Surface treatment device

Abstract

A surface treatment device includes: a treatment bath (100A, 100B) that contains a treatment liquid; an anode (142, 152) disposed within the treatment bath; a jig (10) that hangs and holds a workpiece and sets the workpiece (W) as a cathode; a liquid ejection member (200) disposed between the anode and the workpiece; and a movement mechanism (270A, 270B) that causes the liquid ejection member to move with respect to the workpiece. The liquid ejection member includes at least a pair of plate materials (210, 220, 230) formed along an extension direction toward the workpiece between the anode and the workpiece and spaced in a direction intersecting the extension direction and guides, between at least the pair of plate materials, the treatment liquid flowing with a movement of the liquid ejection member and ejects the treatment liquid toward the workpiece. Figure 3

Description

Surface Treatment Equipment

[0001] The present invention relates to a surface treatment device for performing a surface treatment such as plating on a workpiece.

[0002] In an apparatus for plating a workpiece such as a circuit board, as shown in Patent Document 1, plating liquid is sprayed onto a workpiece suspended in the plating liquid from multiple nozzles arranged along the vertical direction of a nozzle pipe that is installed vertically in the plating liquid.

[0003] In apparatus for plating workpieces such as circuit boards and semiconductor wafers, a paddle for stirring the processing solution is used instead of a nozzle tube, as shown in Patent Documents 2 and 3. The paddle in Patent Document 2 is a stirring rod, and the paddle in Patent Document 3 is a rectangular plate with multiple vertically long holes formed therethrough, and these paddles are moved back and forth parallel to the main surface of the workpiece. Patent Documents 4 to 6 disclose that the nozzle of Patent Document 1 is provided on the paddle of Patent Documents 2 or 3.

[0004] JP 2012-046782 A (FIG. 5) JP 2006-041172 A (FIG. 1-5) JP 2014-185375 A (FIGS. 1, 3-4, 6) JP 2004-16129 A (FIG. 1-4) JP 56-42976 A (FIG. 1-3) JP 10-88397 A (FIG. 1-2)

[0005] However, the nozzle pipes in Patent Document 1 are spaced apart in the width direction of the workpiece, and each nozzle pipe has nozzles spaced apart in the vertical direction, making it difficult to uniformly discharge the plating liquid onto the workpiece. Meanwhile, the paddles in Patent Document 2 only agitate the plating liquid. In Patent Documents 4 to 6, the processing liquid pumped by the liquid injection pump is sprayed toward the workpiece from a moving paddle, but, like Patent Document 1, the in-plane processing uniformity is not improved depending on the nozzle position. Furthermore, Patent Documents 4 to 6 require a liquid injection pump in addition to a drive source to move the paddle.

[0006] The present invention aims to provide a surface treatment device that can reduce the in-plane non-uniformity of the treatment liquid sprayed toward the workpiece without requiring a liquid injection pump, thereby increasing the in-plane uniformity of the surface treatment of the workpiece and also increasing throughput.

[0007] (1) One aspect of the present invention relates to a surface treatment device comprising: a treatment tank containing a treatment liquid; an anode placed in the treatment tank; a jig that holds a workpiece immersed in the treatment liquid in a hanging manner and sets the workpiece as a cathode; a liquid jetting member placed in the treatment liquid between the anode and the workpiece; and a movement mechanism that moves the liquid jetting member relative to the workpiece, wherein the liquid jetting member is formed along an extension direction toward the workpiece between the anode and the workpiece and includes at least a pair of plate members that are spaced apart in a direction intersecting the extension direction, and the treatment liquid that flows due to the movement of the liquid jetting member is guided between the at least pair of plate members and jetted toward the workpiece.

[0008] According to one aspect of the present invention, by moving a liquid jetting member relative to a workpiece suspended in the processing liquid, the processing liquid can be sprayed toward the workpiece without using a nozzle pipe. In other words, by moving the liquid jetting member, the processing liquid flowing in the processing tank is guided between at least a pair of plates and sprayed toward the workpiece. As a result, the processing liquid collides with the workpiece, allowing fresh processing liquid rich in surface treatment components near the anode to be supplied to the workpiece, improving throughput. Furthermore, because the processing liquid can be sprayed toward the workpiece between at least a pair of plates of the moving liquid jetting member, the uniformity of processing within the workpiece surface is improved compared to spraying processing liquid from multiple nozzles of a nozzle pipe.

[0009] (2) In one aspect (1) of the present invention, the moving mechanism moves the liquid jetting member in a reciprocating direction parallel to the workpiece, the liquid jetting member includes: a first guide body having two surfaces intersecting the reciprocating direction; and a second guide body and a third guide body arranged with a gap between them, respectively, and the at least one pair of plate materials includes: a first pair of plate materials formed by the first guide body and the second guide body; and a second pair of plate materials formed by the first guide body and the third guide body, and when the liquid jetting member moves in a forward direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the gap between the first pair of plate materials and sprayed toward the workpiece, and when the liquid jetting member moves in a backward direction of the reciprocating direction, the processing liquid blocked by the first guide body is guided along the gap between the second pair of plate materials and sprayed toward the workpiece.

