Resin-molding device and method for producing resin molded article

Abstract

The resin-molding device (100) according to the present invention is provided with a table (6) that is at least partially translucent, an illumination unit (63) capable of illuminating the table (6) from below, a resin-material-supplying unit (8) that supplies a resin material onto the table (6), an imaging unit (300) capable of capturing an image of the resin material supplied onto the table (6) , and a resin-molding unit (5) that performs resin molding using the resin material supplied onto the table (6).

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] In recent years, there has been a demand for thinner semiconductor packages, and in-plane uniformity of the resin supply amount is required to ensure consistent package thickness over a wide area. For example, Patent Document 1 describes a technique in which a release film is placed on a table, liquid resin is supplied onto the release film, and an image of the resin is captured by a camera (see FIG. 3, etc.). Patent Document 2 describes a technique in which a release film is placed on a moving table, granular resin is supplied onto the release film, and the resin is observed (see paragraphs 0048, 0049, FIG. 1, etc.). In both of these patent documents, the in-plane uniformity of the resin material is identified by observing the resin material layered on the release film.

[0003] Japanese Patent No. 6218891 Japanese Patent Application Laid-Open No. 2020-82534

[0004] Although not explicitly stated in the above publications, in the prior art, the camera and lighting are both placed above the resin material. This means that the direction of the lighting is tilted relative to the imaging direction. As a result, shadows are cast on the resin material, creating variations in brightness and darkness, which can lead to erroneous recognition of in-plane uniformity.

[0005] The present invention has been made to solve this problem, and aims to provide a resin molding device and a method for manufacturing a resin molded product that can detect the occurrence of thickness variations within a single resin molded product.

[0006] The resin molding apparatus of the present invention comprises a table having at least a portion that is translucent, an illumination unit that can illuminate from below the table, a resin material supply unit that supplies resin material onto the table, an imaging unit that can image the resin material supplied onto the table from above, and a resin molding unit that performs resin molding using the resin material supplied onto the table.

[0007] The method for manufacturing a resin molded product according to the present invention comprises the steps of supplying a resin material onto a table having at least a portion that is translucent, imaging the supplied resin material from above while illuminating the table from below, and performing resin molding using the resin material supplied onto the table.

[0008] According to the present invention, it is possible to detect the occurrence of thickness variations within one resin molded product.

[0009] 10 is a plan view schematically showing a resin molding apparatus. FIG. 10 is a plan view of a moving table. FIG. 10 is a cross-sectional view of the moving table. FIG. 10 is a view explaining the operation of a release film supply unit. FIG. 10 is a cross-sectional view explaining a resin material storage unit. FIG. 10 is a cross-sectional view schematically showing a resin material supply unit. FIG. 10 is a view explaining an image capturing state by an imaging unit. FIG. 10 is a view showing an example of a recess in a state where resin material has been supplied. FIG. 10 is a flowchart showing a partial operation procedure in a resin molding apparatus. FIG. 10 is a flowchart showing a procedure of an analysis process executed in step S230 of FIG. 9. FIG. 10 is a view explaining an area included in image data showing a recess. FIG. 10 is a diagram showing an example of analysis data. FIG. 10 is a cross-sectional view explaining the irradiation of light onto a resin material. FIG. 10 is a photograph of a resin material captured by a resin molding apparatus to which the present invention is applied. FIG. 10 is a photograph of a resin material captured by a conventional resin molding apparatus.

[0010] Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described in detail with reference to the drawings. In addition, for ease of understanding, the drawings may be drawn in a schematic manner with appropriate objects omitted or exaggerated.

[0011] 1 is a schematic plan view of a resin molding apparatus 100 according to this embodiment. The resin molding apparatus 100 is configured to resin-seal a substrate W to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, thereby producing a resin-molded product. In this resin molding apparatus 100, the component mounting surface of the substrate W on which electronic components are mounted is resin-sealed.

[0012] Examples of the substrate W used here include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate W may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not already have wiring applied thereto.

[0013] As shown in FIG. 1 , the resin molding apparatus 100 includes a substrate supply / storage module A (hereinafter simply referred to as “module A”), two resin molding modules B (hereinafter simply referred to as “module B”), a resin material supply module C (hereinafter simply referred to as “module C”), and a first control unit 14. The first control unit may be, for example, a programmable logic controller (PLC) or a personal computer (PC). The first control unit 14 includes a central processing unit (CPU), random access memory (RAM), read-only memory (ROM), and the like, and is configured to control each of modules A to C in response to information processing. Each of modules A to C will be described in detail below. Each module is detachable and replaceable with another module. Furthermore, the number of modules A to C in the resin molding apparatus 100 can be increased or decreased.

