Improved semiconductor package lead forming apparatus

Abstract

The present invention relates to an improved semiconductor package lead forming apparatus in which an angular cam punch (100) performs a reciprocating motion along an operation section (81) and an inclined hole (83) of a cap holder in an elastically supported state, such that the lead is bent against a forming die (30) while forming pressure on the inclined package lead is maintained, and impact transmitted between the angular cam punch (100) and the forming die (30) is minimized during the bending process, thereby extending the lifespan of the angular cam punch (100) and mold components, and ensuring product reliability even after prolonged use. The improved semiconductor package lead forming apparatus includes: an upper mold (10) and a lower mold (20); a plurality of forming dies (30) which are installed on the lower mold (20) and on which a package is seated; a punch unit which is installed on the upper mold (10) and has a punch fixing plate (48); a spacer (50) which is elastically supported on the upper mold (10) and the punch unit (40); a stripper plate (60) which is installed opposite and spaced apart from the forming die (30); a shoulder clamp (70) which is installed on the stripper plate (60) to fix a body of the package; a cam holder (80) which has an operation section (81) of a hopper shape on both sides of the shoulder clamp (70); a roller punch (90) which is installed on the punch fixing plate (48) and arranged between the spacer (50) and the operation section (81); and an angular cam punch (100) which is elastically supported in the operation section (81) and configured to bend leads of the package according to the operation of the roller punch (90).