member (16) to the conductor portion (28) through the contact member (64). Additionally, as shown in FIG. 20, a pair of contact members (64) may pinch the lower end (16e) of the side wall (16s) within the concave portion (28r).

[0091] Refer to FIGS. 21 and FIGS. 22 below. FIG. 21 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 22 is an enlarged perspective view illustrating a part of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1E) illustrated in FIG. 21 differs from the substrate processing apparatus (1) in that it includes a contact mechanism (60E).

[0092] As illustrated in FIGS. 21 and 22, the contact mechanism (60E) includes a plurality of male connectors (601E) and a plurality of female connectors (602E). The plurality of male connectors (601E) are mounted on the lower end (16e) of the side wall portion (16s) and are arranged along the circumferential direction. The plurality of female connectors (602E) are mounted on the upper end of the conductor portion (28) and are arranged along the circumferential direction. The contact mechanism (60E) electrically connects the inner wall member (16) to the conductor portion (28) by coupling each of the plurality of male connectors (601E) with the corresponding female connector among the plurality of female connectors (602E). Additionally, a plurality of male connectors (601E) may be mounted on the upper part of the conductor portion (28), and a plurality of female connectors (602E) may be mounted on the lower part (16e) of the side wall portion (16s).

[0093] Refer to FIGS. 23 and FIGS. 24 below. FIG. 23 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 24 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1F) illustrated in FIG. 23 differs from the substrate processing apparatus (1) in that it includes a contact mechanism (60F).

[0094] The contact mechanism (60F) includes a contact member (65). The contact member (65) is a flexible thin film and is formed of a conductive material. The contact member (65) is installed within a recess provided by the conductor portion (28). The contact member (65) is supported by the conductor portion (28) and is electrically connected to the conductor portion (28). Additionally, the contact member (65) is installed to be in contact with the lower surface provided by the lower end (16e) of the side wall portion (16s). The contact mechanism (60F) electrically connects the inner wall member (16) to the conductor portion (28) through the contact member (65) by pressing the contact member (65) against the lower surface of the side wall portion (16s). Additionally, the lower surface of the lower (16e) of the side wall portion (16s) may be provided by the film (16f) of the lower (16e). The film (16f) may be formed of a conductive film or a carbon nanotube.

[0095] In one example, the contact mechanism (60F) may press the contact member (64) against the lower surface of the side wall (16s) by the pressure of a fluid (e.g., gas). In this example, the contact mechanism (60F) may further include a pressure pin (66). The pressure pin (66) is positioned such that the contact member (65) is located between its tip and the lower surface of the side wall (16s). The pressure pin (66) presses the contact member (65) against the lower surface of the side wall (16s) by the pressure of the gas supplied from the gas supply unit (67). A spring (66s) may be connected to the pressure pin (66) to push the pressure pin (66) away from the contact member (65).

[0096] Refer to FIG. 25 below. FIG. 25 is a partial enlarged cross-sectional view of a contact mechanism according to another exemplary embodiment. The contact mechanism shown in FIG. 25 includes a piezoelectric element (68). The piezoelectric element (68) is supported by an insulating portion (2) and is installed below the lower end (16e) of a side wall portion (16s). The piezoelectric element (68) includes a piezoelectric ceramic portion (68a) and a pair of electrodes (68b, 68c). The piezoelectric ceramic portion (68a) is installed between the pair of electrodes (68b, 68c). A conductor (69) is fixed to the upper surface of the piezoelectric element (68). The conductor (69) is electrically connected to the conductor portion (28). As voltage from the power source (68p) is applied to the electrode (68c), the piezoelectric element (68) extends toward the bottom (16e) of the side wall portion (16s). By doing so, the conductor (69) is pressed against the lower surface of the bottom (16e) of the side wall portion (16s). As a result, the inner wall member (16) is electrically connected to the conductor portion (28).

[0097] Refer to FIGS. 26 and FIGS. 27 (a) and (b) below. FIGS. 26 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIGS. 27 (a) and (b) are each enlarged cross-sectional views of a contact mechanism in a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus (1G) illustrated in FIGS. 26 differs from the substrate processing apparatus (1) in that it includes a contact mechanism (60G).

