Automatic agitation plating apparatus

Abstract

An automatic stirring plating device according to one embodiment of the present invention is positioned above a plating tank containing a plating solution and can perform the function of causing a plating mesh containing a workpiece to be plated to flow within the plating solution. To this end, the automatic stirring plating device may include a pair of drive modules that receive power from the outside and each generate a linear reciprocating motion force in a direction perpendicular to the ground. At this time, the pair of drive modules may be spaced apart from each other at a certain distance. Additionally, the automatic stirring plating device may include a pair of link modules that support the plating mesh to vibrate within the plating solution using the linear reciprocating motion force received from the drive modules. These link modules may be coupled to the lower drive shafts of the pair of drive modules and may have a structure that connects by gripping the handle portions on one side and the other side of the plating mesh, respectively.

Description

Technology Field

[0001] The present invention relates to an automatic stirring plating device, and more specifically, to a seesaw-driven automatic plating device. This research is funded by the Ministry of SMEs and Startups and the Korea Technology Information Promotion Agency for SMEs in 2025. (Project No.: 2420024658, Commercialization of Au powder with a size of 16㎛ or less for rubber conductive parts of HBM inspection sockets and development of batch plating equipment for the same) Background Technology

[0002] In wet plating processes for surface treatment of micro and precision parts, such as microelectromechanical systems (MEMS) components or gold plating balls, it is often difficult to apply the conventional mass production method of barrel plating when the parts are very small or have complex shapes. Consequently, it is common to rely on a manual plating process in which an operator places the product into a mesh basket, immerses it in a plating bath, and shakes it directly.

[0003] However, this manual plating method can cause safety issues, such as respiratory diseases, as workers are directly exposed to harmful gases generated from plating chemicals, and it can also lead to musculoskeletal disorders due to repetitive manual labor. Furthermore, the speed or pattern of shaking the plating mesh can vary depending on the worker's skill level or condition on the day, resulting in variations in plating film thickness or limitations in maintaining uniform quality. In particular, for micro-components, it has been continuously raised that plating defects (pitting) occur because it is difficult to completely remove air bubbles trapped inside micro-pores using only simple up-and-down movements or irregular hand tremors.

[0004] Although some automated equipment has been proposed to address this, most of them have structures that perform only simple vertical reciprocating motion, making it difficult to achieve full automation of the entire process due to issues such as failure to ensure plating uniformity for parts with complex shapes or power supply cables getting tangled during movement. Therefore, there is a need to develop a new type of stirring mechanism and an automated system that includes it, which can dramatically improve the plating quality of micro-parts while ensuring worker safety. The problem to be solved

[0005] The present invention was developed to solve the aforementioned problems, and aims to provide an automatic stirring plating device that ensures worker safety by automating the plating mesh stirring process, which previously relied on manual labor, and improves plating quality by implementing complex stirring movements beyond simple up-and-down motions.

[0006] Specifically, by using a pair of independently controllable drive modules to impart a seesaw-shaped tilting motion to the plating mesh, the aim is to induce rolling and tumbling of the workpiece to effectively remove microbubbles and maximize the penetration efficiency of the plating solution. Additionally, the purpose is to ensure the durability of the device by providing a link joint structure capable of flexibly absorbing mechanical twisting or distance changes that occur when the plating mesh is tilted.

[0007] In addition, another objective of the present invention is to provide a fully automated plating system that enables continuous process automation without cable or hose twisting by applying a method of docking from the side to the mobile shuttle module only when it is stopped to supply power. The problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0008] An automatic stirring plating device according to one embodiment of the present invention is positioned above a plating tank containing a plating solution and can perform the function of causing a plating mesh containing a workpiece to be plated to flow within the plating solution. To this end, the automatic stirring plating device may include a pair of drive modules that receive power from the outside and each generate a linear reciprocating motion force in a direction perpendicular to the ground. At this time, the pair of drive modules may be spaced apart from each other at a certain distance. Additionally, the automatic stirring plating device may include a pair of link modules that support the plating mesh to vibrate within the plating solution using the linear reciprocating motion force received from the drive modules. These link modules may be coupled to the lower drive shafts of the pair of drive modules and may have a structure that connects by gripping the handle portions on one side and the other side of the plating mesh, respectively.

