Prepreg, foil-coated laminate, printed wiring board, and semiconductor device

Abstract

This invention provides a prepreg, a metal foil laminate, a printed wiring board, and a semiconductor device. The prepreg of this invention comprises: a resin composition and / or a semi-cured form of the resin composition, and a glass cloth; the resin composition contains a thermosetting compound, and the glass cloth has a dielectric constant of 4.4 or less at a frequency of 10 GHz, as measured by the cavity resonator perturbation method according to JIS C218:2007, and the proportion of SiO2 in the glass cloth is 61-85% by mass.