[0098] In the substrate processing device (1G), the conductor portion (28) has a roughly tubular shape. The conductor portion (28) provides a cavity (28h) that extends along the circumferential direction with respect to its central axis (i.e., axis (AX)). Additionally, the conductor portion (28) provides a plurality of openings (28o) that extend between the cavity (28h) and the space outside the conductor portion (28). The plurality of openings (28o) may be arranged along the circumferential direction. Additionally, the plurality of openings (28o) may be arranged at equal intervals.

[0099] The contact mechanism (60G) comprises an expandable seal (71), a plurality of compression bodies (72), one or more elastic bodies (73), and an air supply unit (74). The expandable seal (71) is installed within a cavity (28h). The expandable seal (71) may have an annular shape or may extend in a circumferential direction within the cavity (28h). The air supply unit (74) is configured to supply air to the expandable seal (71). The expandable seal (71) is configured to expand in the radial direction by air from the air supply unit (74).

[0100] Each of the plurality of compression bodies (72) is formed of a conductive material such as metal (e.g., aluminum). Each of the plurality of compression bodies (72) includes a first part (721) and a second part (722). The first part (721) is installed between the expandable seal (71) and the wall (28w) of the conductive part (28) that partitions the plurality of openings (28o). The second part (722) extends from the first part (721) into the corresponding opening among the plurality of openings (28o). In one embodiment, the tip (723) (diametric tip) of the second part (722) may be formed from a contact band.

[0101] Each of the one or more elastic bodies (73) is formed of a conductive material. The one or more elastic bodies (73) are installed between the first part (721) and the wall (28w). Each of the one or more elastic bodies (73) may have an annular shape or may be continuous in a circumferential direction within the cavity (28h). Each of the one or more elastic bodies (73) may be, for example, an obliquely wound coil spring. Also, in the illustrated example, one of the two elastic bodies (73) is installed above the second part (722), and the other of the two elastic bodies (73) is installed below the second part (722).

[0102] As shown in FIG. 27 (a), each of the second parts (722) of the plurality of compression bodies (72) does not come into contact with the inner surface of the lower end (12e) of the inner wall member (16) when the expandable seal (71) is not expanded. Meanwhile, as shown in FIG. 27 (b), each of the plurality of compression bodies (72) squeezes one or more elastic bodies (73) between the first part (721) and the wall (28w) by the expansion of the expandable seal (71) in the diameter direction, and brings the tip (723) of the second part (722) into contact with the inner surface of the lower end (12e).

[0103] The contact mechanism (60G) electrically connects the inner wall member (16) to the conductor part (28) via the plurality of pressure bodies (72) and one or more elastic bodies (73) by moving each of the plurality of pressure bodies (72) in the radial direction so that the tip (723) of the second part (722) comes into contact with the inner circumference of the lower part (12e). Therefore, it is possible to electrically connect the inner wall member (16) to the conductor part (28) without generating friction between the member of the contact mechanism (60G) and the inner wall member (16). Thus, the contact mechanism (60G) can suppress the generation of particles caused by friction. In addition, in the substrate processing device (1G), the number of pressure bodies (72) and the number of openings (28o) may each be one.

[0104] Refer to FIGS. 28 and FIGS. 29 below. FIG. 28 is a schematic drawing illustrating a substrate processing apparatus according to another exemplary embodiment. FIG. 29 is a partial enlarged cross-sectional view of a substrate processing apparatus according to another exemplary embodiment. Below, differences from the substrate processing apparatus (1) of FIG. 28 (1H) will be described.

[0105] In the substrate processing device (1H), the conductor portion (28) has a roughly tubular shape. The conductor portion (28) is installed so as to be slidable in any horizontal direction above the bottom portion of the chamber (10). In one embodiment, the substrate processing device (1H) may additionally be provided with a thrust bearing (77). The thrust bearing (77) is positioned between the bottom portion of the chamber (10) and the head portion of a bolt (78) screwed into the bottom portion. The conductor portion (28) is supported so as to be slidable above the bottom portion of the chamber (10) via the thrust bearing (77). In one embodiment, the conductor portion (28) is provided with a axial portion (28s) at its lower end. The axial portion (28s) is positioned between the thrust bearing (77) and the head portion of the bolt (78). Additionally, in the illustrated example, two thrust bearings (77) are provided between the bottom of the chamber (10) and the head of the bolt (78). One of the two thrust bearings (77) is positioned between the bottom of the chamber (10) and the shaft portion (28s). The other of the two thrust bearings (77) is positioned between the shaft portion (28s) and the head of the bolt (78). A washer (79) is positioned between the other of the two thrust bearings (77) and the head of the bolt (78).