[0009] Other specific details of the present invention are included in the detailed description and drawings. Effects of the invention

[0010] According to the present invention, a complex flow can be formed on the workpiece inside the plating mesh through a seesaw stirring mode using a pair of driving modules. This effectively removes hydrogen bubbles from the surface of the workpiece and smoothly supplies the plating solution even to the interior of complex shapes, thereby ensuring significantly more uniform and superior plating quality compared to manual work.

[0011] Furthermore, the rotary joint structure and connecting links applied to the link module eliminate mechanical interference during seesaw motion, enabling smooth operation and preventing equipment damage, thereby reducing maintenance costs. Moreover, by applying a transfer shuttle module equipped with a side-docking power supply system, complete automation of the entire process can be achieved while isolating workers from hazardous gases.

[0012] This can not only dramatically increase productivity but also contribute significantly to improving the working environment. The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below. Brief explanation of the drawing

[0013] Various embodiments are described with reference to the drawings, wherein similar reference numbers are used to collectively refer to similar components. In the following embodiments, for illustrative purposes, a number of specific details are presented to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that such embodiment(s) may be practiced without these specific details. FIG. 1 is a perspective view showing the overall configuration of an automatic stirring plating device according to one embodiment of the present invention. FIG. 2 is an operating state diagram to explain the seesaw stirring (Tilting) state and the detailed structure of the link module according to the operation of the driving module of an automatic stirring plating device according to one embodiment of the present invention. FIG. 3 is a conceptual diagram schematically illustrating the configuration of an entire automatic plating system according to another embodiment of the present invention. FIG. 4 is a perspective view illustrating a power supply method between a transfer shuttle module and a fluid supply unit according to one embodiment of the present invention. FIG. 5 is a schematic plan view illustrating the process of a fluid supply unit according to one embodiment of the present invention being docked to a transfer shuttle module. Specific details for implementing the invention

[0014] Various embodiments and / or aspects are now disclosed with reference to the drawings. For illustrative purposes, numerous specific details are disclosed in the following description to aid in a general understanding of one or more aspects. However, it will be apparent to those skilled in the art that these aspects may be practiced without such specific details. The following description and the accompanying drawings describe specific exemplary aspects of one or more aspects in detail. However, these aspects are exemplary, and some of the various methods in the principles of the various aspects may be used, and the descriptions are intended to include all such aspects and their equivalents. Specifically, terms such as “exemplary,” “example,” “aspect,” and “example” as used herein may not be interpreted as implying that any described aspect or design is superior or advantageous to other aspects or designs.

[0015] Hereinafter, identical or similar components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. Furthermore, in describing the embodiments disclosed in this specification, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the embodiments disclosed in this specification. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings.

[0016] Although terms such as first, second, etc. are used to describe various elements or components, it goes without saying that these elements or components are not limited by these terms. These terms are used merely to distinguish one element or component from another. Therefore, it goes without saying that the first element or component mentioned below may be the second element or component within the technical scope of the present invention.

[0017] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning that is commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0018] Furthermore, the term "or" is intended to mean an implicit "or" rather than an exclusive "or." That is, unless otherwise specified or evident from the context, "X uses A or B" is intended to mean one of the natural implicit substitutions. In other words, if X uses A; if X uses B; or if X uses both A and B, "X uses A or B" may apply to any of these cases. Additionally, the term "and / or" as used herein should be understood to refer to and include all possible combinations of one or more of the enumerated related items.

[0019] Additionally, the terms “comprising” and / or “comprising” should be understood to mean that such features and / or components are present, but not to exclude the presence or addition of one or more other features, components, and / or groups thereof. Furthermore, unless otherwise specified or clearly evident from the context to indicate a singular form, the singular in this specification and claims should generally be interpreted to mean “one or more.”

[0020] When it is stated that one component is “connected” or “connected” to another component, it should be understood that it may be directly connected or connected to that other component, or that there may be other components in between. On the other hand, when it is stated that one component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

[0021] When elements or layers are referred to as being "on" or "on" another element or layer, it includes not only being directly on top of the other element or layer but also cases where another layer or element is interposed in between. On the other hand, when a component is referred to as being "directly on" or "immediately on," it indicates that no other element or layer is interposed in between.

[0022] Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used to easily describe the relationship between one component or other components as illustrated in the drawings. Spatially relative terms should be understood as terms that include different orientations of the element during use or operation, in addition to the directions illustrated in the drawings.

