Wafer-like sensor configured for sensor measurements in high-temperature environments implementing sensor circuits and / or sensor processing and a process of implementing the same

TW202627428APending Publication Date: 2026-07-01NORDSON TEST & INSPECTION AMERICAS INC
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Patent Information

Application Number
TW114145598
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-22
Filing Date
2025-11-21
Publication Date
2026-07-01
Patent Text Reader

Abstract

A wafer-like sensor includes a support substrate, at least one temperature sensor arranged on the support substrate, an electrical interface arranged on the support substrate, and at least one sensor interconnect arranged on the support substrate. The wafer-like sensor further includes at least one of the following: a sensor loop arrangement, at least one resistor configured to compensate for drift, a plurality of electrical connections configured to connect to a separate component, a sensor conductor fanout configuration, a diagnostic configuration, an internal calibration configuration, and / or a component to calculate a temperature profile.
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