[0010] In this way, when the liquid ejection member moves forward, for example, the processing liquid guided along the gap between the first pair of plate materials formed by the first and second guide bodies is ejected onto the workpiece, and when the liquid ejection member moves backward, for example, the processing liquid guided along the gap between the second pair of plate materials formed by the first and third guide bodies is ejected onto the workpiece.

[0011] (3) In one aspect (2) of the present invention, the anode may include a first anode and a second anode disposed on both sides of the workpiece, the liquid jetting member may include a first liquid jetting member disposed between the first anode and the workpiece and a second liquid jetting member disposed between the second anode and the workpiece, and the moving mechanism may include a first moving mechanism that moves the first liquid jetting member and a second moving mechanism that moves the second liquid jetting member. In this way, both sides of the workpiece can be processed.

[0012] (4) In one aspect (3) of the present invention, the apparatus may further include a first drive source that applies a drive force to the first moving mechanism and a second drive source that applies a drive force to the second moving mechanism, and the first liquid jetting member and the second liquid jetting member may be driven asynchronously. When the first and second liquid jetting members face each other across the workpiece, the processing liquid is jetted toward both sides of the workpiece in the same region. If the workpiece has through-holes that penetrate both sides, it is difficult for the processing liquid to pass through the through-holes. When the first and second liquid jetting members move synchronously, the positions at which the first and second liquid jetting members face each other during one reciprocating movement of the first and second liquid jetting members are always the same relative to the workpiece. However, when the first and second liquid jetting members move asynchronously, the positions can be made different each time relative to the workpiece. This makes it easier for the processing liquid to pass through the through-holes.

[0013] (5) In one aspect (3) or (4) of the present invention, the treatment tank may be divided into a first tank and a second tank by lowering the jig holding the workpiece from above the treatment tank and attaching it thereto. In this way, the first liquid-squirting member can agitate the treatment liquid in the first tank, and the second liquid-squirting member can agitate the treatment liquid in the second tank, and further, it is possible to eliminate any adverse effect that agitation in one tank has on the other tank.

[0014] (6) In one aspect (5) of the present invention, the processing tank may include buffer tanks communicating with the first tank and the second tank, respectively, on the outsides of the two sidewall portions located at both ends in the reciprocating direction, and containing the processing liquid. This allows the processing liquid pushed toward both ends of the processing tank by the first liquid-squirting member and the second liquid-squirting member to escape into the buffer tank. This reduces the effects of reflected waves of the processing liquid generated at both ends of the processing tank. Furthermore, the flow of processing liquid between the first tank and the second tank can be ensured via the buffer tank.

[0015] (7) In one aspect (5) of the present invention, the treatment tank may include a first treatment tank and a second treatment tank connected in a direction parallel to the reciprocating direction and separated by a first buffer tank. The jig may include a first jig that holds a first workpiece and separates the first treatment tank into the first tank and the second tank, and a second jig that holds a second workpiece and separates the second treatment tank into the first tank and the second tank. The first buffer tank may allow the treatment liquid to flow between the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second tank of the second treatment tank. The first treatment tank may include a second buffer tank that allows the treatment liquid to flow between the first tank and the second tank in the first treatment tank, outside a first sidewall portion located at one end in the reciprocating direction. The second processing tank may include a third buffer tank on the outside of a second side wall portion located at the other end in the reciprocating direction, for circulating the processing liquid between the first tank and the second tank in the second processing tank. In this way, the first workpiece and the second workpiece can be processed simultaneously, and in this case, the same actions and effects as those of one embodiment (6) of the present invention can be achieved.

[0016] Fig. 6(A) to Fig. 6(C) are diagrams showing the relationship between a rectifier and a clamper; Fig. 6(A) is a plan view of a surface treatment device according to a first embodiment of the present invention; Fig. 6(B) is a cross-sectional view of the surface treatment device; Fig. 6(C) is a diagram showing the structure and operation of a liquid jetting member; Fig. 6(B) is a front view of a jig; Fig. 6(C) is a rear view of a jig; Fig. 6(B) is a diagram showing the relationship between a rectifier and a clamper; Fig. 6(C) is a plan view of a surface treatment device according to a second embodiment of the present invention;

[0017] The following disclosure provides many different embodiments and examples for implementing different features of the presented subject matter. Of course, these are merely examples and are not intended to be limiting. Furthermore, the present disclosure may repeat reference numerals and / or letters in various examples. Such repetition is for the sake of brevity and clarity and does not, in itself, require a relationship between the various embodiments and / or configurations being described. Furthermore, when a first element is described as being "connected" or "coupled" to a second element, such a description includes embodiments in which the first and second elements are directly connected or coupled to each other, as well as embodiments in which the first and second elements are indirectly connected or coupled to each other with one or more other intervening elements therebetween. Furthermore, when a first element is described as "moving" relative to a second element, such a description includes embodiments in which at least one of the first and second elements moves relative to the other.