[0014] <1-1. Module A> Module A is a module that supplies pre-sealed substrates W and stores sealed substrates W, and has a substrate supply unit 1, a substrate storage unit 2, a substrate mounting unit 3, and a substrate transport mechanism 4. The substrate supply unit 1 is configured to supply pre-sealed substrates W onto the substrate mounting unit 3. The substrate storage unit 2 is configured to store sealed substrates W (resin molded products). The substrate mounting unit 3 is configured to move in the direction of arrow Y between a position corresponding to the substrate supply unit 1 and a position corresponding to the substrate storage unit 2. The substrate transport mechanism 4 is configured to move in the directions of arrow X and arrow Y across module A and module B, and, for example, holds a pre-sealed substrate W on the substrate mounting unit 3 in module A and transports it to module B. Alternatively, a sealed substrate W manufactured in module B is mounted on the substrate mounting unit 3 of module A.

[0015] <1-2. Module B> Each module B is a module that molds a resin material and has a compression molding unit 5 that produces an encapsulated substrate W (a resin molded product) by compression molding. For example, a black granular resin material P is used in this compression molding. The compression molding unit 5 has an upper mold 52, a lower mold 51 facing the upper mold 52, and a mold clamping mechanism 53. The upper mold 52 is configured to hold the substrate W on its underside. Meanwhile, the lower mold 51 has a bottom member and a side member for forming a concave cavity 51C. That is, the bottom member forms the bottom surface of the cavity 51C, and the side member forms the side surface of the cavity 51C. As described below, the resin material P prepared in module C is placed in the cavity 51C. The mold clamping mechanism 53 is configured to clamp the upper mold 52 to the lower mold 51 in which the resin material P is placed.

[0016] <1-3. Module C> Module C is a module for supplying resin material. As shown in FIG. 1, module C has a moving table 6, a resin material storage unit 7, a resin material supply unit 8, a release film supply unit 9, an imaging unit 300, and a resin material conveying mechanism 90. Furthermore, module C is provided with an HDD (Hard Disc Drive) 200 and a second control unit 150. This second control unit 150 corresponds to the control unit of the present invention. Each component will be described in detail below.

[0017] <1-3-1. Moving Table> FIG. 2 is a plan view of the moving table, and FIG. 3 is a cross-sectional view of FIG. 2. As shown in FIG. 1, the moving table 6 is configured to move in the directions of arrows X and Y in the module C. As shown in FIGS. 2 and 3, a recess 61 is formed in the upper surface of the moving table 6, and a light guide plate 62 is disposed in this recess 61. In addition, an LED module 63 serving as an illumination unit is disposed on a side end surface of the light guide plate 62. Light emitted from this LED module 63 enters the light guide plate 62 and is diffused within the light guide plate 62, causing the upper surface of the light guide plate 62 to emit light. The light guide plate 62 may be a known one made of acrylic resin or the like, and a reflective film or a diffusing film may be provided as necessary.

[0018] On the upper surface of the moving table 6, suction holes (not shown) are formed around the light guide plate 62, and are configured to hold a release film 73, which will be described next, by suction.

[0019] <1-3-2. Release Film Supply Unit> Figure 4 is a side view illustrating the operation of the release film supply unit. As shown in Figure 4(a), a release film supply unit 9 for placing the release film 73 on the upper surface of the movable table 6 is provided on one end side of the movable table 6. The release film supply unit 9 has a roll 91 on which the release film 73 is wound, a feeding unit 92 that pays out the release film 73 from the roll 91 and places it on the movable table 6, and a cutting unit 93 that cuts the release film 73.

[0020] As shown in FIG. 4( b ), the feeding unit 92 is configured to grip an end of the release film 73 wound around the roll 91 and release the release film 73 by separating from the roll 91. At this time, the feeding unit 92 moves above the moving table 6 from one end to the other. As a result, the release film 73 is placed on the moving table 6. The release film 73 on the moving table 6 is sucked by the suction port described above and held on the moving table 6. Furthermore, as shown in FIG. 4( c ), the end of the release film 73 on the roll 91 side is cut by the cutting unit 93. As a result, the release film 73 in the form of a sheet is placed on the moving table 6.

