Application methods for chip inductors, printed circuit boards, modules, and conductive adhesive layers

TW202628145APending Publication Date: 2026-07-01TOYO INK MFG CO LTD +1

0 Cites 0 Cited by

Patent Information

Application Number: TW114135752
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-04-17
Filing Date: 2025-09-17
Publication Date: 2026-07-01

Application Information

Patent Timeline

17 Apr 2025

Priority

17 Sep 2025

Application

TW114135752

01 Jul 2026

Publication

TW202628145A

IPC: H01F27/28; H01F17/04; H05K1/16

Inventors: 森祥太

Get more patent work done with AI

Run novelty searches—or use them for FTO, design risk, drafting and technical problem-solving.

Explore More Agents

Novelty Search
Search existing technologies and assess novelty
↗
FTO
Analyze whether a product may infringe others' patents
↗
Design FTO
Check prior-design risk for exterior design
↗
Drafting
Draft patent application text based on a technical solution
↗
Find Solutions with TRIZ
Generate feasible solution to solve your technical challenge
↗
IP MCP Servers
Connect trusted patent search and cited evidence to Claude, Cursor or your own AI workflow
↗

Patent Text Reader

Abstract

The release film (13) of the chip inductor article (1A) is peeled off to make it a chip inductor (10A). The chip inductor (10A) includes at least a conductive adhesive layer (11). The conductive adhesive layer (11) functions as an inductor by connecting the spaced-apart first conductive pattern and the second conductive pattern formed on the printed wiring board without connecting to the grounding conductive pattern formed on the printed wiring board.

Need to check novelty before this filing date? Find Prior Art