Solder material, solder paste, formed solder and solder joint

Abstract

Provided is a solder material which is capable of suppressing the occurrence of electromigration. This solder material is a core ball 1A which comprises a spherical core 2A that is configured from Cu or a Cu alloy, and a solder layer 3A that covers the core 2A, and wherein the solder layer 3A has a Cu content of from 0.1% by mass to 3.0% by mass (inclusive), a Bi content of from 0.5% by mass to 5.0% by mass (inclusive), an Ag content of from 0% by mass to 4.5% by mass (inclusive) and an Ni content of from 0% by mass to 0.1% by mass (inclusive), with the balance being made up of Sn.