Analysis apparatus, system, method and procedure
TW202627463APending Publication Date: 2026-07-01RIGAKU CORP
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Patent Information
- Application Number
- TW114133877
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-26
- Filing Date
- 2025-09-04
- Publication Date
- 2026-07-01
Abstract
The present invention aims to provide an apparatus, system, method, and program for analyzing the slope of a sample surface. The analysis apparatus of the present invention comprises: a two-dimensional profile acquisition unit that acquires a two-dimensional profile of laser light reflected or diffracted from the sample surface; a spectral profile generation unit that, for a first straight line with a plurality of peaks arranged in a linear pattern and a second straight line orthogonal to the first straight line and also with a plurality of peaks arranged in a linear pattern, generates a first spectral profile by integrating a designated region containing at least a portion of each of the first and second straight lines in a direction perpendicular to the first straight line, and a second spectral profile by integrating in a direction perpendicular to the second straight line; a reflection position determination unit that determines the reflection position of the two-dimensional profile based on the first and second spectral profiles; and a slope calculation unit that calculates the slope of the sample surface based on the reflection position.
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