Low thermal impedance phase change thermal interface materials

TW202627031APending Publication Date: 2026-07-01HONEYWELL INTERNATIONAL INC
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Patent Information

Application Number
TW114127668
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-15
Filing Date
2025-07-22
Publication Date
2026-07-01
Patent Text Reader

Abstract

A phase change thermal interface material including a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material. The thermally conductive filler includes from about 50 wt. % to about 70 wt. % aluminum powder; from about 19 wt. % to about 30 wt. % aluminum oxide; and from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material. The phase change thermal interface material has a thermal impedance from about 0.02 °Ccm2 / W to about 0.04 °Ccm2 / W, as determined by ASTM D5470.
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