Package comprising a substrate with via interconnect with vertical walls
PH12026550223A1Pending Publication Date: 2026-09-02QUALCOMM INC
0 Cites 0 Cited by
Patent Information
- Application Number
- PH12026550223
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-26
- Publication Date
- 2026-09-02
Need to check novelty before this filing date? Find Prior Art
No text content released.