[0021] <1-3-3. Resin Material Container> Next, the resin material container 7 will be described. As shown in FIG. 5( a), the resin material container 7 has a frame-shaped member 72 and a moving mechanism (not shown) for moving it. The frame-shaped member 72 is formed in a rectangular shape, and is placed by the moving mechanism on the moving table 6 on which a release film 73 is placed. This forms a recess 71 into which the resin material is supplied. That is, the release film 73 forms the bottom surface of this recess 71, and the frame-shaped member 72 forms the side surface of the recess 71. Note that this recess 71 has a space corresponding to the size of the cavity 51C of the lower mold 51 of the module B.

[0022] <1-3-4. Resin Material Supply Unit> Next, the resin material supply unit 8 will be described. FIG. 6 is a cross-sectional view schematically illustrating the resin material supply unit. The resin material supply unit 8 is configured to supply a predetermined weight of resin material P to the recess 71 of the frame-shaped member 72, and includes a reservoir 11, a conveying path 12, a vibrating unit 13, and a measuring unit 16. The reservoir 11 temporarily stores granular resin material P and supplies this resin material P to the conveying path 12. The resin material supplied to the conveying path 12 is discharged from a discharge port 121 at its end and supplied to the recess 71 of the frame-shaped member 72. At this time, the vibrating unit 13 vibrates the conveying path 12, thereby conveying the resin material P toward the discharge port.

[0023] The weighing unit 16 is configured to measure the weight of the resin material P in the resin material supply unit 8. The first control unit 14 controls the vibration unit 13 based on the weighing result by the weighing unit 16 so that the amount of resin material P supplied to the resin material accommodation unit 7 becomes a target value.

[0024] The resin material P dropping from the discharge port 121 of the resin material supply unit 8 is spread evenly in the recessed portion 71 by the movement of the moving table 6 relative to the discharge port of the resin material supply unit 8 .

[0025] <1-3-5. Imaging Unit> FIG. 7 is a diagram illustrating the imaging state of the imaging unit. As shown in FIG. 7, the imaging unit 300 is configured to image the resin material P supplied to the recess 71 of the frame-shaped member 72 from above and generate image data. The imaging unit 300 images the resin material P in the recess 71, for example, with the moving table 6 positioned below the imaging unit 300. The imaging unit 300 is configured, for example, with a camera module including an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. During this imaging, light is irradiated from below the resin material P via the release film 73 by the light guide plate 62 described above.

[0026] The above-mentioned HDD 200 is configured to store image data generated by the imaging unit 300. The HDD 200 may be replaced with other storage media such as a solid state drive.

[0027] The second control unit 150 includes a CPU, RAM, ROM, etc., and is configured to control the imaging unit 300, etc. in accordance with information processing. Various controls by the first control unit 14 and the second control unit 150 will be described in detail later.

[0028] 1, the resin material conveying mechanism 90 is configured to move in the directions of arrows X and Y in modules C and B. As shown in FIG. 5(b), the resin material conveying mechanism 90 separates the frame-shaped member 72 and the release film 73 containing the resin material P from the moving table 6. Then, it conveys this to the lower mold 51 of module B, and supplies the resin material P to the cavity 51C of the lower mold 51.

[0029] 2. Suppression of Variation in Thickness of Resin Molded Product Next, a method for suppressing the thickness of the resin molded product in the module C configured as described above will be described.

[0030] In recent years, semiconductor packages (an example of a resin molded product) have become thinner, and products with thicknesses of, for example, 0.38 mm or 0.43 mm are in demand in the market. However, depending on the quality of the molding process, thickness variations may occur within a single resin molded product. In thin resin molded products, even small thickness variations can have a significant impact on the quality of the resin molded product. Thickness variations within a single resin molded product do not refer to thickness variations when comparing the thicknesses of multiple resin molded products, but rather to thickness variations within the surface of a single resin molded product, meaning thickness variations across multiple portions of the resin molded product.

[0031] For example, this problem becomes more pronounced when the resin material P is not evenly supplied to the recess 71 of the frame-shaped member 72. That is, if resin molding is performed with a shortage of resin material P in some areas of the recess 71, the thickness of the completed resin molded product will vary from area to area.

[0032] 8 is a diagram showing an example of the recess 71 in a state in which the resin material P has been supplied. As shown in FIG. 8, the recess 71 includes a region T30 and a region T40. The resin material P is sufficiently supplied in the region T30, but the resin material P is insufficient in the region T40. In the region where the resin material P is insufficient, the bottom surface of the recess 71 is exposed. The color of the bottom surface of the recess 71 is closer to white than the resin material P.

