Manufacturing methods for components, modified substrates, multilayers, and electronic devices

Abstract

This invention provides a composition capable of forming a film that suppresses defect formation and sufficiently suppresses film formation due to atomic layer deposition. Furthermore, this invention provides a method for manufacturing a modified substrate, a method for manufacturing a laminate, and a method for manufacturing an electronic device. The composition of this invention, used to form a film that suppresses film formation due to atomic layer deposition, comprises a compound C1 and an aqueous solvent, wherein the compound C1 has a functional group A bonded to or adsorbed onto a substrate, and at least one of a polyoxyalkylene structure and a betaine structure, i.e., a specific structure B1, and the water content is 10% by mass or more relative to the total mass of the aqueous solvent.