Shielding cable connection structure

Abstract

Provided in the present invention is a shielding cable connection structure. The shielding cable connection structure comprises a connector and a shielding cable, wherein the shielding cable comprises a guide core and a shielding layer; and a first inner cavity for accommodating the shielding cable is arranged in the connector, and the connector is provided with a conductive layer, which is arranged on the inner surface of the first inner cavity and is electrically connected to the shielding layer. By means of the present invention, the technical problem of electromagnetic interference being relatively serious at a joint of a shielding cable is alleviated.

Description

A shielded cable connection structure

[0001] Related applications

[0002] This application claims priority to the Chinese invention patent with patent application number 202110964139.8, application date August 21, 2021, and invention name “A shielded cable connection structure”; at the same time, it claims priority to the Chinese utility model patent with patent application number 202121972383.0, application date August 21, 2021, and invention name “Shielded cable connection structure”. Technical Field

[0003] The present invention relates to the technical field of electrical connection elements, in particular to a shielded cable connection structure. Background Art

[0004] High-voltage cables and data communication cables are used to conduct current and signals. To reduce the effects of electromagnetic interference, these cables are typically shielded. At both ends of the cable, the shield is connected to a shielding device and grounded.

[0005] Shielded cables typically consist of a conductor and a shielding layer arranged in sequence from the inside out. To facilitate connection to the mating cable or electrical device, the cable ends are typically connected to connectors. These connectors typically lack shielding, resulting in significant electromagnetic interference at the connector location.

[0006] Installing a metal cover inside or outside the connector can provide shielding. However, metal covers are difficult to manufacture and are costly. Assembling the metal cover to the connector is also laborious, increasing assembly time. Furthermore, when the metal cover is inside the connector, it can easily short-circuit with the conductor, damaging the shielding layer or even burning the cable, leading to serious accidents.

[0007] Therefore, the technical field of electrical connection elements urgently needs a shielded cable connection structure that can alleviate the relatively severe electromagnetic interference at the shielded cable connection.

[0008] Summary of the Invention

[0009] The object of the present invention is to provide a shielded cable connection structure to alleviate the technical problem of serious electromagnetic interference at the shielded cable connection.

[0010] The above-mentioned purpose of the present invention can be achieved by adopting the following technical solutions:

[0011] The present invention provides a shielded cable connection structure, comprising a connector and a shielded cable, wherein the shielded cable comprises a conductor core and a shielding layer, a first inner cavity for accommodating the shielded cable is provided in the connector, and the connector has a conductive layer, which is provided on the inner surface of the first inner cavity and is electrically connected to the shielding layer.

[0012] The characteristics and advantages of the present invention are:

[0013] 1. In this shielded cable connection structure, the connector surrounds the cable ends and terminals, and the conductive layer is electrically connected to the cable shield. The conductive layer and the cable shield surround the cable conductor, safely shielding the cable and the terminals connected to its ends, reducing the impact of electromagnetic interference. This shielded cable connection structure eliminates the need for a metal cover, facilitating assembly, saving processing time, and reducing the cost of the shielded cable connection structure.

[0014] 2. In the shielded cable connection structure, a shielding device is provided, which can make the conductive layer of the connector and the shielding layer of the shielded cable more stably connected, thereby achieving a better shielding effect.

[0015] 3. The shielded cable connection structure is equipped with a conductive spring that can apply pressure to the shielding layer or shielding device to achieve better conductivity. In addition, the cable can be easily plugged into the conductive layer, saving assembly time and improving production efficiency.

[0016] 4. In the shielded cable connection structure, the impedance of the connection and the transfer impedance range of the conductive layer itself are set, so that the material selection of the conductive layer and the design of the connection can be more standardized.

[0017] 5. In the shielded cable connection structure, the conductive layer, shielding device, conductive spring, insulating shell and insulating protective layer can be processed with a variety of materials, which increases the designer's choice range and adds many corresponding material selection design solutions for different usage environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following drawings are intended only to illustrate and explain the present invention, and are not intended to limit the scope of the present invention.

[0019] Figures 1 to 10 are schematic structural diagrams of a shielded cable connection structure provided by the present invention;

[0020] 11-12 are schematic structural diagrams of the conductive springs in the shielded cable connection structure provided by the present invention. DETAILED DESCRIPTION

[0021] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described with reference to the accompanying drawings. In the description of the present invention, unless otherwise specified, the meaning of "multiple" is two or more.

[0022] Option 1

[0023] The present invention provides a shielded cable connection structure, as shown in Figures 1 to 3, the shielded cable connection structure includes a connector 5 and a shielded cable, the shielded cable includes a conductor core 11 and a shielding layer 13, a first inner cavity 21 for accommodating the shielded cable is provided in the connector 5, the connector 5 has a conductive layer 22, the conductive layer 22 is provided on the inner surface of the first inner cavity 21 and is electrically connected to the shielding layer 13.

[0024] High-voltage cables transmit large currents, generating large electromagnetic fields. To prevent these fields from interfering with surrounding electrical appliances and affecting their normal operation, electromagnetic shielding is required. Data communication cables, on the other hand, transmit electromagnetic signals, which can be disrupted by external electromagnetic fields, leading to distortion and ineffective signal transmission. Therefore, electromagnetic shielding is required to prevent external electromagnetic interference.

[0025] Electromagnetic shielding primarily uses a shield to prevent the effects of high-frequency electromagnetic fields, effectively controlling the radiation and propagation of electromagnetic waves from one area to another. The basic principle is to use a low-resistance conductive material to create a shield. The shielding effect is achieved by utilizing electromagnetic waves reflected from the shield's surface, absorbed within the shield, and lost during transmission.

[0026] In some embodiments, as shown in FIG. 1 , the connector 5 itself is entirely composed of a conductive layer 22 , which has a simple structure and can achieve a good shielding effect.