[0023] The objectives and effects of the present invention, and the technical configurations for achieving them, will become clear by referring to the embodiments described in detail below in conjunction with the accompanying drawings. In describing the present invention, if it is determined that a detailed description of known functions or configurations may unnecessarily obscure the essence of the invention, such detailed description will be omitted. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intentions or conventions of the user or operator.

[0024] However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to make the present invention complete and to fully inform those skilled in the art of the scope of the disclosure, and the present invention is defined only by the scope of the claims. Therefore, such definition should be based on the content throughout this specification.

[0025] Hereinafter, the detailed configuration and operating principle of an automatic stirring plating device (10) according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0026] FIG. 1 is a perspective view showing the overall appearance of an automatic stirring plating device (10) according to one embodiment of the present invention.

[0027] First, referring to FIG. 1, the automatic stirring plating device (10) may be configured to include a frame module (100) forming the framework of the entire system, a driving module (200) generating physical driving force required for the plating process, a link module (300) that receives the driving force and moves a plating mesh (21) containing the workpiece to be plated, and a control module (400) that controls the overall operation. Additionally, the automatic stirring plating device (10) may further include a plating tank (22) that provides a space for the plating process to be performed and a heating stirring module (30) that controls the state of the plating solution.

[0028] The frame module (100) forms the outer shape of the automatic stirring plating device (10) and can perform the function of stably supporting each component. The frame module (100) may include a lower base (120) that rests on the ground and forms the lower part of the device. The lower base (120) is formed in a flat plate shape and can provide a space where the heating stirring module (30), which will be described later, can be stably placed. In addition, the frame module (100) may include a plurality of poles (130) that extend vertically upward from near the corners of the lower base (120).

[0029] In FIG. 1 according to one embodiment, four poles (130) are shown, which can serve as pillars to firmly support the upper structure. The frame module (100) may include an upper base (110) that is coupled to the top of a plurality of poles (130). The upper base (110) may provide a mounting platform function where a drive module (200) and a control module (400) are installed. For example, the upper base (110) may be formed with an open central portion to secure a space where the drive module (200) can protrude downward and operate.

[0030] In one embodiment, a control module (400) may be installed on the upper surface of the upper base (110). The control module (400) may receive operation commands from an operator and perform the function of precisely controlling the operation of the drive module (200) according to a preset program. The control module (400) may be equipped with a user interface, such as a touchscreen, on its front surface to support intuitive setting of stirring speed, time, mode, etc. The drive module (200) may be fixedly installed on the lower surface of the upper base (110).

[0031] The driving module (200) may be an actuator that generates a linear reciprocating motion force in the vertical direction according to a signal from the control module (400). In one embodiment of the present disclosure, the driving module (200) may be composed of a pair arranged side by side at a certain distance from each other, which may be divided into a first driving unit on the left and a second driving unit on the right. Each driving unit may be composed of a pneumatic cylinder or an electric linear motor and may be configured to enable independent position and speed control by the control module (400).

[0032] A heating stirring module (30) may be positioned on the lower base (120). The heating stirring module (30) can perform an auxiliary function of heating the plating solution in the plating tank (22) to an appropriate temperature and using magnetic force to rotate a magnetic bar to form a basic rotating water flow inside the plating solution. An operating part may be provided on the front of the heating stirring module (30).

[0033] In one embodiment, the plating tank (22) may have a bath shape formed of an opaque material (e.g., PP, PVC, PVDF, etc.) having chemical resistance to strong acid or strong alkaline plating solutions. A separate heating unit may be provided inside the plating tank (22) to heat the plating solution to a process temperature. The heating unit (30) may be composed of an immersion heater that is directly immersed in the plating solution, and may include a Teflon heater whose surface is coated with Teflon material to prevent corrosion by the plating solution. This ensures the durability of the heater while maintaining the temperature of the plating solution inside the plating tank (22) precisely. In another embodiment, a transparent beaker-shaped plating tank (22) containing the plating solution may be placed on the heating stirring module (30).

[0034] In one embodiment, a plating mesh (20) for accommodating the object to be plated may be located inside the plating tank (22). The plating mesh (20) may include a main body (21) having a mesh structure capable of accommodating a plurality of fine parts inside. For example, the main body (21) may have a basket shape and may remain submerged in the plating solution during the plating process.

