Semiconductor device manufacturing method
TW202628628APending Publication Date: 2026-07-01CANON KK
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114131716
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-23
- Filing Date
- 2025-08-20
- Publication Date
- 2026-07-01
Abstract
A method for manufacturing a semiconductor device includes: a process for preparing a structure having a gate electrode film; a process for forming a planarization film on the structure; a process for forming a pattern on the planarization film using a photolithography process; and a process for patterning the gate electrode film using the pattern. In the process of forming the planarization film, a plurality of droplets of a curable composition are disposed on the structure, the plurality of droplets are combined to form a liquid film, and the liquid film is cured to obtain the planarization film.
Need to check novelty before this filing date? Find Prior Art