[0027] In this embodiment, the shielded cable connection structure comprises a connector 5 that surrounds the cable end and the terminal 3, and a conductive layer 22 that is electrically connected to the shielding layer 13 of the shielded cable. The conductive layer 22 and the shielding layer 13 of the shielded cable surround the cable conductor 11, providing a secure shield for the conductor 11 and the terminal 3 connected thereto, thereby reducing the effects of electromagnetic interference. This shielded cable connection structure eliminates the need for a metal cover, facilitating assembly, saving processing time, and reducing the cost of the shielded cable connection structure.

[0028] In one embodiment, the conductive layer 22 covers at least a portion of the outer periphery of the shielding layer 13. The conductive layer 22 and the shielding layer 13 are in 360-degree contact and electrically connected, forming an electromagnetic shielding structure that encloses the internal conductor core 11 and the terminal 3, thereby optimizing the electromagnetic shielding effect. If the electromagnetic shielding structure has various gaps, it will affect the integrity of the electromagnetic shielding to varying degrees. Electromagnetic waves will radiate from or enter through the gaps, thereby generating electromagnetic interference. In the prior art, the shielding layer formed by the braided mesh is usually broken up and then welded to the metal shielding shell to form a single line. This allows electromagnetic interference to radiate from or enter through the gaps in the broken shielding layer, affecting signal transmission. In addition, if the conductive layer 22 is connected to the shielding layer 13 at a single point, a large current will flow at the connection location, generating a magnetic field. This magnetic field will couple with the magnetic field generated by the conductor core 11, causing significant radiation from the entire cable connection, seriously affecting the operation of other electrical devices. In this embodiment, the conductive layer 22 covers at least a portion of the outer periphery of the shielding layer 13 to form a closed electromagnetic shielding structure, thereby effectively controlling the radiation of electromagnetic waves and achieving a good shielding effect.

[0029] In one embodiment, it also includes a terminal 3 and an insulating shell 24, the terminal 3 includes a connecting end 31, and the connecting end 31 is electrically connected to the conductor core 11; the insulating shell 24 is provided with a second inner cavity 23 for accommodating the terminal 3, and the conductive layer 22 is wrapped around at least part of the outer periphery of the insulating shell 24.

[0030] The shielded cable connection structure in this embodiment is generally the terminal of the cable, which needs to be plugged into an electrical device or other connector to form an electrical circuit, wherein the terminal 3 is installed in the second inner cavity 23 of the insulating shell 24, and the docking terminal of the electrical device or other connector can be electrically connected to the terminal 3. In addition, the connector 5 can be docked with the electrical device or other connector. The insulating shell 24 is arranged inside the conductive layer 22 in order to isolate the conductive layer 22 and the terminal 3 to avoid a short circuit caused by contact between the two. The shielded cable connection structure can ensure the safe shielding effect of the connection between the terminal 3 and the docking terminal, and greatly reduce the influence of electromagnetic interference. As shown in Figure 1, the direction A of the cable insertion can be the direction from the first inner cavity 21 to the second inner cavity 23.

[0031] The connector 5 is generally cylindrical. In one embodiment, the connector 5 includes an insulating protective layer 25, as shown in FIG3 . The insulating protective layer 25 is disposed at least partially around the outer periphery of the conductive layer 22. The conductive layer 22 has a shielding function, and the outer side of the conductive layer 22 is protected by the insulating protective layer 25 to prevent electrical conduction to the outside world, thereby ensuring a shielding effect.

[0032] In one embodiment, as shown in FIG1 , the shielded cable further includes an inner insulating layer 12 , wherein the conductor 11 is disposed within the inner insulating layer 12 , and the shielding layer 13 is coated around at least a portion of the outer periphery of the inner insulating layer 12 . The inner insulating layer 12 serves to insulate the conductor 11 from the shielded cable to prevent short circuits caused by contact between the conductor 11 and the shielded cable.

[0033] In one embodiment, the shielded cable further includes an outer insulating layer 14. As shown in FIG4 , a shielding layer 13 is disposed within the outer insulating layer 14, and the end portion of the shielding layer 13 located within the first inner cavity 21 is folded outward to cover at least a portion of the outer periphery of the outer insulating layer 14. The shielding layer 13 may be a shielding mesh or a conductive foil wrapped around the inner insulating layer 12. When the shielding layer 13 is cut or stripped, free metal wires may be present. When the metal wires come into contact with the conductor core 11, a short circuit or shielding failure may occur. Therefore, during the processing of a typical shielded cable connection structure, the shielding layer 13 is folded outward to cover at least a portion of the outer periphery of the outer insulating layer 14, and then electrically connected to the conductive layer 22. This prevents the shielding layer 13 from contacting the conductor core 11.

[0034] In one embodiment, the shielded cable further includes a shielding device 15, which is disposed around at least a portion of the periphery of the shielding layer 13. The shielding layer 13 is electrically connected to the conductive layer 22 via the shielding device 15. The shielding layer 13 can be a shielding mesh or a conductive foil wrapped around the inner insulating layer 12. The shielding layer 13 is a flexible structure, while the conductive layer 22 is generally a rigid structure. When the two come into contact, deformation of the shielding layer 13 can cause a temporary disconnection between the conductive layer 22 and the shielding layer 13, thereby changing the impedance at the contact point and causing the shielding effect of the shielded cable connection structure to become unstable, thereby affecting signal transmission. Therefore, the shielding device 15 needs to be stably connected to the shielding mesh, and the shielding device 15 is generally a rigid structure to facilitate a good electrical connection with the conductive layer 22, thereby achieving a stable shielding effect.

[0035] Furthermore, the shielding device 15 is connected to the shielding layer 13 by crimping, welding or bonding. In this embodiment, the shielding device 15 is a metal ring, as shown in FIG5 , which is sleeved on the shielding layer 13 and connected by crimping, welding or bonding.

[0036] The crimping method is to use crimping pliers or crimping equipment to apply a certain force to the shielding device 15, causing the shielding device 15 to deform inward and compress the shielding layer 13, so that the shielding net 13 and the shielding device 15 are relatively fixed and form a larger contact area to ensure good electrical connection.

[0037] Welding methods, including laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, use concentrated heat energy or pressure to produce a molten connection between the contact position of the shielding mesh 13 and the shielding device 15. The welding method provides a stable connection and can also achieve the connection of dissimilar materials. Since the contact position is fused, the conductive effect is better.

