Multilayer substrate

Abstract

A multilayer substrate is provided that can reduce the occurrence of poor mounting of electronic components. The multilayer substrate (100) of the present invention includes first, second, third and fourth conductor layers stacked with an insulating layer between them. Multiple pads (130R, 130G, 130B, 130C) for soldering R electrode, G electrode, B electrode and C (common) electrode of a micro LED (80) are formed on the uppermost first conductor layer. The pads (130R, 130G, 130B, 130C) have the same planar shape. The pads (130G, 130G, 130B, 130C) are electrically connected to wiring patterns formed on the second to fourth conductor layers via conductive vias (140).