[0035] A link module (300) may be connected between the bottom of a pair of drive modules (200) and the top sides of the plating mesh (20). The link module (300) may serve as a medium to transmit the driving force of the drive modules (200) to the plating mesh (20). Corresponding to the drive modules (200), the link module (300) may also form a pair consisting of a first link unit on the left and a second link unit on the right.

[0036] FIG. 2 is an operating state diagram for explaining the seesaw or tilting stirring operation, which is a core operating mode of the automatic stirring plating device (10) according to one embodiment of the present invention.

[0037] Referring to FIG. 2, the operating principle of the seesaw stirring mode can be described as follows: the control module (400) can apply a control signal having opposite phases or a certain phase difference to a first driving unit (201) located on the left and a second driving unit (202) located on the right, spaced apart from the first driving unit (201). For example, the control signal input to the first driving unit (201) and the second driving unit (202) may be an asynchronous signal.

[0038] First, referring to FIG. 2(a), while the first driving unit (201) performs a downward movement (direction of the down arrow), the second driving unit (202) can simultaneously perform an upward movement (direction of the red up arrow). At this time, the first link unit (301) connected to the first driving unit (201) presses down on the left end of the plating mesh (20), and the second link unit (302) connected to the second driving unit (202) lifts up the right end of the plating mesh (20). As a result, the plating mesh (20) is tilted so that the left side is lower and the right side is higher relative to the horizontal plane.

[0039] Next, referring to FIG. 2(b), each driving unit operates in the opposite direction, so that the first driving unit (201) rises and the second driving unit (202) descends. Accordingly, the plating mesh (20) tilts in the opposite direction to FIG. 2(a), that is, with the left side higher and the right side lower. By periodically repeating the state of FIG. 2(a) and the state of FIG. 2(b) in this way, the plating mesh (20) can perform a tilting motion that continuously tilts left and right, as if riding a seesaw.

[0040] In various embodiments, the control module (400) can implement various asymmetric stirring patterns depending on the shape of the workpiece or the characteristics of the plating solution, in addition to the symmetric seesaw motion described above. For example, the control module (400) can move only the second drive unit (202) up and down while holding the first drive unit (201) at a specific height. In this case, the plating mesh (20) can perform a unilateral tilting motion by drawing a fan-shaped trajectory using the fixed first link unit (301) as the axis of rotation. As another example, the control module (400) can drive the first drive unit (201) and the second drive unit (202) by setting their strokes or frequencies differently. That is, by having the first driving unit (201) vibrate quickly and briefly and the second driving unit (202) reciprocate slowly and for a long time, irregular complex turbulence can be generated inside the plating mesh (20). This combination of various patterns can be advantageous for efficiently degassing microbubbles that are not removed in standardized flow patterns, or for penetrating the plating solution into every corner of a workpiece with a complex three-dimensional shape.

[0041] In order to mechanically enable such tilting movement, the link module (300) may have an articulation structure as shown in the enlarged view on the right side of FIG. 2. Each link module (300) may include an articulation axis (320) having a rotational degree of freedom, which is coupled to the rod end of the drive module (200). Additionally, the link module (300) may include a connecting ring (310) that is fastened to the articulation axis (320) and movably connected, and a lower gripper (330) that extends from the lower end of the connecting ring (310) to grip or hook and fix the handle portion of the plating mesh (20). In particular, the coupling structure of the articulation axis (320) and the connecting ring (310) may be configured in the form of a hinge or a universal joint to allow for a relative angle change of the lower gripper (330) with respect to the drive module (200). Due to the organic combination of the joint axis (320) and the connecting ring (310), the minute changes in distance and angle between the two connecting points that occur as the plating mesh (20) tilts during the seesaw stirring motion are flexibly absorbed, so that smooth tilting motion can be made possible without mechanical interference or damage to parts.

[0042] This complex seesaw motion can induce not only simple up-and-down vibration but also lateral rolling and irregular tumbling in the fine workpieces contained within the plating mesh (20). This can provide the effect of improving plating quality by continuously changing the contact points between the workpieces, effectively removing hydrogen bubbles generated on the surface, and smoothly supplying new plating solution into the complexly shaped micro-pores.

[0043] FIG. 3 is a conceptual diagram of a fully automatic plating system (500) according to another embodiment of the present invention. This embodiment relates to a system in which individual drive units described above are arranged in an in-line configuration to automatically perform a continuous multi-stage process.