[0106] The conductor portion (28) has a roughly tubular shape, and the outer surface (28t) of the portion (28u) is formed in a tapered shape. The inner surface (16i) of the lower end (16e) of the side wall portion (16s) of the inner wall member (16) is formed in a tapered shape corresponding to the outer surface (28t). The outer surface (28t) and the inner surface (16i) come into direct or indirect contact. By this, the inner wall member (16) is electrically connected to the conductor portion (28). In one embodiment, a contact band (28b) is installed on the outer surface (28t). The outer surface (28t) and the inner surface (16i) come into indirect contact with each other through the contact band (28b). Additionally, the lower end of the conductor portion (28) and the bottom of the chamber (10) may be electrically connected through a connecting member (76). The connecting member (76) is a member having elasticity and conductivity and is fixed to the bottom of the chamber (10). The connecting member (76) is, for example, a contact band or a conductive spiral.

[0107] In the substrate processing device (1H), even if there is a misalignment between the center axis of the inner wall member (16) and the center axis of the conductor part (28), electrical contact between the lower end (16e) of the inner wall member (16) and the upper end (28u) of the conductor part (28) is uniformly secured in the circumferential direction by the horizontal movement of the conductor part (28). In addition, since there is less friction between the lower end (16e) of the inner wall member (16) and the upper end (28u) (or contact band (28b)) of the conductor part (28), the generation of particles is suppressed.

[0108] Refer to FIG. 30 below. FIG. 30 is a partial enlarged cross-sectional view of a substrate processing apparatus according to another exemplary embodiment. Below, the differences between the structure shown in FIG. 30 and the structure shown in FIG. 28 and FIG. 29 of the substrate processing apparatus are explained. As shown in FIG. 30, the bolt (78) may be screw-coupled to a thrust nut (78n) installed below the shaft portion (28s), and the shaft portion (28s) may be clamped between the head of the bolt (78) and the thrust nut (78n). Additionally, the thrust bearing (77) may be installed within a cavity in the bottom portion of the chamber (10), or may be positioned between the upper wall that partitions the cavity and the thrust nut (78n).

[0109] Refer to FIG. 31 below. FIG. 31 is a partial enlarged cross-sectional view of a substrate processing apparatus according to another exemplary embodiment. In the various exemplary embodiments described above, an expandable seal (80) may be used instead of an actuator (20) to release the fixation of the inner wall member (16) to the support member (14), as shown in FIG. 31.

[0110] Specifically, the expandable seal (80) is installed within a recess provided by the lower surface (14b) of the support member (14). The expandable seal (80) expands downward by air supplied from the air supply unit (81). Due to the downward expansion of the expandable seal (80), the inner wall member (16) moves downward, thereby releasing the fixation of the inner wall member (16) to the support member (14).

[0111] Although various exemplary embodiments have been described above, the invention is not limited to the exemplary embodiments described above, and various additions, omissions, substitutions, and changes may be made. Furthermore, it is possible to form other embodiments by combining elements from other embodiments.

[0112] The return module (CTM) may not be movable and may be fixed by being connected to the chamber of the substrate processing device according to the various exemplary embodiments described above. In addition, instead of the return module (CTM), the return module (TM) may be used as a module that returns the inner wall member (16) between the inside of the chamber (10) and the outside of the chamber (10).

[0113] Herein, various exemplary embodiments included in the present disclosure are described in [E1] to [E31] below.

