Laminated bodies and methods for manufacturing laminated bodies
TW202626336APending Publication Date: 2026-07-01DEXERIALS CORP
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Patent Information
- Application Number
- TW114118468
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-05-23
- Filing Date
- 2025-05-16
- Publication Date
- 2026-07-01
Abstract
A laminate having a first bonding layer, a metal layer and a second bonding layer in sequence, wherein the metal layer has a recess on a first surface on the side of the first bonding layer and on a second surface on the side of the second bonding layer that communicates with the outer periphery of the metal layer.
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