[0033] In this resin molding apparatus 100, before resin molding, the resin material P supplied to the frame-shaped member 72 is imaged by the imaging unit 300. The second control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply unit 8 based on the analysis results. In the resin molding apparatus 100, the resin material supply unit 8 is controlled based on the analysis results of the supply state of the resin material P in the recess 71, thereby improving the supply state of the resin material P in the recess 71. As a result, the resin molding apparatus 100 can prevent the production of resin molded products with varying thicknesses within a single resin molded product. The operation of the resin molding apparatus 100 will be described in detail below.

[0034] 9 is a flowchart showing a part of the operational procedure of the resin molding apparatus 100. The process shown in this flowchart is executed in a state where the recess 71 of the frame-shaped member 72 is positioned below the discharge port 121 of the resin material supply unit 8. The process shown in the flowchart on the left side is executed by the first control unit 14, and the process shown in the flowchart on the right side is executed by the second control unit 150.

[0035] 9 , the first control unit 14 controls the resin material supply unit 8 to discharge the resin material P toward the recessed portion 71 (step S100). The first control unit 14 determines whether or not the discharge of the resin material P is complete (step S110). If it is determined that the discharge of the resin material P is not complete (NO in step S110), the first control unit 14 continues to perform the processes required during the discharge of the resin material P. For example, the first control unit 14 moves the moving table 6 so that the resin material P is evenly supplied to the recessed portion 71.

[0036] On the other hand, when it is determined that the dispensing of the resin material P is completed (YES in step S110), the first control unit 14 sends a signal (image capture instruction signal) to the second control unit 150 instructing the image capture unit 300 to capture an image (S120).

[0037] 9, the second control unit 150 determines whether or not an image capture instruction signal has been received from the first control unit 14 (step S200). If it is determined that an image capture instruction signal has not been received (NO in step S200), the second control unit 150 waits until an image capture instruction signal is received.

[0038] On the other hand, if it is determined that an imaging instruction signal has been received (YES in step S200), the second control unit 150 controls the imaging unit 300 to capture an image of the resin material P in the recess 71 from above and generate image data (step S210). The second control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The second control unit 150 then executes an analysis process for the image data (step S230).

[0039] Fig. 10 is a flowchart showing the procedure of the analysis process executed in step S230 of Fig. 9. Referring to Fig. 10, second control unit 150 reads image data stored in HDD 200 (step S300). Second control unit 150 performs gradation processing and binarization processing on the read image data (step S310).

[0040] In the gradation process, each pixel of the image data is classified into 256 levels [0 (dark) - 255 (light)]. For example, "255" is assigned to white pixels, and "0" is assigned to black pixels. In the binarization process, each pixel of the image data is classified as "white" or "black." For example, pixels that are assigned a value by the gradation process equal to or greater than a threshold value X1 (e.g., 200) are classified as "white," and pixels that are assigned a value by the gradation process less than the threshold value X1 are classified as "black."

[0041] 11 is a diagram for explaining the regions included in the image data showing the recessed portion 71. As shown in FIG. 11, the image data includes regions T1 to T18.

[0042] 10 , the second control unit 150 calculates numerical data corresponding to each of the regions T1-T18 included in the image data (step S320). In this embodiment, this numerical data is the number of pixels classified as "white" in each region. That is, in step S320, the number of pixels classified as "white" in each of the regions T1-T18 is calculated. A large number of pixels classified as "white" means that the resin material P has not been evenly supplied and that a large area of ​​the surface of the recess 71 is exposed.

[0043] The second control unit 150 compares each of the numerical data calculated in step S320 with a threshold value X2 (e.g., 10) and determines whether a problem has occurred in each of the regions T1-T18 (step S330). For example, the second control unit 150 determines that a region whose numerical data exceeds the threshold value X2 is "bad" (NG) and that a region whose numerical data is equal to or less than the threshold value X2 is "good" (OK). That is, in step S320, it is determined whether a shortage of resin material P has occurred in each region of the recess 71 corresponding to each of the regions T1-T18 (whether the number of "white" pixels is greater than the threshold value X2). The second control unit 150 generates analysis data based on the comparison results in step S330 (step S340).

[0044] 12 is a diagram showing an example of analysis data D1. As shown in Fig. 12, the analysis data D1 includes a judgment result regarding OK / NG for each region of the image data, and the number of pixels classified as "white" for each region of the image data.

