Hot pressing cushioning material and manufacturing method of multilayer substrate
TW202626322APending Publication Date: 2026-07-01YAMAUCHI CORP
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Patent Information
- Application Number
- TW114130154
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-09
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-01
Abstract
The objective of the present invention is to make the cushioning material used in pin lamination-type hot pressing of hot pressing that is capable of utilizing for long periods of repeated hot pressing by avoiding damage when inserting guide pin. A hot pressing cushioning material 1 is flat plate-shaped and used in pin lamination-type hot pressing that is performed by inserting a guide pin 51 for position aligning into a through-hole disposed on workpiece. the hot pressing cushioning material 1 includes a cushioning material body 2 with a plurality of through-holes 2a for inserting the guide pin 51 formed along thickness direction at predetermined positions near an outer edge 2d, a cover member 4 having an outer side surface that contacts the side surface of the through-hole 2a, and includes a fixing member 5 that fixes the outer side surface of the cover member 4 and the side surface of the through-hole 2a.
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