A low electrical impedance, high thermal performance, and vibration resistant inverter module.

Abstract

The invention relates to an inverter module with low electrical impedance, high thermal performance, and vibration resistance, suitable for use in low-voltage, high-current motor drive applications. The 3-phase DC-AC inverter module consists of a double-layer metal-based printed circuit board (100) and a mechanical mounting submodule (200) connected by a positive busbar (1), negative busbar (2), and A, B, and C phase connections (3, 4, 5). Thanks to the inverter module in question, the current capacity is increased by connecting discrete semiconductor switching elements (103) in parallel; the electrical and thermal performance is improved by the metal-based (111) double-layer printed circuit board (100) with high copper thickness; and a vibration-resistant structure is created by the mechanical mounting submodule (200), making it suitable for use with a busbar structure without compromising thermal performance.

Claims

8 REQUESTS 1. Low voltage high current motor to which the positive busbar (1) and negative busbar (2) are connected. It is a 3-phase DC-AC inverter module that can be used in driver applications; its features include:  The circuits coming to the board via connector (105) and gate resistors (104) 5 Switching elements controlled by connected signals (103) It consists of 3 half-bridge switching structures, functional. double copper layer (109) in which the circuits are located and switching elements (103) a metal base that reduces the temperature by dissipating the heat it releases (111) having, between the copper layers (109) and the bottom copper layer (109) 10 two thermal conductive electrical insulators between the metal base (111) a printed circuit board (100) containing a dielectric layer (110),  printed circuit board (100) to suppress high frequency noises EMI filter capacitors used,  fixed on a chassis and connected to the printed circuit board (100); 15 a cooling metal block located in the center of it (204), the metal block (204) located at the bottom and top and printed circuit board thermal conductor that transfers heat from the card (100) to the chassis with low resistance pads (209) a mechanical assembly submodule (200) 20 It includes.

2. An inverter module conforming to Request 1, and its feature is; printed circuit board (100) double copper Coated holes through which signal and power exchange is provided between layers (109) (106) includes. 25 3. An inverter module conforming to Request 1, whose feature is; busbar (1, 2) and phase connections (3, 4, 5) Uncoated connector formed on printed circuit board (100) to make It contains holes (107).

4. An inverter module conforming to Claim 1, and its feature is; the mechanical printed circuit board (100) formed on the card (100) for fixing to the mounting submodule (200) It contains uncoated mounting holes (108). 9 5. An inverter module conforming to claim 1, with the following features: positive bus (1), negative bus (2) and phase screws (112) that secure the connections (3, 4, 5) onto the printed circuit board (100) It includes.

6. An inverter module conforming to claim 1, with the feature of having 5 on both sides of the metal block (204). retaining parts (201, 202) where the busbar (1, 2) and phase connections (3, 4, 5) are made It includes.

7. An inverter module that conforms to claim 1 and has the following features: positive bus (1) and negative bus (2) insulating tape (115) 10 which is applied over and provides electrical insulation between them It includes.

8. An inverter module conforming to claim 6, characterized by its metal holder parts (201, 202). It contains connecting screws (203) that fix it to the block (204).

9. It is an inverter module conforming to claim 6, and its feature is that the retaining parts (201, 202) are attached to the chassis. It includes fixing spacer screws (205).

10. An inverter module conforming to claim 6, with the feature of having retaining parts (201, 202) on it. formed embedded nut (210) and insulating screw sleeve (208) placed on it 20 It includes.

11. An inverter module conforming to claim 9, and its feature is; spacer on the printed circuit board (100). It contains screws (112) that fasten to the screws (205).

12. An inverter module conforming to claim 1, with the characteristic of copper layers (109) 280 µm It is thick.

13. An inverter module conforming to claim 1, with the characteristic of dielectric layers (110) 80 µm its thickness is 30

Images