[0038] The bonding method is to use conductive glue to bond the shielding net 13 and the shielding device 15 together. This method does not require the use of equipment, nor does it heat or deform the shielding net 13 and the shielding device 15. The conductive glue makes the shielding net 13 and the shielding device 15 fully electrically connected, with good conductivity, but low connection strength. It is suitable for use in environments where the connection strength requirements are not high and the shielding net 13 and the shielding device 15 have a low melting point or strength.

[0039] Furthermore, as shown in FIG6 , the shielding device 15 includes a first ring and a second ring distributed longitudinally, the inner diameter of the first ring is smaller than the inner diameter of the second ring, the shielding layer 13 is folded outward to at least a portion of the outer periphery of the first ring, and the shielding layer 13 is fixedly connected to the first ring, and the second ring is electrically connected to the conductive layer 22. As described above, during the processing of a general shielded cable connection structure, the shielding layer 13 is folded outward to at least a portion of the outer periphery of the outer insulating layer 14, and then electrically connected to the conductive layer 22, which can prevent the shielding layer 13 from contacting the conductor core 11. In this embodiment, a stepped ring is adopted, and the shielding layer 13 is folded outward to at least a portion of the outer periphery of the first ring, which can prevent the shielding layer 13 from contacting the conductor core 11. The second ring forms a good electrical connection with the conductive layer 22, thereby achieving a stable shielding effect.

[0040] The second ring is sequentially connected to the first ring along the cable insertion direction A. The second ring is sleeved on at least a portion of the outer circumference of the outer insulating layer 14 , and the outer wall of the second ring contacts and cooperates with the inner wall of the conductive layer 22 .

[0041] The shielding layer 13 and the first collar can be fixedly connected by crimping, welding or bonding, and the connection method is as described above.

[0042] In one embodiment, it also includes a conductive spring 4 arranged on the inner surface of the first inner cavity 21, as shown in Figures 7 and 8, the conductive spring 4 is in contact with the shielding layer 13, and the conductive spring 4 applies pressure to the shielding layer 13, and the conductive layer 22 is electrically connected to the shielding layer 13 through the conductive spring 4. At least part of the conductive spring 4 is elastic, and the part has a tendency to shrink inward to press the shielded cable. On the one hand, it ensures the stability of the electrical connection between the conductive layer 22 and the shielding layer 13. On the other hand, when the shielded cable penetrates into the first inner cavity 21 along the cable insertion direction A, it can be in contact with the conductive spring 4, which facilitates the assembly of the shielded cable and the connector 5 and saves assembly and processing time.

[0043] In one embodiment, it also includes a conductive spring clip 4 arranged on the inner surface of the first inner cavity 21, as shown in Figures 9 and 10, the conductive spring clip 4 is in contact with and connected to the shielding device 15 of the shielded cable, and the conductive spring clip 4 applies pressure to the shielding device 15, and the conductive layer 22 is electrically connected to the shielding device 15 through the conductive spring clip 4. At least part of the conductive spring clip 4 is elastic, and the part has a tendency to shrink inward to press the shielding device 15. On the one hand, the stability of the electrical connection between the conductive layer 22 and the shielding device 15 is guaranteed. On the other hand, when the shielded cable penetrates into the first inner cavity 21 along the cable insertion direction, it can be in contact with the conductive spring clip 4, which facilitates the assembly of the shielded cable and the connector 5 and saves assembly and processing time.

[0044] Furthermore, the pressure applied by the conductive spring 4 is in the range of 0.3N-95N. Preferably, the pressure applied by the conductive spring 4 is in the range of 0.5N-50N.

[0045] In order to verify the influence of the pressure applied by the conductive spring 4 to the shielding layer 13 on the contact resistance between the conductive spring 4 and the shielding layer 13, the inventors conducted targeted tests. Taking the pressure applied by the conductive spring 4 to the shielding layer 13 as an example, the inventors selected conductive springs 4 and shielding layers 13 of the same shape and size, and designed the pressure between the conductive spring 4 and the shielding layer 13 to be different pressures to observe the contact resistance between the conductive spring 4 and the shielding layer 13.

[0046] Table 1: Effect of pressure of different conductive springs and shielding layers on contact resistance:

[0047]

[0048] The contact resistance is detected by using a micro-resistance meter to measure the resistance at the contact position between the conductive spring 4 and the shielding layer 13 and read the value on the micro-resistance meter. In this embodiment, the contact resistance is ideally less than 50 μΩ.

[0049] As shown in Table 1, when the pressure between the conductive spring 4 and the shielding layer 13 is less than 0.3N, the bonding force is too weak, resulting in a higher-than-ideal contact resistance, which does not meet the requirements. When the pressure between the conductive spring 4 and the shielding layer 13 is greater than 95N, the contact resistance does not significantly decrease, but material selection and processing become more difficult. Furthermore, excessive pressure can damage the shielding layer 13. Therefore, the inventors set the pressure applied by the conductive spring 4 between 0.3N and 95N.

[0050] In addition, the inventors found that when the pressure between the conductive spring piece 4 and the shielding layer 13 is greater than 0.5N, the contact resistance between the conductive spring piece 4 and the shielding layer 13 is relatively good and tends to decrease quickly. When the pressure between the conductive spring piece 4 and the shielding layer 13 is less than 50N, the manufacturing, installation and use of the conductive spring piece are very convenient and the cost is also low. Therefore, the inventors prefer that the pressure applied by the conductive spring piece 4 is in the range of 0.5N-50N.

[0051] In order to verify the influence of the pressure applied by the conductive spring clip 4 to the shielding device 15 on the contact resistance between the conductive spring clip 4 and the shielding device 15, the inventor conducted targeted tests. Taking the pressure applied by the conductive spring clip 4 to the shielding device 15 as an example, the inventor selected a conductive spring clip 4 and a shielding device 15 of the same shape and size, and designed the pressure between the conductive spring clip 4 and the shielding device 15 to be different pressures to observe the contact resistance between the conductive spring clip 4 and the shielding device 15.

