METHOD FOR MAKING A PLURALITY OF WAFER BODIES

Abstract

The present invention relates to a method for producing a plurality of wafer bodies (400), wherein two wafer sheets (100, 200) are mutually coupled such that the respective portions (102, 202) are joined together to form the wafer bodies (400), and wherein the joined portions (102, 202) are subsequently separated from the mutually coupled wafer sheets (100, 200). The method is characterized in that it involves the use of wafer sheets (100, 200) provided with coupling formations (105, 205) for the purpose of ensuring correct mutual positioning of the wafer sheets (100, 200).