[0018] 1 is a schematic diagram of a surface treatment apparatus, such as an electrolytic plating apparatus, according to this embodiment. The electrolytic plating apparatus 1 has a flat jig 10 for holding a workpiece W, and a surface treatment tank 100A in which the jig 10 is installed. The workpiece W has a first main surface (e.g., a front surface) W Ｆ and a second main surface (e.g., a back surface) W Ｂ At least one of the surfaces is the surface to be treated, and in this embodiment, both of the surfaces are the surface to be treated.

[0019] 1 and 2, a surface treatment tank 100A containing a treatment liquid, for example, a plating liquid 2, has support portions 110 and 120 that detachably support a jig 10 that holds a workpiece W in a vertical position. The lower support portion 110 has a slit into which the lower end of the jig 10 is inserted. The upper support portion 120 also has a slit into which the side edge of the jig 10 is inserted. The jig 10 is lowered from an upper opening of the surface treatment tank 100A and is held in a vertical position by the support portions 110 and 120. The upper support portion 120 has a terminal group (not shown) that contacts terminal groups 35A, 35B, 45A, and 45B of the jig 10, which will be described later. As a result, the jig 10 is lowered from above and supported by the upper support portion 120, allowing the terminal groups 35A, 35B, 45A, and 45B of the jig 10 to be connected to a rectifier (not shown) located outside the surface treatment tank 100A. The support portions 110 and 120, the jig 10 supported by the support portions 110 and 120, and the workpiece W held by the jig 10, partition the surface treatment tank 100A into a first tank 101 and a second tank 102, as shown in FIGS. 1 and 2. The first tank 101 and the second tank 102 do not necessarily need to be sealed liquid-tight. The surface treatment tank 100A has openings 103 and 104 at its lower portion, as shown in FIGS. 1 and 2. The opening 103 is formed facing the first tank, and the opening 104 is formed facing the second tank 102. The surface treatment tank 100A is supplied with a prepared plating solution 2, for example, through an opening at the top, and is discharged from the openings 103 and 104. The discharged plating solution 2 is repeatedly supplied to the surface treatment tank 100A after being adjusted by filtering, replenishing each main component, etc. Note that the plating solution 2 is supplied from the openings 103 and 104, and any overflowing plating solution may be discharged, for example.

[0020] As shown in FIGS. 1 and 2, the surface treatment tank 100A is configured to treat the surface W of the workpiece W. Ｆ and back W Ｂ The first anode box 140 is connected to the surface W of the workpiece W. Ｆ The second anode box 150 holds the first anode 142 facing the back surface W of the workpiece W. ＢIn order to perform electrolytic plating, at least one rectifier is connected to the first anode 142 and the second anode 152, and the workpiece W is set as the cathode via the jig 10.

[0021] 1 and 2, the surface treatment tank 100A has a liquid jetting member 200 (200A and 200B) between the workpiece W and the anodes 142 and 152. The liquid jetting member 200 (200A and 200B) jets liquid onto the main surface W of the workpiece W. Ｆ , W Ｂ The liquid jetting members 200 (200A and 200B) are moved in a reciprocating direction parallel to the arrows 201 and 201. Details of the liquid jetting members 200 (200A and 200B) will be described later.

[0022] 1.2. Workpiece The workpiece W is, for example, a rectangular circuit board, and is plated with, for example, copper by the electrolytic plating apparatus 1. However, the type of plating is not important. The circuit board W has a surface W Ｆ and / or back surface W Ｂ and a via hole can be formed in the surface W Ｆ and back W Ｂ In this case, the inner walls of the via holes and the through holes are also plated. Ｆ and back W Ｂ The plating areas at each point may differ significantly.

[0023] 1.3. Jig The jig 10 for holding the workpiece W will be described using FIG. 4, a front view of the jig 10, and FIG. 5, a rear view of the jig 10. The workpiece W can be attached to and detached from the jig 10, for example, by an automated machine. The jig 10 has a jig body 12 formed, for example, from a flat plate made of an insulating material. The jig body 12 has a rectangular hole 14 with an area slightly larger than that of the rectangular workpiece W. The workpiece W is placed in the hole 14. The jig 10 has electrodes 15A-15D (shown in FIG. 4) and electrodes 15E-15H (shown in FIG. 5) along the four sides of the rectangular hole 14. These electrodes 15A-15H are insulated from one another. Each of the electrodes 15A-15H holds a plurality of clampers 20. The clampers 20 clamp the workpiece W from both sides. 4 and 5, the clamper 20 may include a clamper 21 for clamping the upper edge of the workpiece W, a clamper 22 for clamping the left edge of the workpiece W, a clamper 23 for clamping the lower edge of the workpiece W, and a clamper 24 for clamping the right edge of the workpiece W. Here, the clamper 21 clamps the surface W of the workpiece W. Ｆ and a clamp piece 31 (FIG. 4) that contacts the back surface W of the workpiece W. Ｂ and clamp piece 41 ( FIG. 5 ) that contacts the workpiece W. In this embodiment, clamp piece 31 and clamp piece 41 are electrically insulated. Similarly, clamper 22 includes electrically insulated clamp pieces 32 and 42, clamper 23 includes electrically insulated clamp pieces 33 and 43, and clamper 24 includes electrically insulated clamp pieces 34 and 44. Clamp piece 31 is electrically connected to electrode 15A, clamp piece 32 is electrically connected to electrode 15B, clamp piece 33 is electrically connected to electrode 15C, clamp piece 34 is electrically connected to electrode 15D, clamp piece 41 is electrically connected to electrode 15E, clamp piece 42 is electrically connected to electrode 15H, clamp piece 43 is electrically connected to electrode 15G, and clamp piece 44 is electrically connected to electrode 15F. In this way, clamp pieces 31 to 34 and 41 to 44 are insulated from each other, so that different currents can flow on the front and back of the workpiece W and from each of the four sides on the front and back.