[0052] Table 2: Effect of pressure of different conductive springs and shielding devices on contact resistance:

[0053]

[0054] The contact resistance is detected by using a micro-resistance meter to measure the resistance at the contact position between the conductive spring 4 and the shielding device 15 and read the value on the micro-resistance meter. In this embodiment, the contact resistance is ideally less than 50 μΩ.

[0055] As shown in Table 2, when the pressure between the conductive spring 4 and the shielding device 15 is less than 0.3N, the bonding force is too weak, resulting in a higher-than-ideal contact resistance than required. When the pressure between the conductive spring 4 and the shielding device 15 exceeds 95N, the contact resistance does not significantly decrease, but material selection and processing become more difficult. Furthermore, excessive pressure can damage the shielding device 15. Therefore, the inventors set the pressure applied by the conductive spring 4 between 0.3N and 95N.

[0056] In addition, the inventors found that when the pressure between the conductive spring clip 4 and the shielding device 15 is greater than 0.5N, the contact resistance between the conductive spring clip 4 and the shielding device 15 is relatively good and tends to decrease quickly. When the pressure between the conductive spring clip 4 and the shielding device 15 is less than 50N, the manufacturing, installation and use of the conductive spring clip are very convenient and the cost is very low. Therefore, the inventors prefer that the pressure applied by the conductive spring clip 4 is in the range of 0.5N-50N.

[0057] In one embodiment, as shown in FIG7 , one end of the conductive spring 4 is fixed to the inner surface of the first inner cavity 21, and the minimum inner diameter of the other end in a free state is less than or equal to the outer diameter of the shielding layer 13. In this way, the conductive layer 22 and the shielding layer 13 are electrically connected via the conductive spring 4.

[0058] In one embodiment, as shown in FIG9 , one end of the conductive spring 4 is fixed to the inner surface of the first inner cavity 21, and the minimum inner diameter of the other end in a free state is less than or equal to the outer diameter of the shielding device 15. The conductive layer 22 and the shielding device 15 are electrically connected via the conductive spring 4.

[0059] The conductive spring piece 4 is at least partially elastic, and the minimum inner diameter of one end of the conductive spring piece 4 crimped to the shielding layer 13 in a free state is less than or equal to the outer diameter of the shielding layer 13 or the shielding device 15, so that when the conductive spring piece 4 contacts and is connected to the shielding layer 13 or the shielding device 15, the conductive spring piece 4 applies pressure inward, and the pressure acts on the shielding layer 13 or the shielding device 15.

[0060] The inner diameter of the conductive spring clip 4 gradually decreases along the direction of cable insertion. The end of the conductive spring clip 4 with a smaller inner diameter is crimped to the shielding layer 13 or the shielding device 15, and the end of the conductive spring clip 4 with a larger inner diameter is fixed on the inner surface of the first inner cavity 21, so as to facilitate the cable to enter the first inner cavity 21 along the direction of cable insertion.

[0061] As shown in Figures 7 and 9, the conductive spring 4 includes a contraction portion 45 whose inner diameter gradually decreases along the direction in which the cable is inserted. The two ends of the contraction portion 45 are respectively provided with a first barrel portion that is in contact with and connected to the shielding layer 13 or the shielding device 15 and a second barrel portion that is fixed to the inner surface of the first inner cavity 21. The inner diameter of the first barrel portion is smaller than the inner diameter of the second barrel portion.

[0062] In one embodiment, as shown in FIG8 , both ends of the conductive spring 4 are fixed to the inner surface of the first inner cavity, and the minimum inner diameter of the free middle portion of the conductive spring 4 is less than or equal to the outer diameter of the shielding layer 13 .

[0063] In one embodiment, as shown in FIG. 10 , both ends of the conductive spring 4 are fixed to the inner surface of the first inner cavity, and the minimum inner diameter of the free middle portion of the conductive spring 4 is less than or equal to the outer diameter of the shielding device 15 .

[0064] As shown in FIG8 and FIG10 , both ends of the conductive spring piece 4 are fixed to the inner surface of the first inner cavity 21 , and the middle portion of the conductive spring piece 4 is retracted inwardly to contact and connect with the shielding layer 13 or the shielding device 15 .

[0065] The conductive spring piece 4 is at least partially elastic, and the minimum inner diameter of the middle part of the conductive spring piece 4 in a free state is less than or equal to the outer diameter of the shielding layer 13 or the shielding device 15, so that the middle part of the conductive spring piece 4 applies pressure inward, and the pressure acts on the shielding layer 13 or the shielding device 15.

[0066] In one embodiment, the conductive spring 4 includes a base strip 41 and multiple elastic strips 42. As shown in Figures 7, 9, and 11, the base strip 41 is fixed to the inner surface of the first inner cavity 21, and the multiple elastic strips 42 are fixed to the base strip 41. The other end is free and contacts the shielding layer 13 or the shielding device 15. The elastic strips 42 are elastic. One end of the conductive spring 4 contacts the shielding layer 13 or the shielding device 15, and the minimum inner diameter in the free state is less than or equal to the outer diameter of the shielding layer 13 or the shielding device 15. When the conductive spring 4 is crimped to the shielding layer 13, the conductive spring 4 applies inward pressure, which acts on the shielding layer 13 or the shielding device 15.

[0067] In one embodiment, two basebands 41 are provided, both secured to the inner surface of the first inner cavity. A plurality of elastic sheets 42 are secured at both ends to the two basebands 41. The basebands 41 include a first baseband 43 and a second baseband 44. As shown in Figures 8, 10, and 12, the first baseband 43 and the second baseband 44 are secured to the inner surface of the first inner cavity 21. The elastic sheets 42 are secured at one end to the first baseband 43 and at the other end to the second baseband 44. The middle portion of the elastic sheets 42 is retracted inward until it contacts and connects to the shielding layer 13 or the shielding device 15.

[0068] In one embodiment, as shown in FIG7 , the connection between the baseband 41 and the inner surface of the first inner cavity 21 is by welding, bonding, integral injection molding, embedding or clamping; as shown in FIG8 , the connection between the first baseband 43 and the inner surface of the first inner cavity 21 is by welding, bonding, integral injection molding, embedding or clamping, and the connection between the second baseband 44 and the inner surface of the first inner cavity 21 is by welding, bonding, integral injection molding, embedding or clamping.