[0114] [E1]

[0115] A chamber including a side wall providing an opening, and

[0116] A substrate support installed within the above chamber, and

[0117] A support member installed above the above substrate support, and

[0118] An inner wall member including a ceiling portion that can be positioned above the substrate support and below the support member, and

[0119] A contact member mounted on one of the support member and the inner wall member, configured to detachably fix the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member, and

[0120] A substrate processing device having an actuator configured to move the inner wall member downward to release the fixation of the inner wall member to the support member.

[0121] In the substrate processing apparatus of the embodiment of [E1], the contact member exerts a horizontal spring reaction force on the other member between the support member and the inner wall member by being deformed by the other member. By this, the inner wall member is fixed to the support member. Additionally, by moving the inner wall member downward by an actuator in resistance to the spring reaction force of the contact member, the fixation of the inner wall member to the support member is easily released. The inner wall member, released from fixation to the support member, can be removed from the inside of the chamber to the outside through an opening in the side wall of the chamber. Therefore, according to the embodiment of [E1], it is possible to easily maintain the inner wall member.

[0122] [E2]

[0123] The lower surface of the above-mentioned support member provides a concave portion, and

[0124] The upper surface of the ceiling portion above provides a concave portion, and

[0125] The above contact member is,

[0126] A first part fitted into the concave portion of the support member, and

[0127] A substrate processing apparatus described in [E1], comprising a second part extending downward from the first part and having a spring that exerts the spring reaction force by being fitted into the concave part of the ceiling part.

[0128] [E3]

[0129] The above contact member is configured to be detachable from the above support member, and

[0130] The first part described above is a substrate processing apparatus described in [E2], having elasticity such that when the contact member is separated from the support member, it can be withdrawn from the concave portion of the support member by deformation in the horizontal direction.

[0131] [E4]

[0132] A substrate processing device described in [E3], wherein the concave portion of the support member narrows at the lower opening of the concave portion of the support member.

[0133] [E5]

[0134] The upper surface of the ceiling portion above provides a convex portion, and

[0135] The above contact member is fixed within a recess provided on the lower surface of the support member and provides a recess that opens downward.

[0136] The above contact member includes a spring installed within the concave portion of the above contact member, and

[0137] A substrate processing device described in [E1], wherein the spring of the contact member exerts the spring reaction force by the convex portion of the ceiling portion being fitted into the concave portion of the contact member.

[0138] [E6]

[0139] The above contact member further comprises a floating mechanism that supports the spring, a substrate processing device described in [E5].

[0140] [E7]

[0141] The lower surface of the above-mentioned support member provides a female screw, and

[0142] A substrate processing device described in [E5] or [E6], wherein the outer surface of the contact member above provides a male screw that is screwed into the female screw.

[0143] [E8]

[0144] The lower surface of the above-mentioned support member provides a concave portion, and

[0145] The upper surface of the ceiling portion above provides a convex portion, and

[0146] A substrate processing apparatus described in [E1], wherein the contact member is fixed to the ceiling portion to cover the convex portion, and the spring exerts the spring reaction force by fitting the convex portion and the contact member into the concave portion of the support member.

[0147] [E9]

[0148] The lower surface of the above-mentioned support member provides a concave portion, and

[0149] The upper surface of the ceiling portion above provides a convex portion, and

[0150] The above contact member is a spiral spring gasket installed along the inner wall surface that partitions the concave portion, and

[0151] The above spiral spring gasket exerts the spring reaction force by the convex portion being fitted into the concave portion, a substrate processing device described in [E1].

[0152] [E10]

[0153] A substrate processing apparatus described in any one of [E1] to [E9], wherein the inner wall member is configured to be conveyable between the inside and outside of the chamber by means of a conveying arm through the opening.

[0154] [E11]

[0155] A substrate processing apparatus described in any one of [E1] to [E10], further comprising a heat transfer sheet that is squeezed between the support member and the ceiling portion.

[0156] [E12]

[0157] A substrate processing apparatus described in any one of [E1] to [E11], wherein the support member and the ceiling portion constitute a shower head configured to supply gas into the chamber.

[0158] [E13]

[0159] The above-mentioned support member is a substrate processing apparatus described in any one of [E1] to [E12], which provides a channel through which a heat medium flows within it.

