Method for bonding semiconductor substrates

Abstract

The present disclosure relates to methods and apparatus for joining a first semiconductor substrate and a second semiconductor substrate. The method may comprise: first pushing the first semiconductor substrate towards an auxiliary member to bring the first semiconductor substrate into contact with the auxiliary member; and then second pushing the second semiconductor substrate towards the first semiconductor substrate and the auxiliary member to cause joining of the first semiconductor substrate and the second semiconductor substrate, wherein the first pushing is substantially the same as the second pushing. Additionally or alternatively, the method may comprise: clamping an auxiliary member to a clamp, wherein the first semiconductor substrate is secured to the auxiliary member; and pushing the auxiliary member away from the clamp and towards the second semiconductor substrate to bring the first semiconductor substrate into contact with the second semiconductor substrate.