[0069] Welding methods, including laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing, use concentrated heat energy or pressure to produce a molten connection between the base tape 41 and the inner surface of the first inner cavity 21 at the contact position. The welding method provides a stable connection and can also achieve the connection of dissimilar materials. Since the contact positions are fused, the conductive effect is better.

[0070] The bonding method is to use conductive glue to bond the base tape 41 and the inner surface of the first inner cavity 21 together. This method does not require the use of equipment, nor does it heat or deform the base tape 41 and the inner surface of the first inner cavity 21. The conductive glue makes the base tape 41 and the inner surface of the first inner cavity 21 fully electrically connected, with good conductivity, but low connection strength. It is suitable for use in environments where the connection strength requirements are not high and the melting point or strength of the base tape 41 and the inner surface of the first inner cavity 21 are low.

[0071] The one-piece injection molding method is to put the conductive spring 4 into the injection mold, and when processing the connector, it is directly injection-molded on the inner surface of the first inner cavity 21. The processing is simple and fast, and there is no other assembly process, which saves assembly time.

[0072] The embedding method is to set a groove on the inner surface of the first inner cavity 21 and then embed the first base band 43 and / or the second base band 44 of the conductive elastic sheet 4 into the groove to fix the conductive elastic sheet 4 on the inner surface of the first inner cavity 21.

[0073] The clamping method is to set a claw or a slot on the inner surface of the first inner cavity 21, set a corresponding slot or claw on the base band 41, and then assemble and connect the claw and the slot to fix the conductive spring 4 on the inner surface of the first inner cavity 21.

[0074] In one embodiment, the impedance between the conductive layer 22 and the shielding layer 13 is less than 80 mΩ. The impedance between the conductive layer 22 and the shielding layer 13 should be as small as possible so that the current generated by the shielding layer 13 can flow back to the energy source or grounding position without hindrance. If the impedance between the conductive layer 22 and the shielding layer 13 is large, a large current will be generated between the conductive layer 22 and the shielding layer 13, thereby generating greater radiation at the cable connection.

[0075] To verify the effect of the impedance between the conductive layer 22 and the shielding layer 13 on the shielding effect of the shielded cable connection structure, the inventors selected connectors 5, cables, and terminals 3 of the same specifications, and selected different impedances between the conductive layer 22 and the shielding layer 13. They produced a series of samples of the shielded cable connection structure and tested the shielding effect of each of the shielded cable connection structures. The experimental results are shown in Table 3 below. In this embodiment, the shielding performance value of the shielded cable connection structure is greater than 40dB, which is an ideal value. The shielding performance value test method is as follows: the test instrument outputs a signal value (this value is test value 2) to the shielded cable, and a detection device is set on the outside of the shielded cable. This detection device detects a signal value (this value is test value 1). Shielding performance value = test value 2 - test value 1.

[0076] Table 3: Effect of impedance between conductive layer 22 and shielding layer 13 on shielding performance

[0077]

[0078] It can be seen from Table 3 that when the impedance value between the conductive layer 22 and the shielding layer 13 is greater than 80mΩ, the shielding performance value of the shielded cable connection structure is less than 40dB, which does not meet the ideal value requirements. When the impedance value between the conductive layer 22 and the shielding layer 13 is less than 80mΩ, the shielding performance values ​​of the shielded cable connection structure all meet the ideal value requirements, and the trend is getting better and better. Therefore, the inventor sets the impedance between the conductive layer 22 and the shielding layer 13 to be less than 80mΩ.

[0079] In one embodiment, the conductive layer 22 is one or more of a metal insert, a conductive plating, a conductive coating, a conductive non-metallic insert, and a conductive non-metallic plastic. The conductive layer 22 can be made of a variety of materials to suit different usage environments, connector materials, and shielding effectiveness requirements, allowing designers to design and select materials for shielded cable connection structures in a variety of ways.

[0080] In one embodiment, the transfer impedance of the conductive layer 22 is less than 100 mΩ. Shielding materials generally use transfer impedance to characterize the shielding effect of the conductive layer 22. The smaller the transfer impedance, the better the shielding effect. The transfer impedance of the conductive layer 22 is defined as the ratio of the differential mode voltage U induced by the shield per unit length to the current Is passing through the surface of the shield, that is:

[0081] Z T =U / I S Therefore, it can be understood that the transfer impedance of the conductive layer 22 converts the current in the conductive layer 22 into differential mode interference. The smaller the transfer impedance, the better, that is, reducing the conversion of differential mode interference can achieve better shielding performance.

[0082] In order to verify the influence of the conductive layer 22 with different transfer impedance values ​​on the shielding effect of the shielded cable connection structure, the inventors selected connectors 5, cables and terminals 3 of the same specifications, and used conductive layers 22 with different transfer impedance values ​​to produce a series of samples of shielded cable connection structures, and tested the shielding effect of the shielded cable connection structures respectively. The experimental results are shown in Table 4 below. In this embodiment, the shielding performance value of the shielded cable connection structure is greater than 40dB, which is an ideal value.

[0083] The shielding performance value test method is as follows: the test instrument outputs a signal value (this value is test value 2) for the shielded cable, and a detection device is installed on the outside of the shielded cable, which detects a signal value (this value is test value 1). Shielding performance value = test value 2 - test value 1.

[0084] Table 4: Effect of transfer impedance of conductive layer 22 on shielding performance

[0085]

[0086] It can be seen from Table 4 above that when the transfer impedance value of the conductive layer 22 is greater than 100mΩ, the shielding performance value of the shielded cable connection structure is less than 40dB, which does not meet the ideal value requirements. When the transfer impedance value of the conductive layer 22 is less than 100mΩ, the shielding performance values ​​of the shielded cable connection structure all meet the ideal value requirements, and the trend is getting better and better. Therefore, the inventor sets the transfer impedance of the conductive layer 22 to less than 100mΩ.