[0160] [E14]

[0161] A substrate processing apparatus described in any one of [E1] to [E13], wherein the inner wall member further includes a side wall portion extending downward from the periphery portion of the ceiling portion, and together with the substrate support, forms a processing space in which a substrate mounted on the substrate support is processed.

[0162] [E15]

[0163] The above substrate processing device is a plasma processing device, a substrate processing device described in [E14].

[0164] [E16]

[0165] A grounded conductor portion having a tubular shape and extending along the outer circumference of the substrate support, and

[0166] A substrate processing apparatus described in [E15], further comprising a contact mechanism that electrically connects the lower end of the side wall portion to the conductor portion and electrically connects the inner wall member to the conductor portion.

[0167] [E17]

[0168] The above contact mechanism is,

[0169] A tubular body formed from a conductive material, electrically connected to the conductor portion, and extending along the outer circumference of the conductor portion, and

[0170] A pressing body formed of a conductive material and disposed between the substrate support and the tubular body, and

[0171] It includes a driving unit configured to rotate the above-mentioned tubular body along the circumferential direction,

[0172] The above contact mechanism is configured to apply pressure to the outer surface of the lower end of the side wall portion by rotating the cylindrical body in the circumferential direction, thereby electrically connecting the inner wall member to the conductor portion through the pressure member and the cylindrical body, as described in [E16].

[0173] [E18]

[0174] The upper end of the above conductor portion provides a concave portion extending in the circumferential direction, and

[0175] The above contact mechanism includes another contact member having elasticity, and

[0176] The other contact member extends circumferentially within the concave portion of the conductor portion and is electrically connected to the conductor portion,

[0177] A substrate processing apparatus described in [E16], wherein the other contact member is configured to electrically connect the inner wall member to the conductor member through the other contact member by elastically contacting the lower end of the side wall member within the concave portion.

[0178] [E19]

[0179] The above contact mechanism is,

[0180] A plurality of male connectors mounted on one side of the lower end of the side wall portion and the upper end of the conductor portion, and

[0181] It includes a plurality of female connectors mounted on the other side between the lower end of the side wall portion and the upper end of the conductor portion, and

[0182] The above contact mechanism is configured to electrically connect the inner wall member to the conductor part by connecting each of the plurality of male connectors to the corresponding female connector among the plurality of female connectors. [E16] A substrate processing device.

[0183] [E20]

[0184] The above contact mechanism includes another contact member installed to be in contact with the lower surface provided by the lower end of the side wall portion, and

[0185] A substrate processing apparatus described in [E16], wherein the contact mechanism is configured to electrically connect the inner wall member to the conductor portion through the other contact member by pressing the other contact member against the lower surface of the side wall portion.

[0186] [E21]

[0187] The above contact mechanism is configured to press the other contact member against the lower surface of the side wall portion by the pressure of a fluid, in a substrate processing device described in [E20].

[0188] [E22]

[0189] A substrate processing apparatus described in [E20], wherein the above contact mechanism further comprises a piezoelectric element configured to press the other contact member against the lower surface of the sidewall portion.

[0190] [E23]

[0191] The above support member is a substrate processing device described in any one of [E1] to [E22], which constitutes the upper electrode of a capacitively coupled plasma processing device.

[0192] [E24]

[0193] The above-mentioned conductor portion provides, within it, a cavity extending along the circumferential direction with respect to the central axis of the conductor portion and an opening extending between the cavity and the space outside the conductor portion.

[0194] The above contact mechanism is,

[0195] An expandable seal installed within the above cavity, and

[0196] A pressurizing body formed of a conductive material, comprising a first part installed between the wall of the conductive part partitioning the expandable seal and the opening within the above cavity, and a second part extending from the first part into the opening, and

[0197] An elastic body formed of a conductive material and installed between the first part and the wall of the conductor part, and

[0198] It includes an air supply unit configured to supply air to the inflatable seal above,

[0199] A substrate processing apparatus described in [E16], wherein the above-described pressing body is configured to squeeze the elastic body between the first part and the wall of the conductor part by expanding the expandable seal by the air from the air supply part, and to bring the tip of the second part into contact with the inner circumference of the lower end of the side wall part.

[0200] [E25]

[0201] A substrate processing device described in [E24], wherein the tip of the second part above is formed as a contact band.