[0024] As shown in Figures 4 and 5, conductive patterns 31A, 32A1, 32A2, 33A, 31B, 33B, 34B1, and 34B2 electrically connected to the clampers 20 are formed on the jig body 12 made of insulating material. In the left region of the surface of the jig body 12, as shown in Figure 4, the clamp piece 31L of the clamper 21L located in the left region among the multiple clampers 21 is connected to the conductive pattern 31A via electrode 15A. The clamp piece 32U of the clamper 22U located in the upper region among the multiple clampers 22 is connected to the conductive pattern 32A1 via electrode 15B. The clamp piece 32L of the clamper 22L located in the lower region among the multiple clampers 22 is connected to the conductive pattern 32A2 via electrode 15B. The clamp piece 33L of the clamper 23L located in the left region among the multiple clampers 23 is connected to the conductive pattern 33A via electrode 15C. These conductive patterns 31A, 32A1, 32A2, and 33A are connected to a group of terminals 35A formed on a protruding portion 16A that protrudes in the width direction at the top of the jig body 12, for example, via wiring 36A.

[0025] In the right region of the surface of the jig body 12, as shown in FIG. 4, the clamp piece 31R of the clamper 21R in the right region among the multiple clampers 21 is connected to the conductive pattern 31B via the electrode 15A. The clamp piece 34U of the clamper 24U in the upper region among the multiple clampers 24 is connected to the conductive pattern 34B2 via the electrode 15D. The clamp piece 34L of the clamper 24L in the lower region among the multiple clampers 24 is connected to the conductive pattern 34B1 via the electrode 15D. The clamp piece 33R of the clamper 23R in the right region among the multiple clampers 23 is connected to the conductive pattern 33B via the electrode 15C. These conductive patterns 31B, 33B, 34B1, 34B2 are connected to a terminal group 35B formed on a protrusion 16B that protrudes in the width direction at the top of the jig body 12, for example, via wiring 36B. In this way, the surface W of the rectangular workpiece W is Ｆ With this, current can be controlled independently for up to four divisions (top, bottom, left, and right).

[0026] Meanwhile, in the right region of the back surface of the jig body 12, as shown in FIG. 5 , the clamp piece 41R of the clamper 21R in the right region (left region as viewed from the front) of the multiple clampers 21 is connected to the conductive pattern 41A via electrode 15E. The clamp piece 42U of the clamper 22U in the upper region of the multiple clampers 22 is connected to the conductive pattern 42A1 via electrode 15H. The clamp piece 42L of the clamper 22L in the lower region of the multiple clampers 22 is connected to the conductive pattern 42A2 via electrode 15H. The clamp piece 43R of the clamper 23R in the right region (left region as viewed from the front) of the multiple clampers 23 is connected to the conductive pattern 43A via electrode 15G. These conductive patterns 41A, 42A1, 42A2, and 43A are connected to a terminal group 45A formed on the protrusion 16A of the jig body 12, for example, via wiring 37A.

[0027] 5, in the left region of the rear surface of the jig body 12, the clamp piece 41L of the clamper 21L in the left region among the plurality of clampers 21 is connected to the conductive pattern 41B via the electrode 15E. The clamp piece 44U of the clamper 24U in the upper region among the plurality of clampers 24 is connected to the conductive pattern 44B1 via the electrode 15F. The clamp piece 44L of the clamper 24L in the lower region among the plurality of clampers 24 is connected to the conductive pattern 44B2 via the electrode 15F. The clamp piece 43 of the clamper 23 in the left region among the plurality of clampers 23 is connected to the conductive pattern 43B via the electrode 15G. These conductive patterns 41B, 43B, 44B1, 44B2 are connected to a terminal group 45B formed on the protrusion 16B of the jig body 12, for example, via wiring 37B. In this way, the rear surface W of the rectangular workpiece W Ｂ However, the current can be controlled independently in up to four sections, top, bottom, left and right.

[0028] The conductive patterns 41A, 41B, 42A1, 42A2, 43A, 43B, 44B1, and 44B2 formed on the front and back surfaces of the jig 10 are insulated to prevent plating from adhering to them. Furthermore, the electrodes 15A-15D shown in FIG. 4 and the electrodes 15E-15H shown in FIG. 5 are arranged near the periphery of the workpiece W and can function as dummy electrodes to eliminate abnormalities in plating thickness, known as "dog bones," caused by electric field concentration around the periphery of the workpiece W. The electrodes 15A-15D shown in FIG. 4 and the electrodes 15E-15H shown in FIG. 5 can be covered with position-adjustable insulators 17A-17D that adjust the electrode exposure in the region between two adjacent clampers to prevent plating from adhering to them and to adjust the electrode exposure amount (see Japanese Patent Application No. 2019-15827 by the present applicant).

