Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, and semiconductor device.

Abstract

The present invention provides a resin composition, a cured product formed by curing the resin composition, a laminate containing the cured product, a method for manufacturing the cured product, a method for manufacturing the laminate, a method for manufacturing a semiconductor device including the method for manufacturing the cured product, and a semiconductor device containing the cured product. The resin composition comprises resin A and photosensitizer B, wherein resin A comprises a acetate structure and an amino acid structure, and further comprises at least one structure selected from the group consisting of structures represented by formula (AY1) and structures represented by formula (DY1). The molar amount of the acetate structure in resin A is 90.00 to 99.90% relative to the total molar amount of the amino acid structure and the acetate structure, and the amine value of resin A is 0.0010 to 0.3000 mmol / g.