Refrigerant flow path module, heat source unit, and air conditioner
MYUI2026001184UUndetermined Publication Date: 2026-08-28DAIKIN INDUSTRIES LTD
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Patent Information
- Application Number
- MYUI2026001184
- Authority / Receiving Office
- MY · MY
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2025-02-28
- Filing Date
- 2026-02-27
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2046-02-27
Abstract
The present disclosure discloses a refrigerant flow path module, a heat source unit, and an air conditioner. The refrigerant flow path module has a refrigerant flow path and includes a plurality of plates stacked to each other. Adjacent plates of the plurality of plates are joined together through brazing. Each of the plurality of plates has a plurality of insertion holes, and each of the plurality of insertion holes is configured for an insertion of a fastener. The plurality of insertion holes include a plurality of first insertion holes formed at corners of the plate and a plurality of second insertion holes formed at different positions from the first insertion holes; and the plurality of insertion holes are distributed such that an overlapping region exists between each of imaginary circles and at least one of the remaining imaginary circles, and a center of each of the plurality of second insertion holes is located outside each of the remaining imaginary circles, the imaginary circles each being centered at a center of each of the plurality of insertion holes and having a uniform radius larger than a radius of the insertion hole. For the refrigerant flow path module according to the present disclosure, warpage deformation of the plate can be suppressed. (Most Illustrative Figure: Fig 12)
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