[0029] The clamper may be capable of holding the workpiece W by covering a small gap formed around the workpiece W in the hole 14 of the jig 10. In this way, the jig 10, the workpiece W, and the support parts 110, 120 of the surface treatment tank 100A can almost completely divide the interior of the surface treatment tank 100A into a first tank 101 and a second tank 102 located on the front and back of the workpiece W.

[0030] 1.4. Rectifier In this embodiment, at least the surface W of the workpiece W Ｆ and back W Ｂ In order to independently set the current flowing through the workpiece W, it is preferable to provide a plurality of rectifiers as shown in Figures 6(A) to 6(C). In Figure 6(A), two rectifiers 300A and 300B are provided. The rectifier 300A is connected to the surface W of the workpiece W. Ｆ The rectifier 300B is electrically connected to the clamp pieces 31 to 34 that contact the back surface W of the workpiece W. Ｂ The two rectifiers 300A and 300B are independently controlled to electrically connect the clamp pieces 41 to 44 that contact the surface W of the workpiece W. Ｆ and back W Ｂ In this way, the current flowing through the surface W of the workpiece W can be set independently. Ｆ and back W ＢEven if the plating areas at the respective locations are significantly different, the current can be adjusted according to the plating area and plating location. In this case, the contacts at which the two rectifiers 300A and 300B are electrically connected to the first anode 142 and the second anode 152 are disposed, for example, at the centers of the first anode 142 and the second anode 152.

[0031] In FIG. 6B, four rectifiers 310A to 310D are provided, and the rectifier 310A is arranged to irradiate the surface W of the workpiece W. Ｆ The rectifier 310B is electrically connected to the clamp pieces 31, 32U, 34U that contact the upper region of the workpiece W. Ｆ The rectifier 310C is electrically connected to the clamp pieces 33, 32L, 34L that contact the lower area of ​​the workpiece W. Ｂ The rectifier 310D is electrically connected to the clamp pieces 41, 42U, 44U that contact the upper region of the workpiece W. Ｂ In this way, the clamp pieces 43, 42L, 44L that come into contact with the lower region of the surface W of the workpiece W are electrically connected. Ｆ and back W Ｂ Each of these makes it possible to independently control the current flowing in two regions, the upper region and the lower region of the workpiece W, i.e., a total of four regions on the front and back sides. In this case, the contact points at which the four rectifiers 310A to 310D are electrically connected to the first anode 142 and the second anode 152 are arranged corresponding to a total of four regions, namely, the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152.

[0032] In FIG. 6C, eight rectifiers 320A to 320H are provided, and the rectifier 320A is arranged to irradiate the surface W of the workpiece W. Ｆ The rectifier 320B is electrically connected to the clamp pieces 31L and 32U that contact the upper left region of the workpiece W. Ｆ The rectifier 320C is electrically connected to the clamp pieces 32L and 33L that contact the lower left region of the workpiece W. Ｆ The rectifier 320D is electrically connected to the clamp pieces 31R and 34U that contact the upper right region of the workpiece W. Ｆ The rectifier 320E is electrically connected to the clamp pieces 33R and 34L that contact the lower right region of the workpiece W. ＢThe rectifier 320F is electrically connected to the clamp pieces 41L and 44U that contact the upper left region of the workpiece W. Ｂ The rectifier 320G is electrically connected to the clamp pieces 43L and 44L that contact the lower left region of the workpiece W. Ｂ The rectifier 320H is electrically connected to the clamp pieces 41R and 42U that contact the upper right region of the workpiece W. Ｂ The clamp pieces 42L and 43R are electrically connected to the lower right region of the workpiece W. Ｆ and back W Ｂ Each of these makes it possible to independently control the current flowing in four regions, the upper left region, lower left region, upper right region, and lower right region, of the workpiece W, i.e., a total of eight regions on the front and back sides. In this case, the contact points at which the eight rectifiers 320A to 320H are electrically connected to the first anode 142 and the second anode 152 are arranged corresponding to a total of eight regions, namely the upper left region, lower left region, upper right region, and lower right region of the first anode 142, and the upper left region of the second anode 152, the upper region of the first anode 142, the lower region of the first anode 142, the upper region of the second anode 152, and the lower region of the second anode 152. However, the workpiece W may be divided into more than eight regions on the front and back sides.

[0033] 1.5. Liquid jetting member The liquid jetting member 200 jets liquid onto the surface W of the workpiece W. Ｆ and the first anode 142, and the back surface W of the workpiece W. Ｂ and the second anode 152. The first liquid jetting member 200A is moved by a first reciprocating mechanism 270 (first moving mechanism) A to the surface W of the workpiece W. Ｆ The second liquid ejection member 200B is moved in a reciprocating direction parallel to the back surface W of the workpiece W by a second reciprocating mechanism (second moving mechanism) 270B. Ｂ The first and second reciprocating mechanisms 270A and 270B can utilize various rotary motion-to-reciprocating linear motion conversion mechanisms such as a slider-crank mechanism or an eccentric cam, and detailed descriptions thereof will be omitted here.

