Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, semiconductor device and polyimide

Abstract

The present invention provides a resin composition, a cured product formed by curing the above composition and a method for manufacturing the same, a laminate containing the cured product and a method for manufacturing the same, a semiconductor device and a method for manufacturing the same, and a novel polyimide, wherein the aforementioned resin composition comprises a resin having a structure represented by the following formula (A-1).