Semiconductor structure and method for forming the same
TW202628653APending Publication Date: 2026-07-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- TW114119341
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-20
- Filing Date
- 2025-05-22
- Publication Date
- 2026-07-01
Abstract
A method includes: providing a plurality of fins that extend vertically above a substrate and a contiguous gate structure that extends over the plurality of fins; forming an opening in the contiguous gate structure with a metal gate cut between a pair of fins, wherein forming the opening includes etching a partial opening to a current depth and performing an etching cycle including: depositing a protective layer on sidewalls of the partial opening; and extending, via etching, the partial opening a predetermined incremental depth below the current depth; and repeating the etching cycle for at least 10 cycles to achieve a desired gate cut length.
Need to check novelty before this filing date? Find Prior Art