Photosensitive resin laminate, photosensitive element and pattern forming method

Abstract

This invention provides a photosensitive resin laminate, a photosensitive element, a method for forming a photoresist pattern, and a method for manufacturing a conductor pattern, all of which achieve both high adhesion and high resolution. The photosensitive resin laminate comprises a temporary support and a photosensitive resin layer on the temporary support. The average thickness of the photosensitive resin layer is 20 μm or less. The photosensitive resin layer contains a photosensitive resin composition comprising (A) an adhesive polymer, (B) a photopolymerizable compound with vinyl unsaturated bonds, (C) a photopolymerization initiator, and (D) a polymerization inhibitor. The content of the photopolymerization initiator (C) is 5.0 parts by mass or more, relative to 100 parts by mass of the total amount of (A) the adhesive polymer and (B) the photopolymerizable compound. The polymerization inhibitor (D) comprises a polymerization inhibitor with two or more phenolic hydroxyl groups, and its content is 0.025 parts by mass or more, relative to 100 parts by mass of the total amount of (A) the adhesive polymer and (B) the photopolymerizable compound.