[0044] Referring to FIG. 3, the entire automatic plating system (500) may include a chamber housing (510) that forms a process space isolated from the external environment. The chamber housing (510) may serve as a barrier that maintains a constant internal process environment and prevents the leakage of contaminants.

[0045] A rail system (520) extending along the longitudinal direction or process direction may be installed on the upper inner side of the chamber housing (510). The rail system (520) may include a guide rail (522) providing a fixed path and a plurality of transfer carriages (521) movably coupled to the guide rail (522). Here, the transfer carriage (521) may be a drive block that moves horizontally and is precisely position-controlled along the guide rail (522) by a linear motor or belt drive method.

[0046] A transfer shuttle module (600) can be securely connected to the bottom of the transfer carriage (521). The transfer shuttle module (600) can be defined as a movable carrier unit equipped with a pair of drive modules (200) and a link module (300) as described in FIGS. 1 and 2. That is, the transfer shuttle module (600) is horizontally transferred to each process step by the transfer carriage (521) and can raise and lower the plating mesh or perform seesaw stirring motion through its own drive module (200).

[0047] A plurality of process stations may be partitioned and arranged in the lower space of the chamber housing (510) according to the process sequence. In the embodiment illustrated in FIG. 3, the process station may be configured to include a pretreatment station (541) for removing foreign substances from the workpiece, a catalyst station (542) for surface activation, a first plating station (543, e.g., nickel) for performing primary plating, and a second plating station (544, e.g., gold) for final finishing.

[0048] Each process station (541, 542, 543, 544) may be configured in a form where multiple baths are assembled for production efficiency and process quality. For example, the pretreatment station (541) may have a structure in which one degreasing bath and three washing baths are arranged in sequence, and the transfer shuttle module (600) may pass through each bath sequentially according to a set program to perform immersion and stirring. However, the process sequence or the number of baths shown in FIG. 3 is exemplary and may be varied depending on the type of workpiece.

[0049] Additionally, the entire automatic plating system (500) may include air conditioning equipment for treating fumes or harmful gases generated during the process. An exhaust unit (530) for collecting internal air and discharging it to the outside may be installed on one side (e.g., top) of the chamber housing (510). Additionally, a circulation and filtration unit (540) for regulating the pressure inside the chamber or purifying and circulating contaminated air may be provided on the other side (e.g., bottom) of the chamber housing (510). The circulation and filtration unit (540) may include a vent valve and a filtration filter to maintain a pleasant and safe working environment.

[0050] Meanwhile, the overall operation of the system (500) can be integratedly controlled by a centralized main controller. The main controller can achieve automation of the entire process by comprehensively managing the movement path of each transfer carriage (521), the residence time at each process station, and the stirring pattern (amplitude, speed, seesaw mode, etc.) performed by the drive module (200) of the transfer shuttle module (600).

[0051] FIG. 4 is a perspective view illustrating a method of supplying a driving source (fluid or power) to a transfer shuttle module (600) moving along a rail, and FIG. 5 is a plan schematic diagram illustrating the docking process in which the supply mechanism of FIG. 4 operates.

[0052] For the drive module (200) mounted on the transfer shuttle module (600) moving along the rail to operate, the supply of an energy source, such as electricity or compressed air, is essential. In this embodiment, for example, when the drive module (200) is a pneumatic cylinder, the explanation focuses on a fluid supply unit (700) that disconnects during transfer and injects fluid only when stopped.

[0053] Referring to FIG. 4, a shuttle port (610) for receiving compressed air may be provided on one side of a transfer carriage (521) that slides along a guide rail (522). The shuttle port (610) may have a check valve structure that prevents internal air pressure from escaping even when the connection to the external supply line is disconnected. This allows the cylinder pressure of the drive module (200) to be maintained while the transfer carriage (521) is moving, thereby preventing the plating mesh from falling.

[0054] A stationary fluid supply unit (700) may be installed on one side frame of the station where each process group (541, 542, 543, 544) is located. The fluid supply unit (700) may be a device connected to a main air supply line to continuously provide high-pressure compressed air.

[0055] Referring to the enlarged view of FIG. 4 and FIG. 5, the detailed configuration of the fluid supply unit (700) can be examined. The fluid supply unit (700) may include a moving base (710) capable of linear reciprocating movement toward the transfer carriage (521). The moving base (710) may advance or retract in a direction perpendicular to the longitudinal direction of the guide rail (522) by a separate pneumatic or electric actuator. Additionally, a supply nozzle (720) may be provided on the front of the moving base (710) and formed to protrude at a position corresponding to the shuttle port (610). The supply nozzle (720) may include an O-ring or gasket for maintaining airtightness during docking.

