Layered bonding material, semiconductor package, and power module
PH12022552209B1Active Publication Date: 2026-08-12SENJU METAL IND CO LTD
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Patent Information
- Application Number
- PH12022552209
- Authority / Receiving Office
- PH · PH
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-08-23
- Publication Date
- 2026-08-12
- Estimated Expiration
- 2042-08-23
Abstract
In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm / K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.
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