Metal ion supply system and metal ion supply method for electroplating equipment

Abstract

This invention provides a metal ion supply system that can suppress dilution of the plating solution in a plating solution circulation chamber. It is used in an electroplating apparatus and includes: an anode chamber, an anode disposed within the anode chamber, a cathode chamber, a cathode disposed within the cathode chamber, a plating solution circulation chamber disposed between the anode and cathode chambers, a first diaphragm disposed between the anode and plating solution circulation chambers, and a second diaphragm disposed between the cathode and plating solution circulation chambers. The plating solution circulation chamber has an outlet for discharging the plating solution into the electroplating apparatus and an inlet for receiving the plating solution from the electroplating apparatus to allow circulation of the plating solution. The diffusion rate of water in the second diaphragm is greater than that in the first diaphragm. The anode chamber is filled with an anolyte containing ions of the same metal as the metal contained in the anode. The cathode chamber is filled with a catholyte, the osmotic pressure molar concentration of which is higher than that of the plating solution in the plating solution circulation chamber.