Chip structure and semiconductor package including the same

Abstract

Provided is a chip structure including a redistribution structure, an electronic integrated circuit chip on an upper surface of the redistribution structure, and a photonic integrated circuit chip including a first substrate on an upper surface of the electronic integrated circuit chip and comprising an active surface and an inactive surface opposite to the active surface, a first reflector on the inactive surface of the first substrate, and a first wiring structure on the active surface of the first substrate, the first wiring structure comprising a waveguide, a grating coupler, and a second reflector, wherein a patterned surface of the grating coupler faces the redistribution structure.