Photosensitive resin composition, light-shielding film, and display device

TW202626765APending Publication Date: 2026-07-01NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information

Application Number
TW114137304
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-19
Filing Date
2025-09-26
Publication Date
2026-07-01
Patent Text Reader

Abstract

An objective of the present invention is to provide a photosensitive resin composition and a light-shielding film that can simultaneously achieve high light-shielding properties and a reduction in the reflectivity on both the glass substrate side and the film surface side, while being environmentally friendly by using a very small amount of fluorine, thereby meeting regulations such as those for PFAS. A photosensitive resin composition of the present invention is characterized by containing components (A) to (F) and satisfying the following conditions (i) and (ii) simultaneously. (i) When a cured film of the composition is formed on a glass substrate with an average thickness in the range of 0.5 to 4.0 µm and the film's surface is measured by XPS, the ratio of the peak area of SiO2 to the peak area ASiO (ASiO2 / ASiO) in the peak fitting analysis of the Si2p3 / 2 peak is from 0.10 to 10.0. (ii) The amount of fluorine (F) element relative to the total amount of Si, C, O, and F elements present on the film surface [F / (Si+C+O+F)] is 5.0% or less.
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