Solder inspection device

TW202627998APending Publication Date: 2026-07-01CKD CORP
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Patent Information

Application Number
TW114131129
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-15
Filing Date
2025-08-15
Publication Date
2026-07-01
Patent Text Reader

Abstract

[Problem] To provide a solder inspection device capable of performing inspections with high precision considering the direction of the scraper's movement. [Solution] An AI model 101, generated by learning from image data of good solder paste using only image data of a predetermined neural network, is input into inspection image data to obtain reconstructed image data. The goodness or badness of the solder paste is determined by comparing the inspection image data and the reconstructed image data. The AI ​​model 101 is generated by learning from image data of solder paste with a common scraper movement direction. The inspection unit 79 inputs the inspection image data into the AI ​​model 101. The scraper movement direction in the learned data of the AI ​​model 101 becomes a common direction to the scraper movement direction related to the solder paste in the inspection image data and the object being inspected.
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