[0087] Furthermore, the material of the metal insert contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

[0088] In order to demonstrate the effect of different metal insert materials on the conductivity of the conductive layer 22, the inventors used samples of metal inserts of the same specifications and sizes but different materials to test the conductivity of the metal inserts. The experimental results are shown in Table 5. In this embodiment, the conductivity of the metal insert is greater than 99%, which is an ideal value.

[0089] Table 5: Effects of metal inserts of different materials on the conductivity of the conductive layer 22

[0090]

[0091] Table 5 shows that the conductivity of the metal inserts made of the selected metal materials is within the ideal range. Furthermore, phosphorus is a non-metallic material and cannot be directly used as a material for metal inserts. However, it can be added to other metals to form alloys, thereby improving the metal's inherent conductivity and mechanical properties. Therefore, the inventors have selected metal inserts made from one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

[0092] Furthermore, the material of the conductive coating contains one or more of gold, silver, copper, nickel, titanium, tin, aluminum, cadmium, zirconium, chromium, cobalt, manganese, zinc, phosphorus, tellurium, beryllium, tin-lead alloy, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver and silver-gold-zirconium alloy.

[0093] In order to demonstrate the effect of different conductive coating materials on the conductivity of the conductive layer 22, the inventors used materials of the same specifications and sizes but different materials to make samples of conductive coatings, and tested the conductivity of the conductive coatings respectively. The experimental results are shown in Table 6. In this embodiment, the conductivity of the conductive coating is greater than 99%, which is an ideal value.

[0094] Table 6: Effects of different conductive coating materials on the conductivity of the conductive layer 22

[0095]

[0096] Table 6 shows that the conductivity of the metal inserts made of the selected metal materials is within the ideal range. Furthermore, phosphorus is a non-metallic material and cannot be directly used as a material for the conductive coating. However, it can be added to other metals to form alloys, thereby improving the metal's inherent conductivity and mechanical properties. Therefore, the inventors have selected the conductive coating material to contain one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

[0097] Furthermore, the material of the conductive plating layer contains one or more of gold, silver, copper, nickel, titanium, tin, aluminum, cadmium, zirconium, chromium, cobalt, manganese, zinc, phosphorus, tellurium, beryllium, tin-lead alloy, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver and silver-gold-zirconium alloy.

[0098] In order to demonstrate the effect of different conductive coating materials on the conductivity of the conductive layer 22, the inventors used materials of the same specifications and sizes but different materials to make connector samples with conductive coatings, and tested the conductivity of the conductive coatings respectively. The experimental results are shown in Table 7. In this embodiment, the conductivity of the conductive coating is greater than 99%, which is an ideal value.

[0099] Table 7: Effects of different conductive coating materials on the conductivity of the conductive layer 22

[0100]

[0101]

[0102] As can be seen from Table 7, the conductivity of the conductive coatings made from the selected metal materials is within the ideal range. Furthermore, phosphorus is a non-metallic material and cannot be directly used as a material for the conductive coating. However, it can be added to other metals to form alloys, thereby improving the conductive and mechanical properties of the metal itself. Therefore, the inventors have selected the conductive coating materials to include one or more of gold, silver, copper, nickel, titanium, tin, aluminum, cadmium, zirconium, chromium, cobalt, manganese, zinc, tin-lead alloys, silver-antimony alloys, palladium, palladium-nickel alloys, graphite silver, graphene silver, and silver-gold-zirconium alloys.

[0103] Furthermore, the conductive non-metallic insert is made of one or more of a conductive ceramic, a carbon-containing conductor, a solid electrolyte, a mixed conductor, and a conductive polymer. Furthermore, the carbon-containing conductor is one or more of graphite powder, carbon nanotube material, and graphene material.

[0104] In order to demonstrate the effect of different materials of conductive non-metallic inserts on the conductivity of the conductive layer 22, the inventors used materials of the same specifications and dimensions but different materials to make connector samples with conductive non-metallic inserts, and tested the conductivity of the conductive non-metallic inserts. The experimental results are shown in Table 8 below. In this embodiment, the conductivity of the conductive non-metallic insert is greater than 99%, which is an ideal value.

[0105] Table 8: Effects of different conductive non-metallic inserts on the conductivity of the conductive layer 22

[0106]

[0107] As can be seen from Table 8 above, the conductivity of the conductive non-metallic inserts made of the selected materials is within the ideal value range. Therefore, the inventors set the material of the conductive non-metallic insert to be a combination of one or more of conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials. Furthermore, the carbon-containing conductor is one or more of graphite powder, carbon nanotube materials, and graphene materials.

[0108] Furthermore, the conductive non-metallic plastic part is a polymer material containing metal particles, the material of the metal particles contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium, and the material of the polymer material is polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxy alkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, cross-linked polyolefin, One or more of ethylene propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, butadiene rubber, isoprene rubber, ethylene propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, epichlorohydrin rubber, chlorinated polyethylene rubber, chlorosulfur rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, cross-linked polyethylene, polycarbonate, polysulfone, polyphenylene oxide, polyester, phenolic resin, urea-formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, and polyoxymethylene resin.

[0109] Furthermore, the conductive non-metallic plastic part is processed by one or more processes selected from the group consisting of extrusion, injection molding, dipping, blow molding, foaming, spraying, printing, and 3D printing.

[0110] The injection molding process refers to the process of making semi-finished products of a certain shape through operations such as pressurization, injection, cooling, and separation of molten raw materials.

[0111] The dipping process refers to the process of electrically heating the workpiece to a certain temperature, then dipping it into the dipping liquid and allowing the dipping liquid to solidify on the workpiece.

[0112] Blow molding involves using an extruder to extrude a tubular parison, placing it into a mold while still hot, and blowing it with compressed air until it reaches the mold cavity shape. Once cooled and shaped, the finished product is obtained. Advantages include compatibility with a variety of plastics, the ability to produce large products, high production efficiency, relatively uniform parison temperature, and low equipment investment.

