Laser processing apparatus, method for manufacturing semiconductor products, and laser processing method

Abstract

The laser processing apparatus 1A of the present invention includes a light generating unit 3A, a light-collecting optical system 5, and a control unit 6A. The light generating unit 3A generates laser light L with radial or angular polarization and a helical phase distribution. The light-collecting optical system 5 focuses the laser light L onto a focusing position within the workpiece 11, which is a uniaxial birefringent crystal. The control unit 6A moves the focusing position within the workpiece 11 to form a modified region 12 for cutting the workpiece 11.