Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methods
PH12026550203A1Pending Publication Date: 2026-09-02QUALCOMM TECHNOLOGIES INC +1
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Patent Information
- Application Number
- PH12026550203
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-23
- Publication Date
- 2026-09-02
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