[0045] Referring again to the right side of FIG. 9, when the image analysis is completed in step S230, the second control unit 150 transmits the analysis data D1 to the first control unit 14 (step S240).

[0046] 9 again, the first control unit 14 determines whether or not the analysis data D1 has been received from the second control unit 150 (step S130). If it is determined that the analysis data D1 has not been received (NO in step S130), the first control unit 14 waits until the analysis data D1 is received.

[0047] On the other hand, when it is determined that the analysis data D1 has been received (YES in step S130), the first control unit 14 determines whether or not there is a problem with the state of the resin material P in the recess 71 based on the analysis data D1 (step S140). For example, if any of the regions T1-T18 is determined to be "NG," the first control unit 14 determines that there is a problem with the state of the resin material P in the recess 71 (NG), and if none of the regions T1-T18 is determined to be "NG," the first control unit 14 determines that there is no problem with the state of the resin material P in the recess 71 (OK).

[0048] If it is determined that there is no problem with the state of the resin material P in the recess 71 (OK in step S140), the first control unit 14 controls each component to proceed to the resin molding process (step S150). That is, even when the first control unit 14 controls the resin material supply unit 8 next time, the first control unit 14 maintains the operating state of the resin material supply unit 8 without particularly changing the operating state of the resin material supply unit 8.

[0049] On the other hand, if it is determined that there is a problem with the state of the resin material P in the recessed portion 71 (NG in step S140), the first control unit 14 executes the process for the NG determination (step S160). That is, the first control unit 14 changes the control content for the next time the resin material supply unit 8 is controlled, stores the change, and stops the resin molding apparatus 100. For example, when the first control unit 14 next controls the resin material supply unit 8, it controls the resin material supply unit 8 so that the shortage of resin material P is resolved in the region (T1-T18) where it was determined that there was a shortage of resin material P. More specifically, the first control unit 14 reduces the amount of resin material P supplied to the region where there was no shortage of resin material P and increases the amount of resin material P supplied to the region where there was a shortage of resin material P. This ensures that the resin material P is evenly supplied in the recessed portion 71.

[0050] 4. Features According to the resin molding apparatus 100 of this embodiment, the following effects can be obtained.

[0051] In module C, as described above, light is irradiated onto the resin material P from below the movable table 6, and this is imaged from above by the imaging unit 300. Therefore, for example, as shown in FIG. 13 , in areas where the resin material P is not densely layered and voids have formed (thin areas where the required thickness cannot be achieved), light from the light guide plate 62 passes through and can be imaged by the imaging unit 300. FIG. 14 is an example of an image captured, with the white areas indicating areas where light is passing through (the thickness of the resin material P is approximately 1.0 mm). In other words, it is believed that the resin material P is not densely layered in these white areas, and voids have formed inside.

[0052] In contrast, for example, if light is irradiated obliquely from above the movable table 6 and an image is taken with the imaging unit 300, an image like that shown in FIG. 15 is obtained. Images of the same resin material P are shown in FIGS. 14 and 15 . In FIG. 15 , the central portion (dashed line area) of the resin material appears densely layered, but in FIG. 14 , a white area appears in this area, revealing the formation of a gap within. For example, even in areas where the granular resin material P is thinly layered, if light is irradiated obliquely from above, the shadow of the resin material P makes the resin material P appear densely layered. Therefore, if an image is taken using illumination from above, even if the resin material P is not densely layered, it may be erroneously recognized as densely layered. In contrast, if light is irradiated from below the movable table 6 as in this embodiment, areas where the resin material P is not densely layered can be accurately detected, preventing erroneous recognition.

[0053] Incidentally, irradiating the resin material P with light from below in this manner has the advantage that it is easy to see visually, regardless of whether inspection is performed with a camera.

[0054] 5. Modifications Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.

[0055] (1) The configuration of the movable table 6 is not particularly limited, and various configurations are possible as long as light can be irradiated from below the resin material P. For example, in the above embodiment, light is irradiated using the light guide plate 62. However, if a light-transmitting material is placed on the movable table 6 and a light source (illumination unit) is placed below it, light can be irradiated from below the resin material P. In this case, the type of light source is not particularly limited, and in addition to an LED, for example, an organic EL, an inorganic EL, etc. can be used. Furthermore, the range in which the light-transmitting material is placed on the movable table 6 can be changed as appropriate depending on the size of the recess 71 of the frame-shaped member 72 or the imaging range.

