Vacuum processing device and platen chamber

Abstract

The platen chamber of the present invention comprises: a platen mechanism, a bottom portion, a rear wall portion, a transverse side wall portion, a front flange portion, and a curved top portion. The aforementioned platen mechanism rotates the substrate under reduced pressure between a transverse position capable of being moved in and out, and a longitudinal position close to the vacuum processing section and upright for vacuum processing. The aforementioned rear wall portion is erected upwards from the rear end of the aforementioned bottom portion, forming a slot for moving the aforementioned substrate in and out. The aforementioned transverse side wall portion is erected upwards from the left and right ends of the aforementioned bottom portion, with its rear end connected to the aforementioned rear wall portion. The aforementioned front flange portion is erected upwards from the front end of the aforementioned bottom portion, connected to the front end of the aforementioned transverse side wall portion, surrounding the processing opening portion that opens into the aforementioned vacuum processing section. The aforementioned curved top portion is respectively connected to the upper ends of the aforementioned front flange portion, the aforementioned rear wall portion, and the aforementioned transverse side wall portion. The aforementioned transverse side wall portion is outwardly convex and curved from the aforementioned curved top portion to the aforementioned bottom portion.