[0113] The foaming process involves the addition and reaction of physical or chemical blowing agents during the foaming process or within a foamed polymer material, creating a honeycomb or porous structure. The basic steps of foaming are cell nucleus formation, cell nucleus growth or expansion, and cell nucleus stabilization. Under given temperature and pressure conditions, the solubility of a gas decreases, reaching saturation. This allows excess gas to be expelled and form bubbles, thus achieving nucleation.

[0114] Spraying is a coating method that uses a spray gun or disc atomizer to disperse the spray material into uniform, fine droplets using pressure or centrifugal force, and then applies it to the surface of the object being coated. Spraying can be categorized as air spray, airless spray, electrostatic spray, and various derivatives of these basic spray methods.

[0115] Printing process refers to the method of transferring ink or other viscous fluid materials to the surface of the object to be coated using a printing plate, including screen printing, letterpress printing, flexographic printing, gravure printing or offset printing.

[0116] 3D printing is a type of rapid prototyping technology, also known as additive manufacturing. It is a technology that uses digital model files as the basis and uses adhesive materials such as powdered metal or plastic to construct objects by printing layer by layer.

[0117] In one embodiment, the material of the insulating shell 24 includes one or more of polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxyalkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, cross-linked polyolefin, ethylene propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, butadiene rubber, isoprene rubber, ethylene propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, epichlorohydrin rubber, chlorinated polyethylene rubber, chlorosulfur rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, cross-linked polyethylene, polycarbonate, polysulfone, polyphenylene oxide, polyester, phenolic resin, urea-formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, and polyoxymethylene resin.

[0118] In one embodiment, the material of the insulating protective layer 25 includes one or more of polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxyalkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, cross-linked polyolefin, ethylene propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, butadiene rubber, isoprene rubber, ethylene propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, epichlorohydrin rubber, chlorinated polyethylene rubber, chlorosulfur rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, cross-linked polyethylene, polycarbonate, polysulfone, polyphenylene oxide, polyester, phenolic resin, urea-formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, and polyoxymethylene resin.

[0119] In one embodiment, the shielding device 15 is made of one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

[0120] In one embodiment, the conductive spring 4 is made of one or more materials selected from the group consisting of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

[0121] From the above experiments, it can be seen that the corresponding electrical conductivity of the selected metal materials all meets the ideal value, and therefore, they can also be used as the material of the shielding device 15 and the conductive spring 4.

[0122] The conductive layer 22 disposed within the second inner cavity 23 is exposed. When the shielded cable connection structure is connected to the mating terminal, the exposed conductive layer 22 within the second inner cavity 23 contacts and electrically connects with the exposed conductive layer 22 of the mating terminal, thereby connecting with the shielding mesh of the cable at the mating end. This ensures a smooth connection between the mating terminal and the shielding layer 13 of the shielded cable, reduces grounding lines, facilitates connection, and saves processing and assembly time. The conductive spring 4 can be cylindrical.

[0123] The connector 5 may be a single-layer structure, that is, the housing of the connector 5 is a conductive layer 22 ; the connector 5 may also be a multi-layer structure, including a conductive layer 22 and an insulating protective layer 25 .

[0124] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A shielded cable connection structure, wherein, It includes a connector and a shielded cable. The shielded cable includes a conductor core and a shielding layer. A first inner cavity for accommodating the shielded cable is provided in the connector. The connector has a conductive layer, and the conductive layer is provided on the inner surface of the first inner cavity and is electrically connected to the shielding layer.

2. The shielded cable connection structure according to claim 1, wherein, The conductive layer covers at least a part of the outer periphery of the shielding layer.

3. The shielded cable connection structure according to claim 1, wherein, It further includes a terminal and an insulating housing. The terminal includes a connection end, and the connection end is electrically connected to the conductor core; The insulating housing is provided with a second inner cavity for accommodating the terminal; The conductive layer surrounds at least a part of the outer periphery of the insulating housing.

4. The shielded cable connection structure according to claim 1, wherein, The connector has an insulating protective layer, and the insulating protective layer is provided on at least a part of the outer periphery of the conductive layer.

5. The shielded cable connection structure according to claim 1, wherein, The shielded cable further includes an inner insulating layer. The conductor core is arranged in the inner insulating layer, and the shielding layer covers at least a part of the outer periphery of the inner insulating layer.

6. The shielded cable connection structure according to claim 1, wherein, The shielded cable further includes an outer insulating layer. The shielding layer is arranged in the outer insulating layer, and the end of the shielding layer located in the first inner cavity is turned outwards to cover at least a part of the outer periphery of the outer insulating layer.

7. The shielded cable connection structure according to claim 1, wherein, The shielded cable further includes a shielding device. The shielding device is provided on at least a part of the outer periphery of the shielding layer, and the shielding layer is electrically connected to the conductive layer through the shielding device.

8. The shielded cable connection structure according to claim 7, wherein, The shielding device is connected to the shielding layer by means of crimping or welding or bonding.

9. The shielded cable connection structure according to claim 7, wherein, The shielding device includes a first collar and a second collar distributed longitudinally. The inner diameter of the first collar is smaller than the inner diameter of the second collar. The shielding layer is turned outwards to cover at least a part of the outer periphery of the first collar, and the shielding layer is fixedly connected to the first collar. The second collar is electrically connected to the conductive layer.

10. The shielded cable connection structure according to claim 1, wherein, It further includes a conductive elastic sheet provided on the inner surface of the first inner cavity. The conductive elastic sheet is in contact connection with the shielding layer, and the conductive elastic sheet applies pressure to the shielding layer.

11. The shielded cable connection structure according to claim 7, wherein, It further includes a conductive elastic sheet provided on the inner surface of the first inner cavity. The conductive elastic sheet is in contact connection with the shielding device, and the conductive elastic sheet applies pressure to the shielding device.

12. The shielded cable connection structure according to claim 10 or 11, wherein, The pressure applied by the conductive elastic sheet ranges from 0.3N to 95N.

13. The shielded cable connection structure according to claim 10, wherein, One end of the conductive elastic sheet is fixed on the inner surface of the first inner cavity, and the minimum inner diameter of the other end in the free state is less than or equal to the outer diameter of the shielding layer.

