Curable resin and manufacturing method thereof, curable resin composition and cured product thereof

Abstract

The present invention provides a curable resin with excellent low dielectric properties, a manufacturing method thereof, a curable resin composition, and a cured product thereof. A curable resin according to the present invention is represented by the following formula (1): . In formula (1), each R1 independently represents a saturated hydrocarbon group having 1 to 5 carbon atoms. Each X independently represents a structure of the following formula (a0). m is an integer from 0 to 4. n is an integer from 0 to 3, and the average value of n, nave, is 0.01≦nave≦3. In formula (a0), * represents the bonding position to the five-membered ring of the indene structure in formula (1). Each R2 independently represents a saturated hydrocarbon group having 1 to 5 carbon atoms. q is an integer from 0 to 3. When q is o, p is an integer from 0 to 5; when q is 1, p is an integer from 0 to 7; when q is 2, p is an integer from 0 to 9; and when q is 3, p is an integer from 0 to 11. J is an integer of 0 or 1.