Semiconductor device and method of manufacturing semiconductor device
TW202628582APending Publication Date: 2026-07-01SK HYNIX INC
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Patent Information
- Application Number
- TW114130306
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-24
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-01
Abstract
A semiconductor device includes a gate structure including a source select line, a drain select line, and word lines stacked between the source select line and the drain select line; a second channel layer penetrating through the source select line and including polysilicon; a third channel layer penetrating through the drain select line and including polysilicon; a first channel layer penetrating through the word lines, connected between the second channel layer and the third channel layer, and including molybdenum disulfide (MoS2); and an insulating core disposed inside the first channel layer.
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