[0202] [E26]

[0203] The above elastic body is an oblique winding coil spring, a substrate processing device described in [E24] or [E25].

[0204] [E27]

[0205] The device further comprises the conductor portion having a tubular shape, extending along the outer circumference of the substrate support, and being a grounded conductor portion installed so as to be slidable in a horizontal direction above the bottom portion of the chamber.

[0206] The outer surface of the upper part of the above conductor is a tapered surface, and

[0207] The inner surface of the lower end of the above-mentioned side wall is a tapered surface corresponding to the outer surface of the upper end of the above-mentioned conductor part, and

[0208] A substrate processing apparatus described in [E15], configured such that the outer surface of the upper portion of the conductor part and the inner surface of the lower portion of the side wall part are in direct or indirect contact.

[0209] [E28]

[0210] A substrate processing apparatus described in [E27], further comprising a contact band installed on the outer surface of the above-mentioned government of the above-mentioned conductor portion.

[0211] [E29]

[0212] The chamber further comprises a thrust bearing disposed between the bottom portion of the chamber and the head portion of a bolt screwed into the bottom portion,

[0213] A substrate processing apparatus described in [E27] or [E28], wherein the above conductor portion is slidably supported via a thrust bearing above the bottom portion of the chamber.

[0214] [E30]

[0215] A process for introducing an inner wall member by means of a return arm from the outside of a chamber of a substrate processing device to the inside of the chamber through an opening installed in the side wall of the chamber, wherein the substrate processing device comprises the chamber, a substrate support installed within the chamber, and a support member installed above the substrate support, and the inner wall member comprises a ceiling portion that can be positioned above the substrate support and below the support member.

[0216] A maintenance method for a substrate processing apparatus, comprising a process of detachably fixing the inner wall member to the support member by moving one of the support member and the inner wall member along a vertical direction, wherein the inner wall member is fixed to the support member by a contact member mounted on one of the support member and the inner wall member exerting a horizontal spring reaction force on the other of the support member and the inner wall member.

[0217] [E31]

[0218] A process for introducing a return arm from the outside of a chamber of a substrate processing device into the interior of the chamber through an opening installed in the side wall of the chamber, wherein the substrate processing device comprises the chamber, a substrate support installed within the chamber, a support member installed above the substrate support, an inner wall member including a ceiling portion positioned above the substrate support and below the support member, and a contact member mounted on one of the support member and the inner wall member, wherein the contact member is configured to detachably fix the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member.

[0219] A process of transferring the inner wall member to the return arm by moving the inner wall member downward by an actuator to release the fixation of the inner wall member by the contact member, and

[0220] A maintenance method for a substrate processing apparatus comprising a process of removing the inner wall member from the inside of the chamber to the outside of the chamber through the opening.

[0221] From the foregoing description, it will be understood that various embodiments of the present disclosure are described herein for illustrative purposes only, and that various modifications may be made without departing from the scope and common knowledge of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, and the true scope and essence are indicated by the appended claims. Explanation of the symbols

[0222] 1: Substrate processing device 10: Chamber 12: Substrate support 14: Lack of support 16: Interior wall member 16c: Ceiling 18: Absence of contact 20: Actuator

