Wafer-like sensor configured for sensor measurements in high-temperature environments implementing sensor circuits and / or sensor processing and a process of implementing the same
TW202627428APending Publication Date: 2026-07-01NORDSON TEST & INSPECTION AMERICAS INC
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Patent Information
- Application Number
- TW114145598
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-22
- Filing Date
- 2025-11-21
- Publication Date
- 2026-07-01
Abstract
A wafer-like sensor includes a support substrate, at least one temperature sensor arranged on the support substrate, an electrical interface arranged on the support substrate, and at least one sensor interconnect arranged on the support substrate. The wafer-like sensor further includes at least one of the following: a sensor loop arrangement, at least one resistor configured to compensate for drift, a plurality of electrical connections configured to connect to a separate component, a sensor conductor fanout configuration, a diagnostic configuration, an internal calibration configuration, and / or a component to calculate a temperature profile.
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