[0056] A specific docking and operation process is described with reference to FIG. 5. First, the transfer carriage (521) can move along the guide rail (522) and stop at a specific process position. At this time, the main control module can detect the stop signal of the transfer carriage (521) and operate the fluid supply unit (700). As the moving base (710) of the fluid supply unit (700) moves forward in a direction perpendicular to the rail direction (in the direction of the arrow in FIG. 5), the supply nozzle (720) can be inserted into the shuttle port (610) of the transfer carriage (521). Once this mechanical connection is completed, the check valve inside the shuttle port (610) opens to form a flow path, and compressed air is supplied to the transfer shuttle module (600) so that the drive module (200) can lower the plating mesh or perform a seesaw stirring motion. When the process is completed, the moving base (710) moves backward to return to its original position, and the shuttle port (610) closes again to move to the next process while trapping internal pressure.

[0057] In another embodiment, the docking system of the present invention may be modified and implemented using an electrical connection method. If the drive module (200) is composed of an electric motor (such as a linear motor), the shuttle port (610) may be replaced with an electrical contact terminal made of conductive metal. Correspondingly, the supply nozzle (720) of the fluid supply unit (700) may be replaced with an elastic feed probe (Pogo Pin Probe) or a conductive brush. In this case, at the moment the moving base (710) advances and the feed probe contacts the electrical contact terminal, power and control signals are supplied to the transfer shuttle module (600), allowing for motor-based precise stirring control to be performed. It is evident that such an electrical docking method is also included within the scope of the technical concept of the present invention.

[0058] [Paraphrasing]

[0059] An automatic stirring plating device according to one embodiment of the present invention is positioned above a plating tank containing a plating solution and can perform the function of causing a plating mesh containing a workpiece to be plated to flow within the plating solution. To this end, the automatic stirring plating device may include a pair of drive modules that receive power from the outside and each generate a linear reciprocating motion force in a direction perpendicular to the ground. At this time, the pair of drive modules may be spaced apart from each other at a certain distance. Additionally, the automatic stirring plating device may include a pair of link modules that support the plating mesh to vibrate within the plating solution using the linear reciprocating motion force received from the drive modules. These link modules may be coupled to the lower drive shafts of the pair of drive modules and may have a structure that connects by gripping the handle portions on one side and the other side of the plating mesh, respectively.

[0060] In one embodiment, a pair of link modules may be provided with a rotary joint structure that converts the vertical linear motion of the driving module into the inclined pendulum motion of the plating mesh. This rotary joint structure can increase stirring efficiency by inducing the plating mesh to be stirred while tilted at a preset angle, rather than moving only vertically within the plating solution.

[0061] As a characteristic configuration of the present invention, a pair of drive modules may be composed of a first drive unit and a second drive unit capable of independent drive control. Accordingly, the automatic stirring plating device can impart a left-right seesaw-shaped tilt stirring motion to the plating mesh by controlling the lowering and rising timings of the first drive unit and the second drive unit differently from each other.

[0062] The automatic stirring plating device may further include a control module that is electrically connected to a drive module and applies a drive signal. The control module can select and execute an appropriate stirring mode depending on the operating conditions. For example, the control module can execute a vertical stirring mode by transmitting a synchronized signal so that a pair of drive modules rise and fall simultaneously. As another example, the control module can execute a seesaw stirring mode by transmitting an asynchronous signal so that a pair of drive modules rise and fall in opposite phases or cross each other with a certain time delay.

[0063] Looking at the specific shape of the link module, the link module may include an articulating shaft that is coupled to the end of the drive shaft of the drive module and provides a center of rotation. Additionally, the link module may include a lower gripper that grasps or hooks the connecting portion of the plating mesh to secure it. In particular, a connecting ring may be located between the articulating shaft and the lower gripper; the connecting ring is fastened to the articulating shaft to be rotatably connected, and its lower end may be connected to the lower gripper. This multi-segment link structure can mechanically absorb changes in distance and angle between the drive module and the plating mesh that occur when the plating mesh tilts, thereby enabling smooth seesaw motion.