Claims

Claim 1 A substrate processing apparatus comprising: a chamber including a side wall providing an opening; a substrate support installed within the chamber; a support member installed above the substrate support; an inner wall member including a ceiling portion positionable above the substrate support and below the support member; a contact member mounted on one of the support member and the inner wall member, configured to detachably fix the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member; and an actuator configured to move the inner wall member downward to release the fixation of the inner wall member to the support member. Claim 2 A substrate processing apparatus according to claim 1, wherein the lower surface of the support member provides a concave portion and the upper surface of the ceiling portion provides a concave portion, and the contact member comprises a first portion fitted into the concave portion of the support member and a second portion extending downward from the first portion and having a spring that exerts the spring reaction force by being fitted into the concave portion of the ceiling portion. Claim 3 In claim 2, the contact member is configured to be detachable from the support member, and the first part has elasticity so that it can be withdrawn from the concave portion of the support member by deformation in the horizontal direction when the contact member is separated from the support member. Claim 4 In claim 3, the concave portion of the support member narrows at the lower opening of the concave portion of the support member. Claim 5 A substrate processing apparatus according to claim 1, wherein the upper surface of the ceiling portion provides a convex portion, the contact member is fixed within a concave portion provided on the lower surface of the support member and provides a concave portion that is open toward the downward direction, the contact member includes a spring installed within the concave portion of the contact member, and the spring of the contact member exerts the spring reaction force by the convex portion of the ceiling portion being fitted into the concave portion of the contact member. Claim 6 In claim 5, the substrate processing device further comprises a floating mechanism that supports the spring in the contact member. Claim 7 A substrate processing apparatus according to claim 5, wherein the lower surface of the support member provides a female screw, and the outer surface of the contact member provides a male screw that is screwed into the female screw. Claim 8 A substrate processing apparatus according to claim 1, wherein the lower surface of the support member provides a concave portion and the upper surface of the ceiling portion provides a convex portion, the contact member is fixed to the ceiling portion to cover the convex portion, and the spring having a spring that exerts the spring reaction force by the convex portion and the contact member being fitted into the concave portion of the support member. Claim 9 A substrate processing device according to claim 1, wherein the lower surface of the support member provides a concave portion and the upper surface of the ceiling portion provides a convex portion, the contact member is a spiral spring gasket installed along an inner wall surface that partitions the concave portion, and the spiral spring gasket exerts the spring reaction force by the convex portion being fitted into the concave portion. Claim 10 A substrate processing apparatus according to any one of claims 1 to 9, wherein the inner wall member is configured to be conveyable between the inside and outside of the chamber through the opening by a conveying arm. Claim 11 A substrate processing apparatus according to any one of claims 1 to 9, further comprising a heat transfer sheet that is clamped between the support member and the ceiling portion. Claim 12 A substrate processing device according to any one of claims 1 to 9, wherein the support member and the ceiling portion constitute a shower head configured to supply gas into the chamber. Claim 13 A substrate processing apparatus according to any one of claims 1 to 9, wherein the support member provides a flow path through which a heat medium flows. Claim 14 A substrate processing apparatus according to any one of claims 1 to 9, wherein the inner wall member further comprises a side wall portion extending downward from the periphery of the ceiling portion, and together with the substrate support, forms a processing space in which a substrate mounted on the substrate support is processed. Claim 15 In claim 14, the substrate processing device is a plasma processing device, which is a substrate processing device. Claim 16 A substrate processing apparatus according to claim 15, further comprising a grounded conductor portion having a tubular shape and extending along the outer circumference of the substrate support, and a contact mechanism that electrically connects the lower end of the side wall portion to the conductor portion and electrically connects the inner wall member to the conductor portion. Claim 17 In claim 16, the contact mechanism comprises a tubular body formed of a conductive material and electrically connected to the conductor portion and extending along the outer circumference of the conductor portion, a pressing body formed of a conductive material and disposed between the substrate support and the tubular body, and a driving unit configured to rotate the tubular body in a circumferential direction, wherein the contact mechanism is configured to apply pressure to the outer circumferential surface of the lower end of the side wall portion by the circumferential rotation of the tubular body, thereby electrically connecting the inner wall member to the conductor portion through the pressing body and the tubular body. Claim 18 A substrate processing apparatus according to claim 16, wherein the upper end of the conductor portion provides a recess extending in a circumferential direction, and the contact mechanism includes another contact member having elasticity, wherein the other contact member extends in a circumferential direction within the recess of the conductor portion and is electrically connected to the conductor portion, and wherein the other contact member is configured to electrically connect the inner wall member to the conductor portion through the other contact member by elastically contacting the lower end of the side wall portion