Solder inspection device
TW202627998APending Publication Date: 2026-07-01CKD CORP
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Patent Information
- Application Number
- TW114131129
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-15
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-01
Abstract
[Problem] To provide a solder inspection device capable of performing inspections with high precision considering the direction of the scraper's movement. [Solution] An AI model 101, generated by learning from image data of good solder paste using only image data of a predetermined neural network, is input into inspection image data to obtain reconstructed image data. The goodness or badness of the solder paste is determined by comparing the inspection image data and the reconstructed image data. The AI model 101 is generated by learning from image data of solder paste with a common scraper movement direction. The inspection unit 79 inputs the inspection image data into the AI model 101. The scraper movement direction in the learned data of the AI model 101 becomes a common direction to the scraper movement direction related to the solder paste in the inspection image data and the object being inspected.
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