Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, semiconductor device and polyimide

Abstract

The present invention provides a resin composition, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, and a semiconductor device containing the cured product, as well as a polyimide containing repeating units represented by the following formula (A-2) and repeating units represented by the following formula (A-3), wherein the resin composition contains polyimide, and the polyimide has a structure derived from a diamine containing at least one group selected from the group consisting of hydroxyl, alkoxy, carboxyl and ester groups.