Photosensitive resin composition, cured material, method for manufacturing cured material, semiconductor device and display device

Abstract

The objective of this invention is to provide a photosensitive resin composition that yields a hardened material with good solvent solubility, high sensitivity, retention of pattern shape during heat treatment, and high elongation at break. The solution is a photosensitive resin composition comprising: a polyimide resin (A1) containing diamine residues having a specific structure, a phenolic resin (A2), a photosensitizer (B), and a solvent (C).