[0034] In this embodiment, the surface W of the workpiece W Ｆ and back W ＢOne liquid jetting member 200A, 200B is provided for each of the workpieces W. It is preferable that the liquid jetting members 200A, 200B are reciprocated with a stroke longer than the width of the workpiece W. In this way, the liquid jetting members 200A, 200B do not turn back at the positions where they overlap the widthwise ends of the workpiece W. Therefore, the time that the liquid jetting member 200 is in the shadow of the electric field between the cathode and the anode does not differ between both ends of the workpiece W and positions other than the both ends. The surface W of the workpiece W Ｆ and back W Ｂ It is also possible to provide multiple liquid jetting members for each surface of the workpiece W. In this way, the movement stroke of each liquid jetting member can be shortened. However, this has the disadvantage that the time during which the liquid jetting member 200 is in the shadow of the electric field relative to the anodes 142 and 152 differs depending on the area of ​​the workpiece W (for example, both ends and the center).

[0035] As shown in FIG. 3 , the liquid jetting member 200 (200A and 200B) includes a first guide body 210 having two surfaces that intersect, for example, perpendicular to the reciprocating direction, and a second guide body 220 and a third guide body 230 that are respectively disposed on, for example, both sides of the first guide body 210, with a gap between them and the two surfaces of the first guide body 210. Each pair of adjacent guide bodies among the first to third guide bodies 210-230 constitutes a pair of plate members that are formed along an extension direction toward the workpiece W between the anode 142, 152 and the workpiece W, and are spaced apart in a direction that intersects with the extension direction. As shown in FIG. 2 , each of the first and second guide bodies 210-230 has a height that extends at least the vertical length of the workpiece W. A first passage 201 is formed between the first pair of plate members formed by the first guide body 210 and the second guide body 220. A second passage 202 is formed between the second pair of plate members formed by the first guide body 210 and the third guide body 230. The first guide body 210 is formed, for example, longer than the second guide body 220 and the third guide body 230, and both ends thereof protrude beyond the corresponding ends of the second guide body 220 and the third guide body 230. The end of the first guide body 210 facing the workpiece W is, for example, tapered. The end of the first guide body 210 closer to the anode boxes 140 and 150 is fixed to a base end 240 extending, for example, parallel to the workpiece W. The second guide body 220 and the third guide body 230 may further include a fourth guide body 250 extending, for example, parallel to the base end 240. A third passage 203 is formed between the fourth guide body 250 extending from the second guide body 220 and the base end 240. The third passage 203 is connected to the first passage 201 and guides the processing liquid to the first passage 201. Similarly, a fourth passage 204 is formed between a fourth guide body 250 extending from the third guide body 230 and the base end portion 240. The fourth passage 204 is connected to the second passage 202 and guides the treatment liquid to the second passage 202. The first guide body 210, the second guide body 220, and the third guide body 230 are connected at a constant interval by flat spacers 260. As shown in FIG. 2 , a plurality of spacers 260 can be provided at intervals in the height direction.

[0036] The first liquid jetting member 200A is moved in reciprocating directions A and B in Fig. 2 by, for example, connecting its base end 240 to a first reciprocating mechanism 270A to which a driving force is applied by, for example, a first drive source 280A. Similarly, the second liquid jetting member 200B is moved in reciprocating directions A and B in Fig. 2 by, for example, connecting its base end 240 to a second reciprocating mechanism 270B to which a driving force is applied by, for example, a second drive source 280B. When the liquid jetting members 200 (200A and 200B) move in the forward direction A in Fig. 3 out of the reciprocating directions A and B in Fig. 2, the plating liquid blocked by the first guide body 210 is guided along a first passage 201 between a first pair of plates formed by the first guide body 210 and the second guide body 220 and jetted toward the workpiece W. When the liquid jetting member 200A moves in the return direction B of the reciprocating directions A and B, the plating liquid blocked by the first guide body 210 is guided along the second passage 202 between the second pair of plates formed by the first guide body 210 and the third guide body 230, and jetted toward the workpiece W. Similar to the first liquid jetting member 200A, the second liquid jetting member 200B jets the plating liquid toward the workpiece W through the first passage 201 when moving in the forward direction A, and jets the plating liquid toward the workpiece W through the second passage 202 when moving in the return direction B. It is not necessary to provide both the first passage 201 and the second passage 202. In either case of movement of the liquid ejection member 200 (200A and 200B) in the reciprocating directions A and B, the third passage 203 and the fourth passage 204 may be formed by other guide bodies, such as inclined or curved, so as to guide the processing liquid to a common passage between at least one pair of plate materials.