[0064] In another embodiment, the automatic stirring plating device may further include a guide rail installed longitudinally along a line in which a plurality of process tanks are arranged, and a transfer carriage coupled to be movable along the guide rail. In this case, a pair of drive modules may be mounted on the transfer carriage to form an integrated transfer shuttle module. The transfer shuttle module can move horizontally along the guide rail to the position of each process tank and perform a continuous plating process.

[0065] To supply power to the transfer shuttle module, a shuttle port may be provided on one side of the transfer shuttle module to receive a power source for operating the drive module. Additionally, a fluid supply unit for supplying the power source may be installed on one side of the path where the guide rail is installed. In particular, the fluid supply unit may include a supply nozzle that moves forward in a horizontal direction perpendicular to the longitudinal direction of the guide rail and docks with the shuttle port when the transfer shuttle module stops at a designated position. This side horizontal docking method can provide the effect of minimizing interference during transfer and stably supplying power only when stopped.

[0066] In the specific embodiments of the present disclosure described above, the components of the plating apparatus and the system including the same included in the present disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression of the components is selected to suit the circumstances presented for convenience of explanation, and the present disclosure is not limited to a singular or plural component, and even a component expressed in the plural may be composed of a singular form, or even a component expressed in the singular form may be composed of a plural form.

[0067] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

[0068] The description of the presented embodiments is provided so that any person skilled in the art may use or practice the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the scope of the present invention. Thus, the present invention is not limited to the embodiments presented herein, but should be interpreted in the broadest possible scope consistent with the principles and novel features presented herein.

Claims

Claim 1 An automatic stirring plating device disposed on the upper side of a plating tank containing a plating solution, for flowing a plating mesh containing a workpiece within the plating solution, comprising: a pair of drive modules disposed spaced apart from each other at a certain distance and each generating a linear reciprocating motion force in a direction perpendicular to the ground by receiving power from the outside; and a pair of link modules each coupled to the lower drive shaft of the pair of drive modules, gripping and connecting the upper ends of one side and the other side of the plating mesh respectively, and supporting the plating mesh to vibrate within the plating solution using the linear reciprocating motion force received from the drive modules; wherein the pair of drive modules is composed of a first drive unit and a second drive unit capable of independent drive control, and by controlling the lowering and rising timings of the first drive unit and the second drive unit differently from each other, the plating mesh is imparted a left-right seesaw-shaped tilt stirring motion. Claim 2 An automatic stirring plating device according to claim 1, wherein the pair of link modules comprises a rotary joint structure that converts the vertical linear motion of the driving module into the inclined pendulum motion of the plating mesh, thereby inducing the plating mesh to be stirred in a state inclined at a preset angle within the plating solution. Claim 3 delete Claim 4 An automatic stirring plating device according to claim 1, further comprising a control module electrically connected to the driving module and applying a driving signal; wherein the control module selects and executes one of the following modes: a vertical stirring mode in which a synchronized signal is transmitted so that the pair of driving modules rise and fall simultaneously; and a seesaw stirring mode in which a desynchronized signal is transmitted so that the pair of driving modules rise and fall in opposite phases or cross each other with a certain time difference. Claim 5 The automatic stirring plating device according to paragraph 2, wherein the link module comprises: an articulating shaft coupled to the end of the drive shaft of the drive module to provide a center of rotation; a lower gripper that grips or hooks and fixes the connecting portion of the plating mesh; and a connecting ring that is fastened to the articulating shaft and rotatably connected, with its lower end connected to the lower gripper; and is characterized by absorbing changes in distance and angle between the drive module and the plating mesh that occur when the plating mesh is tilted. Claim 6 The automatic stirring plating apparatus according to claim 1 further comprises: a guide rail installed longitudinally along a line in which a plurality of process tanks are arranged; and a transfer carriage coupled to be movable along the guide rail; wherein the pair of driving modules are mounted on the transfer carriage to form an integrated transfer shuttle module and are characterized by moving horizontally along the guide rail to each process tank position. Claim 7 An automatic stirring plating device according to claim 6, wherein one side of the transfer shuttle module is provided with a shuttle port for receiving a power source to operate the drive module, and one side of the path where the guide rail is installed is provided with a fluid supply unit for supplying the power source, wherein the fluid supply unit includes a supply nozzle that moves forward in a horizontal direction perpendicular to the longitudinal direction of the guide rail and docks with the shuttle port when the transfer shuttle module stops at a predetermined position.

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