Catalyst influenced pattern transfer technology

TW202628588AActive Publication Date: 2026-07-01BOARD OF RGT THE UNIV OF TEXAS SYST
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Patent Information

Application Number
TW115107381
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2018-09-10
Filing Date
2018-11-23
Publication Date
2026-07-01
Estimated Expiration
2038-11-22
Patent Text Reader

Abstract

Various embodiments of the present technology generally relate to semiconductor device architectures and manufacturing techniques. More specifically, some embodiments of the present technology relate to silicon etching using catalyst influenced chemical etching technology with application to three-dimensional memory architectures and transistors. CICE is a catalyst based etching method that can be used on semiconductors as well as multilayers of the semiconductors. Various embodiments of the CICE process can use a catalyst to etch semiconducting substrates and to fabricate high aspect ratio features. A fabrication tool for this purpose is also disclosed. This shall enable adoption of this technology in making semiconductor devices.
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