Manufacturing process for probe socket set

MYPI2025001273A0Pending Publication Date: 2026-08-25UNITECH TECH YEH CORP
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Patent Information

Application Number
MYPI2025001273
Authority / Receiving Office
MY · MY
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2026-08-25
Patent Text Reader

Abstract

ABSTRACT MANUFACTURING PROCESS FOR PROBE SOCKET SET A manufacturing process for a probe socket set is performed by molding equipment and has steps of forming a socket base and forming a positioning frame. A socket base (14a / 14b / 14c) shaped as a flat board and having multiple probe holes arranged in an array is molded via a base mold (20) of the molding equipment. The socket base (14a / 14b / 14c) is placed in a frame mold (21), and a positioning frame (15a / 15b / 15c) surrounding the socket base (14a / 14b / 14c) is molded via the molding equipment. The socket base (14a / 14b / 14c) with less thickness variation is formed firstly to enhance dimensional accuracy of the probe holes (141) in the socket base (14a / 14b / 14c). Accordingly, the probe socket set (10) with good dimensional accuracy of the probe holes (141) in the socket base (14a / 14b / 14c) is manufactured with low manufacturing cost and short manufacturing period. Fig. 1
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