Apparatus and method for processing of substrate

Abstract

This invention provides a substrate processing apparatus, which may include: a process chamber forming a processing space and a controller for controlling the process chamber. The controller forms a warpage compensation layer on one side of a substrate mounted on a base within the process chamber, wherein a main layer and a buffer layer are alternately stacked at least once, and can control the density of the buffer layer to be lower than the density of the main layer.