[0056] The wavelength of the light from the light source may be changed depending on the type of resin material used. That is, since some types of resin materials may absorb light, the wavelength of the light can be selected according to the type of resin material so that the light can sufficiently pass through the less dense portions of the resin material.

[0057] (2) In the above embodiment, granular resin material P is used, but the present invention can also be applied to liquid resin such as paste. Even with such resin material, light can pass through areas where the layers are not densely stacked, making it possible to identify these areas.

[0058] (3) The resin molding unit of the present invention corresponds to module B shown in the above embodiment, but the configuration of module B is only an example, and various configurations are possible. In other words, the configuration is not particularly limited as long as it performs resin molding using the resin material supplied onto the moving table 6.

[0059] (4) In the above embodiment, the imaging unit 300 captures an image after the discharge of the resin material P is completed. However, the timing of capturing an image by the imaging unit 300 is not limited to this. For example, the imaging unit 300 may be disposed near the discharge port of the resin material supply unit 8, and the imaging unit 300 may constantly capture a video of the recess 71 while the resin material supply unit 8 is supplying the resin material P. In this case, the second control unit 150 may determine in real time whether there is a problem with the state of the resin material P in the recess 71 based on the video image data being captured, and may change the control content of the resin material supply unit 8 in real time.

[0060] (5) In the above embodiment, image analysis was performed through gradation processing and binarization processing. However, the technology used for image analysis is not limited to this. For example, regions in the recesses 71 where the resin material P is insufficient may be detected based on the results of unevenness measurement based on a 3D image of the recesses 71. Alternatively, regions in the recesses 71 where the resin material P is insufficient may be detected by using pattern matching, statistical techniques, AI (artificial intelligence), or the like.

[0061] (6) In the above embodiment, if it is determined that there is a problem with the state of the resin material P in the recess 71 (NG in step S140 in FIG. 9 ), the first control unit 14 reduces the amount of resin material P supplied to the region where there was no shortage of resin material P and increases the amount of resin material P supplied to the region where there was a shortage of resin material P from the next time. However, the control content by the first control unit 14 from the next time is not limited to this. For example, the first control unit 14 may refer to the analysis data D1 and reduce the amount of resin material P supplied to the region with fewer pixels classified as “white” and increase the amount of resin material P supplied to the region with more pixels classified as “white.”

[0062] (7) In the above embodiment, the resin molding apparatus 100 is controlled by the first control unit 14 and the second control unit 150. However, the control performed by the first control unit 14 and the second control unit 150 may be configured by a common control unit, or may be realized by, for example, one computer or three or more computers.

[0063] (8) In the above embodiment, the resin molding apparatus 100 includes the HDD 200. However, the resin molding apparatus 100 does not necessarily need to include the HDD 200. The HDD 200 may be present on a cloud server, for example. In this case, the second control unit 150 accesses the cloud server via a communication unit (not shown).

[0064] 6 Moving table: (table) 63: LED module (illumination unit) 73: Release film 9: Release film supply unit 100: Resin molding device 150: Second control unit (control unit) 300: Imaging unit

Claims

1. A resin molding device comprising: a table having at least a portion that is translucent; an illumination unit that can illuminate from below the table; a resin material supply unit that supplies resin material onto the table; an imaging unit that can image the resin material supplied onto the table from above; and a resin molding unit that performs resin molding using the resin material supplied onto the table.

2. The resin molding device according to claim 1, wherein the table is provided with a light-transmitting light guide plate, and the lighting unit is configured to irradiate light from a side end surface of the light guide plate.

3. A resin molding device as described in claim 1 or 2, further comprising a release film supply unit that supplies a release film onto the table, and configured so that the resin material is supplied onto the release film placed on the table.

4. A resin molding device as described in any one of claims 1 to 3, further comprising a control unit configured to analyze image data generated by the imaging unit and control the resin material supply unit based on the analysis results.

5. The resin molding device according to claim 4, wherein the control unit is configured to analyze the image data by performing gradation processing and binarization processing on the image data.

6. A method for manufacturing a resin molded product, comprising the steps of: supplying a resin material onto a table having at least a portion that is translucent; imaging the supplied resin material from above while illuminating the table from below; and performing resin molding using the resin material supplied onto the table.

7. The method for manufacturing a resin molded product according to claim 6, further comprising the step of placing a release film on the table prior to the step of supplying the resin material, wherein the resin material is supplied onto the release film.

8. The method for manufacturing a resin molded product according to claim 5 or 6, further comprising the step of analyzing image data generated by the imaging and controlling the supply of the resin material based on the analysis results.