Weldments, semiconductor processing systems including weldments, and methods of making weldments for chamber arrangements and semiconductor processing systems

Abstract

A weldment includes a channel body formed from a ceramic material and having a plate portion, a first sidewall portion, and a second sidewall portion. The plate portion of the channel body has a first surface and a second surface. The first sidewall portion extends from the plate portion and is substantially orthogonal relative to the first surface of the plate portion of the channel body. The second sidewall portion is spaced apart from the first sidewall portion of the channel body and is substantially parallel to the first sidewall portion of the channel body. The channel body has a single, one-piece construction with no welds formed using a subtractive manufacturing technique to limit optical effects associated with dimensional variation otherwise introduced into the channel body by welding. Chamber arrangements and semiconductor processing systems including weldments, methods of making weldments, and related methods of depositing material layers and / or removing material form substrates supported within weldments are also described.