[0037] In this way, the processing liquid 2 collides with the workpiece W, and the main surface W of the workpiece W Ｆ , W ＢThis agitates the processing liquid in the vicinity to prevent the processing liquid from stagnating, and also allows fresh processing liquid 2 rich in plating components near the anode boxes 140, 150 to be supplied to the workpiece W, thereby accelerating the plating process. Furthermore, the liquid jetting members 200 (200A and 200B) can jet the processing liquid 2 uniformly toward the workpiece W in the vertical direction of FIG. 2 , excluding the spacer 260. The spacer 260 can be formed in a thin plate shape, so the in-plane uniformity of the processing of the workpiece W is not impaired.

[0038] Here, the first drive source 280A and the second drive source 280B can be driven asynchronously. When the first and second liquid jetting members 200A and 200B face each other across the workpiece W, the processing liquid 2 is jetted toward both sides of the workpiece W in the same region. If the workpiece W has through-holes that penetrate both sides, the processing liquid 2 is less likely to pass through the through-holes. The positions at which the first and second liquid jetting members 200A and 200B face each other during one reciprocating movement are always the same if the first and second liquid jetting members are moved synchronously. However, by moving the first and second liquid jetting members asynchronously, the positions can be made different each time. This ensures reliable plating within the through-holes formed in the workpiece W, regardless of their positions. Furthermore, the first drive source 280A and the second drive source 280B may move the liquid jetting members 200A and 200B at different speeds. In this way, the pressure of the processing liquid 2 acting on the workpiece W is different between the front and back surfaces WF and WB. Utilizing this pressure difference, it is possible to facilitate the passage of the processing liquid through the through-holes. In this case, the first driving source 280A and the second driving source 280B may be driven synchronously, or the first and second driving sources 280A and 280B may be the same driving source.

[0039] Furthermore, the surface treatment tank 100A is divided into a first tank 101 and a second tank 102 when a jig 10 holding a workpiece W is lowered from above and attached thereto. When the first and second liquid jetting members 200A and 200B are reciprocated, the liquid flow is blocked by the second and third guide bodies 220 and 230, and the repulsive liquid flow becomes an agitating flow that agitates the entire tank. In this case, the first liquid jetting member 200A agitates the treatment liquid in the first tank 101, and the second liquid jetting member 200B agitates the treatment liquid in the second tank 102, and further, it is possible to eliminate any adverse effects that agitation in one tank has on the other.

[0040] The surface treatment tank 100A may also have buffer tanks 107 and 108 on the outsides of the two sidewalls 105 and 106 located at both ends in the reciprocating directions A and B. An opening 105A formed in the sidewall 105 connects the first tank 101 to the buffer tank 107. An opening 105B formed in the sidewall 105 connects the second tank 102 to the buffer tank 107. An opening 106A formed in the sidewall 106 connects the first tank 101 to the buffer tank 108. An opening 106B formed in the sidewall 106 connects the second tank 102 to the buffer tank 108. This allows the treatment liquid pushed toward each end of the treatment tank 100A by the liquid ejection members 200 (200A and 200B) to escape to the buffer tanks 107 and 108. In this way, the influence of reflected waves of the processing solution generated at both ends of the processing tank 100 A can be reduced. In addition, the flow of the processing solution between the first tank 101 and the second tank 102 can be ensured via the buffer tanks 107 and 108.

[0041] 2. Second Embodiment Fig. 7 is a plan view of a surface treatment apparatus according to a second embodiment of the present invention. In Fig. 7, a treatment tank 100B can include a first treatment tank 100B1 and a second treatment tank 100B2 that are connected in a direction parallel to the reciprocating direction and are separated by a first buffer tank 109. The jigs can include a first jig 10A that holds a first workpiece W1 and separates the first treatment tank 100B1 into a first tank 101 and a second tank 102, and a second jig 10B that holds a second workpiece W2 and separates the second treatment tank 100B2 into a first tank 101 and a second tank 102. In this case, the first buffer tank 109 may include first to fourth openings 109A1, 109A2, 109B1, and 109B2 that interconnect the first tank 101 of the first treatment tank 100B1, the first tank 101 of the second treatment tank 100B2, the second tank 102 of the first treatment tank 100B1, and the second tank 102 of the second treatment tank 100B2. The first treatment tank 100B1 may also include a second buffer tank 107, located on the outside of a first sidewall portion 105 provided at one end in the reciprocating direction, that allows the treatment liquid to circulate between the first tank 101 and the second tank 102 in the first treatment tank 100B1. The second treatment tank 100B2 may include a third buffer tank 108, located outside the second sidewall 106 at the other end of the reciprocating direction, for circulating the treatment solution between the first tank 101 and the second tank 102 in the second treatment tank 100B2. In this manner, the first workpiece W1 and the second workpiece W2 can be simultaneously treated, achieving the same effects and advantages as the treatment tank 100A of FIG. 1 . A central wall may be provided instead of the first buffer tank 109. In this case, the central wall may have a first opening communicating with the first tank 101 of the first treatment tank 100B1 and the first tank 101 of the second treatment tank 100B2, and a second opening communicating with the second tank 102 of the first treatment tank 100B1 and the second tank 102 of the second treatment tank 100B2. However, in this case, the first tank 101 and the second tank 102 cannot be communicated with each other.