within the recess. Claim 19 In claim 16, the contact mechanism comprises a plurality of male connectors mounted on one side of the lower end of the side wall portion and the upper end of the conductor portion, and a plurality of female connectors mounted on the other side of the lower end of the side wall portion and the upper end of the conductor portion, and the contact mechanism is configured to electrically connect the inner wall member to the conductor portion by coupling each of the plurality of male connectors with a corresponding female connector among the plurality of female connectors. Claim 20 A substrate processing apparatus according to claim 16, wherein the contact mechanism comprises another contact member installed to be in contact with the lower surface provided by the lower end of the side wall portion, and the contact mechanism is configured to electrically connect the inner wall member to the conductor portion through the other contact member by pressing the other contact member against the lower surface of the side wall portion. Claim 21 In claim 20, the contact mechanism is configured to press the other contact member against the lower surface of the sidewall portion by the pressure of a fluid, in a substrate processing device. Claim 22 In claim 20, the contact mechanism further comprises a piezoelectric element configured to press the other contact member against the lower surface of the sidewall portion. Claim 23 In any one of claims 1 to 9, the support member is a substrate processing device constituting the upper electrode of a capacitance-coupled plasma processing device. Claim 24 In claim 16, the conductor portion provides, within it, a cavity extending along the circumferential direction with respect to the central axis of the conductor portion and an opening extending between the cavity and the space outside the conductor portion, and the contact mechanism comprises an expandable seal installed within the cavity, a first portion installed between the wall of the conductor portion partitioning the expandable seal and the opening within the cavity, and a second portion extending from the first portion into the opening, a pressurizing body formed of a conductive material, an elastic body formed of a conductive material and installed between the first portion and the wall of the conductor portion, and an air supply unit configured to supply air to the expandable seal, wherein the pressurizing body is configured to clamp the elastic body between the first portion and the wall of the conductor portion and bring the tip of the second portion into contact with the inner circumference of the lower end of the side wall portion by the expansion of the expandable seal by the air from the air supply unit. A substrate processing device. Claim 25 In claim 24, the tip of the second part is formed as a contact band in a substrate processing device. Claim 26 In claim 24, the elastic body is an oblique winding coil spring substrate processing device. Claim 27 A substrate processing apparatus according to claim 15, further comprising a conductor portion having a tubular shape, extending along the outer circumference of the substrate support, and grounded, which is installed to slide horizontally above the bottom portion of the chamber, wherein the outer surface of the top portion of the conductor portion is a tapered surface, and the inner surface of the bottom portion of the side wall portion is a tapered surface corresponding to the outer surface of the top portion of the conductor portion, and configured such that the outer surface of the top portion of the conductor portion and the inner surface of the bottom portion of the side wall portion are in direct or indirect contact. Claim 28 A substrate processing device according to claim 27, further comprising a contact band installed on the outer surface of the portion of the conductor. Claim 29 A substrate processing apparatus according to claim 27, further comprising a thrust bearing disposed between the bottom portion of the chamber and the head portion of a bolt screwed to the bottom portion, wherein the conductor portion is slidably supported above the bottom portion of the chamber via the thrust bearing. Claim 30 A maintenance method for a substrate processing device comprising: a process of introducing an inner wall member by means of a return arm from the outside of the chamber of the substrate processing device into the interior of the chamber through an opening installed in the side wall of the chamber, wherein the substrate processing device comprises the chamber, a substrate support installed in the chamber, and a support member installed above the substrate support, and wherein the inner wall member comprises a ceiling portion that can be disposed above the substrate support and below the support member; and a process of detachably fixing the inner wall member to the support member by moving one of the support member and the inner wall member along a vertical direction, wherein the inner wall member is fixed to the support member by a contact member mounted on one of the support member and the inner wall member exerting a horizontal spring reaction force on the other of the support member and the inner wall member. Claim 31 A maintenance method for a substrate processing device, comprising: a process of introducing a return arm from the outside of a chamber of the substrate processing device into the interior of the chamber through an opening installed in the side wall of the chamber, wherein the substrate processing device comprises the chamber, a substrate support installed in the chamber, a support member installed above the substrate support, an inner wall member including a ceiling portion disposed above the substrate support and below the support member, and a contact member mounted on one of the support member and the inner wall member, wherein the contact member is configured to detachably fix the inner wall member to the support member by exerting a horizontal spring reaction force on the other of the support member and the inner wall member; a process of delivering the inner wall member to the return arm by moving the inner wall member downward by an actuator to release the fixation of the inner wall member by the contact member; and a process of removing the inner wall member from the interior of the chamber to the exterior of the chamber through the opening.

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