Chip socket assembly for semiconductor chip testing and semiconductor chip testing apparatus including the same

Abstract

Disclosed are a chip socket assembly for semiconductor chip testing and a semiconductor chip testing apparatus including the same. The chip socket assembly includes a chip guide member having a chip guide hole through which a chip having a plurality of bumps and a plurality of pads formed on one surface thereof is inserted and guided, a bump guide member having at least one bump guide hole configured to guide the positions of at least some of the bumps and at least one pad exposure hole configured to expose at least some of the pads, an intermediate fastening member having an opening configured to expose at least a part of the one surface of the chip on which the bumps and the pads are formed, and a chip socket substrate provided on one surface thereof with a plurality of probes configured to contact at least some of the pads.