Laser dicing apparatus and method for producing substrate

Abstract

An object of the present disclosure is to provide a laser dicing apparatus that enables easily obtaining a substrate having a desired groove. An aspect of the present disclosure is a laser dicing apparatus for applying a laser beam to a substrate to form a groove for singulating the substrate, the laser dicing apparatus including: a stage configured to receive a substrate to be placed thereon; and a laser beam applying portion configured to apply a laser beam to the substrate placed on the stage, wherein the laser beam applying portion includes a pulsed fiber laser.