14. The shielded cable connection structure according to claim 11, wherein, One end of the conductive elastic sheet is fixed on the inner surface of the first inner cavity, and the minimum inner diameter of the other end in the free state is less than or equal to the outer diameter of the shielding device.

15. The shielded cable connection structure according to claim 10, wherein, Both ends of the conductive elastic sheet are fixed on the inner surface of the first inner cavity, and the minimum inner diameter of the middle part of the conductive elastic sheet in the free state is less than or equal to the outer diameter of the shielding layer.

16. The shielded cable connection structure according to claim 11, wherein, Both ends of the conductive elastic sheet are fixed on the inner surface of the first inner cavity, and the minimum inner diameter of the middle part of the conductive elastic sheet in the free state is less than or equal to the outer diameter of the shielding device.

17. The shielded cable connection structure according to claim 13 or 14, wherein, The conductive elastic sheet includes a base band and a plurality of elastic sheets. The base band is fixed on the inner surface of the first inner cavity, and one ends of the plurality of elastic sheets are fixed on the base band.

18. The shielded cable connection structure according to claim 17, wherein, The number of the base bands is two, and both of the two base bands are fixed on the inner surface of the first inner cavity. Both ends of the plurality of elastic sheets are respectively fixed on the two base bands.

19. The shielded cable connection structure according to claim 18, wherein, The connection between the baseband and the inner surface of the first inner cavity adopts a welding method, an adhesive bonding method, an integrally injection molding method, an embedding method or a snap connection method.

20. The shielded cable connection structure according to claim 1, wherein, The impedance between the conductive layer and the shielding layer is less than 80 mΩ.

21. The shielded cable connection structure according to claim 1, wherein, The conductive layer is one or several of a metal insert, a conductive coating, a conductive layer, a conductive non-metal insert, and a conductive non-metal plastic part.

22. The shielded cable connection structure according to claim 1, wherein, The transfer impedance of the conductive layer is less than 100 mΩ.

23. The shielded cable connection structure according to claim 21, wherein, The material of the metal insert contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium.

24. The shielded cable connection structure according to claim 21, wherein, The material of the conductive coating contains one or more of gold, silver, copper, nickel, titanium, tin, aluminum, cadmium, zirconium, chromium, cobalt, manganese, zinc, phosphorus, tellurium, beryllium, tin-lead alloy, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver, and silver-gold-zirconium alloy.

25. The shielded cable connection structure according to claim 21, wherein, The material of the conductive layer contains one or more of gold, silver, copper, nickel, titanium, tin, aluminum, cadmium, zirconium, chromium, cobalt, manganese, zinc, phosphorus, tellurium, beryllium, tin-lead alloy, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver, and silver-gold-zirconium alloy.

26. The shielded cable connection structure according to claim 21, wherein, The material of the conductive non-metal insert contains a combination of one or more of conductive ceramics, carbon-containing conductors, solid electrolytes, mixed conductors, and conductive polymer materials.

27. The shielded cable connection structure according to claim 26, wherein, The carbon-containing conductor contains one or more of graphite powder, carbon nanotube materials, and graphene materials.

28. The shielded cable connection structure according to claim 21, wherein, The conductive non-metal plastic part is a polymer material containing metal particles. The material of the metal particles contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, and beryllium. The material of the polymer material is one or more of polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxy alkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, cross-linked polyolefin, ethylene-propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, cis-butadiene rubber, isoprene rubber, ethylene-propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, chlorinated ether rubber, chlorinated polyethylene rubber, chlorosulfide rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, cross-linked polyethylene, polycarbonate, polysulfone, polyphenylene ether, polyester, phenolic resin, urea formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, and polyoxymethylene resin.

29. The shielded cable connection structure according to claim 21, wherein, The conductive non-metal plastic part is processed by one or more of an extrusion process, an injection molding process, a dipping process, a blow molding process, a foaming process, a spraying process, a printing process, and a 3D printing process.

30. The shielded cable connection structure according to claim 3, wherein, The material of the insulating housing contains one or more of polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxy alkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, crosslinked polyolefin, ethylene-propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, cis-1,4-polybutadiene rubber, isoprene rubber, ethylene-propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, chlorinated ether rubber, chlorinated polyethylene rubber, chlorosulfide rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, crosslinked polyethylene, polycarbonate, polysulfone, polyphenylene ether, polyester, phenolic resin, urea formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, polyoxymethylene resin.

31. The shielded cable connection structure according to claim 4, wherein, The material of the insulating protective layer contains one or more of polyvinyl chloride, polyethylene, polyamide, polytetrafluoroethylene, tetrafluoroethylene / hexafluoropropylene copolymer, ethylene / tetrafluoroethylene copolymer, polypropylene, polyvinylidene fluoride, polyurethane, polyterephthalic acid, polyurethane elastomer, styrene block copolymer, perfluoroalkoxy alkane, chlorinated polyethylene, polyphenylene sulfide, polystyrene, silicone rubber, crosslinked polyolefin, ethylene-propylene rubber, ethylene / vinyl acetate copolymer, chloroprene rubber, natural rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, cis-1,4-polybutadiene rubber, isoprene rubber, ethylene-propylene rubber, chloroprene rubber, butyl rubber, fluororubber, polyurethane rubber, polyacrylate rubber, chlorosulfonated polyethylene rubber, chlorinated ether rubber, chlorinated polyethylene rubber, chlorosulfide rubber, styrene-butadiene rubber, butadiene rubber, hydrogenated nitrile rubber, polysulfide rubber, crosslinked polyethylene, polycarbonate, polysulfone, polyphenylene ether, polyester, phenolic resin, urea formaldehyde, styrene-acrylonitrile copolymer, polymethacrylate, polyoxymethylene resin.

32. The shielded cable connection structure according to claim 7, wherein, The material of the shielding device contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, beryllium.

33. The shielded cable connection structure according to claim 10 or 11, wherein, The material of the conductive elastic sheet contains one or more of nickel, cadmium, zirconium, chromium, cobalt, manganese, aluminum, tin, titanium, zinc, copper, silver, gold, phosphorus, tellurium, beryllium.