[0042] In the second embodiment, the first jig 10A and the second jig 10B may be integrally configured. Alternatively, the two first liquid jetting members 200A may be driven by the same drive source, and the other two second liquid jetting members 200B may be driven by the same drive source. In a broad sense, the surface treatment tank may be configured by connecting first to Nth (N is an integer of 2 or greater) treatment tanks. When N≧3, (N−1) partition walls are provided parallel to the side walls located at both ends in the reciprocating direction.

[0043] REFERENCE SIGNS LIST 1...surface treatment device, 2...treatment liquid, 10, 10A, 10B...jig, 12...main body plate, 13A...lower part, 13B...first side part, 13C...second side part, 14...rectangular opening, 16A, 16B...projecting pieces, 21, 41...first clamper, 22, 42...second clamper, 23, 43...third clamper, 24, 44...fourth clamper, 31A to 34B2, 41A to 44B2...conductive patterns, 35A, 35B, 45A, 45B...terminal group, 36A to 37B...wiring, 100A, 100B...surface treatment tank, 101...first tank, 102...second tank, 103, 104...opening, 105, 106 ...Side wall portion, 105A, 105B, 106A, 106B...Opening, 107, 108, 109...Buffer tank, 109A, 109B...First and second openings, 110...Lower support portion, 120...Upper support portion, 142...First anode, 152...Second anode, 200 (200A, 200B)...Liquid jetting member, 201-204...First to fourth passages, 210...First guide body, 220...Second guide body, 230...Third guide body, 240...Base portion, 250...Fourth guide body, 260...Spacer, 270A, 270B...Moving mechanism, 270A...First moving mechanism, 270B...Second moving mechanism, W...Work, W Ｆ ...First principal surface, W Ｂ ...Second principal surface

Claims

1. A surface treatment apparatus comprising: a treatment tank that contains a treatment liquid; an anode that is placed in the treatment tank; a jig that holds a workpiece immersed in the treatment liquid in a hanging manner and sets the workpiece as a cathode; a liquid jetting member that is placed in the treatment liquid between the anode and the workpiece; and a movement mechanism that moves the liquid jetting member relative to the workpiece, wherein the liquid jetting member is formed along an extension direction toward the workpiece between the anode and the workpiece and includes at least a pair of plate members that are spaced apart in a direction intersecting the extension direction, and the treatment liquid that flows due to the movement of the liquid jetting member is guided between the at least pair of plate members and jetted toward the workpiece.

2. A surface treatment device according to claim 1, wherein the moving mechanism moves the liquid jetting member in a reciprocating direction parallel to the workpiece, the liquid jetting member comprising: a first guide body having two surfaces intersecting the reciprocating direction; and a second guide body and a third guide body arranged with a gap between each of the two surfaces of the first guide body, the at least one pair of plate materials comprising: a first pair of plate materials formed by the first guide body and the second guide body; and a second pair of plate materials formed by the first guide body and the third guide body, wherein when the liquid jetting member moves in a forward direction of the reciprocating direction, the processing liquid held back by the first guide body is guided along the gap between the first pair of plate materials and sprayed towards the workpiece, and when the liquid jetting member moves in a backward direction of the reciprocating direction, the processing liquid held back by the first guide body is guided along the gap between the second pair of plate materials and sprayed towards the workpiece.

3. A surface treatment device according to claim 2, wherein the anode includes a first anode and a second anode arranged on either side of the workpiece, the liquid jetting member includes a first liquid jetting member arranged between the first anode and the workpiece, and a second liquid jetting member arranged between the second anode and the workpiece, and the moving mechanism includes a first moving mechanism that moves the first liquid jetting member, and a second moving mechanism that moves the second liquid jetting member.

4. A surface treatment device according to claim 3, further comprising a first drive source that applies a drive force to the first moving mechanism and a second drive source that applies a drive force to the second moving mechanism, wherein the first liquid ejection member and the second liquid ejection member are driven asynchronously.

5. A surface treatment device according to claim 3 or 4, characterized in that the treatment tank is divided into a first tank and a second tank by the jig holding the workpiece being lowered from above the treatment tank and attached thereto.

6. A surface treatment device according to claim 5, characterized in that the treatment tank includes buffer tanks on the outside of two side wall portions located at both ends in the reciprocating direction, each of which is connected to the first tank and the second tank and contains the treatment liquid.

7. In claim 5, the treatment tank includes a first treatment tank and a second treatment tank connected in a direction parallel to the reciprocating direction and separated by a first buffer tank, the jig includes a first jig that holds a first workpiece and separates the first treatment tank into the first tank and the second tank, and a second jig that holds a second workpiece and separates the second treatment tank into the first tank and the second tank, the first buffer tank allows the treatment liquid to circulate between the first tank of the first treatment tank, the first tank of the second treatment tank, the second tank of the first treatment tank, and the second tank of the second treatment tank, and the first treatment tank includes a second buffer tank on the outside of a first side wall portion located at one end in the reciprocating direction and allows the treatment liquid to circulate between the first tank and the second tank in the first treatment tank, The second treatment tank includes a third buffer tank on the outside of a second side wall portion located at the other end of the reciprocating direction, which allows the treatment liquid to circulate between the first tank and the second tank in the second treatment tank.