Impedance-matched coaxial test socket with secure polymer body

Abstract

A coaxial test socket (100) in a semiconductor device testing apparatus having a coaxial structure (430) comprising an elongated signal pin (420) held near each of its two ends by a snug-fitting hollow passage (260, 360) in a dielectric support structure (240, 340). The dielectric support structures (240, 340) are formed by first curing, in-situ, curable polymer injected into two cavities (220, 320) to form polymer bodies (245, 345). The afore-mentioned hollow passages (260, 360) are then machined through the polymer bodies (245, 345) to form the dielectric support structures (240, 340) in their finished form. At least one relief feature is provided along a wall (225, 325) of at least one of the cavities (220, 320) to provide increased purchase of the dielectric support structure (240, 340) on the cavity wall (225, 325), and reduces the risk of it being dislodged from the cavity.